*Official Retail G0 Q6600 Overclocking Thread*

[Hans Gruber]

I had the foresight to check my CPU and heatsink with a razor before installing. Both parts weren't flat, so I'll probably do some sanding work eventually. The funny thing is, I threw this box together quickly, and just used Thermalright's paste (yes I have some AS-5) without even properly cleaning the CPU, and it runs at 3600 mhz @ 1.38v at 43c idle. Not a shabby CPU! I imagine once I lapp the parts I may see another 5c drop.

- Sker

I'm skeptical about lapping CPU's or heatsinks. If done right, it might lower your temps, but I don't think the difference is really all that apparent. Some lapped CPU's look very cool with intense reflections.

I think it's your motherboard and the Thermalright Extreme heatsink that are giving you very good overclocks. That MSI board is the same as the platinum with lower quality heatpipes. Everyone is on the Gigabyte/ASUS bandwagon, but MSI has been making some outstanding motherboard over the years. The P35 NEO-2 is one of those great boards.

[sesdave]

I'm skeptical about lapping CPU's or heatsinks. If done right, it might lower your temps, but I don't think the difference is really all that apparent. Some lapped CPU's look very cool with intense reflections.

I think it's your motherboard and the Thermalright Extreme heatsink that are giving you very good overclocks. That MSI board is the same as the platinum with lower quality heatpipes. Everyone is on the Gigabyte/ASUS bandwagon, but MSI has been making some outstanding motherboard over the years. The P35 NEO-2 is one of those great boards.

If the IHS is concave and the HS uneven lapping will provide better contact and reduce temperatures - check the 10c drop in the link posted previously. Achieving even flat surface on the CPU and HS is the objective - if already flat dont waste your time lapping. Mirroring adds nothing as paste will still be applied to complete the thermal transfer connection.
MB and HSF are part of the overclock but CPU heat output is a main contributor to restricting the overclock. He has a good CPU(lucky swine -lol) but he hasn't maxed his overclock out. So when raising FSb and other parameters he will be limited by the amount of vcore that can be applied for stability before the resulting temperature rise causes instability or fries the CPU. Water and air cooling have a limit to what they can hold the load temps at no matter how good they are - so any reduction in the heat output under load is good to achieve the maximum overclock. That is why people use phase for extreme overclocking.

[Skerlnik]

If the IHS is concave and the HS uneven lapping will provide better contact and reduce temperatures - check the 10c drop in the link posted previously. Achieving even flat surface on the CPU and HS is the objective - if already flat dont waste your time lapping. Mirroring adds nothing as paste will still be applied to complete the thermal transfer connection.
MB and HSF are part of the overclock but CPU heat output is a main contributor to restricting the overclock. He has a good CPU(lucky swine -lol) but he hasn't maxed his overclock out. So when raising FSb and other parameters he will be limited by the amount of vcore that can be applied for stability before the resulting temperature rise causes instability or fries the CPU. Water and air cooling have a limit to what they can hold the load temps at no matter how good they are - so any reduction in the heat output under load is good to achieve the maximum overclock. That is why people use phase for extreme overclocking.

Hans, I'll admit I was a little skeptical before my first lapping. I had an E6600 that ran somewhat warm, so I decided to lap the heatsink and CPU, and it ended up running 7c cooler! That's not too shabby! Also, my MSI *is* the Platinum edition with the crazy heat pipes which kind of make mounting a fan to a Thermalright U-120 somewhat tricky! I've owned Asus, Giga, A-open, Abit, and Intel MB's, yet this MSI definitely has impressed me.

Sesdave, you make some good points! Once I lapp everything I'll ramp up this CPU to see what it can really do! *oink*


- Sker

[Hans Gruber]

Hans, I'll admit I was a little skeptical before my first lapping. I had an E6600 that ran somewhat warm, so I decided to lap the heatsink and CPU, and it ended up running 7c cooler! That's not too shabby! Also, my MSI *is* the Platinum edition with the crazy heat pipes which kind of make mounting a fan to a Thermalright U-120 somewhat tricky! I've owned Asus, Giga, A-open, Abit, and Intel MB's, yet this MSI definitely has impressed me.

Sesdave, you make some good points! Once I lapp everything I'll ramp up this CPU to see what it can really do! *oink*


- Sker

Glad to hear that your lapping was successful. Obviously you knew what you were doing. Some people have posted little or no gain in lower temps. I assume skill (lapping) has more to do with it than anything.

I have the Thermalright Ultra 120 as well on my C2D setup. It was very difficult setting up the Thermalright 120. So difficult that I actually prefer the Tuniq Tower 120 for simplicity and the fact it comes with its own fan. The Tuniq fan is ceratainly a lot louder than the Thermalright.

[Talonman]

Glad to hear that your lapping was successful. Obviously you knew what you were doing. Some people have posted little or no gain in lower temps. I assume skill (lapping) has more to do with it than anything.

Sometimes I wonder if after sanding a water block, and CPU for hours, it kind of makes you apply the paste a little 'better' too?

Or even that the surfaces were super clean so everything bonded better...

Not sure, but I skipped lapping.