Results 1 to 25 of 216

Thread: Lapping Q6600

Hybrid View

  1. #1
    Xtreme Member
    Join Date
    Jul 2004
    Posts
    391
    Well, it's not exactly scientific testing methodology, but I just used some MX2 and found its thinness to be very beneficial to getting that super thin layer you want. It's cooling better than the last few applications of AS5, and I applied the pastes the same way each time (AS's line-of-paste across cores method) and always use Articlean. The MX2 squished out into a translucent layer whereas the AS5 was more an opague layer that didn't spread as well.

    With AS5 I was seeing 70-72C on one of the dies. This was about the same as before I lapped, btw. With the MX2 it's holding at 66-67C. That die sure does run hotter than the other. Lapping didn't really help with that difference. I kinda suspect that one die has higher leakage power than the other... Could be more solder on one too, I guess. Who really knows....

    I'll probably use MX2 from now on after getting this improvement and really liking its ease of application. It's cheaper too I believe.

    AS5 may possibly work better if you spread it thinly yourself. But I've used up so much paste and pulled my heatsink on and off so many times in the past week that I'm a bit burned out. lol
    Last edited by swaaye; 09-27-2007 at 10:51 AM.

  2. #2
    Xtreme Enthusiast
    Join Date
    Aug 2007
    Location
    South Wales
    Posts
    651
    have to ask, are you seeing that your paste has mushed out by lifting the heatsink after applying it?

    the as5 squished out nicely for me - noticed after remounting the heatsink when i changed case layout.

    your temps seem very high if you have lapped. im getting 25 celcius on idle @3.2ghz 1.4v ..... 44ish CPU load or 51 if in a game - extra heat contribution thanks to a large GPU heatsink next to the processor!!

    "Never under estimate the predictability of stupidity"


    =======
    Q6600 @ 3.6 / TRUE (both lapped)
    P5Q Deluxe
    4Gb Corsair DominatRIX 1066Mhz
    1Gb HD 4870 + HR03-GT
    2 x 320gb WD3200AAKS RAID-0
    Thermaltake Toughpower 850
    X-Fi Fatality / SR-71 Amp > Sennheiser HD650's & Logitech Z-5500
    HP W2207 TFT

    and me??? Powered by absolut, kebabs, tramadol & a new liver

  3. #3
    Xtreme Member
    Join Date
    Nov 2006
    Location
    Ohio
    Posts
    262
    Quote Originally Posted by it_burns_when_i_pee View Post
    have to ask, are you seeing that your paste has mushed out by lifting the heatsink after applying it?

    the as5 squished out nicely for me - noticed after remounting the heatsink when i changed case layout.

    your temps seem very high if you have lapped. im getting 25 celcius on idle @3.2ghz 1.4v ..... 44ish CPU load or 51 if in a game - extra heat contribution thanks to a large GPU heatsink next to the processor!!
    Hmm...I can get 3.2 @ 1.300v I'm @ 3.6 right now w/ 1.45v. After I lapped, I got these temperatures. This is @ 3.2ghz 1.300v:

    Idle Unlapped - Idle for lapped and unlapped was unchanged

    Load Unlapped

    Load Lapped


    Oh and just for and giggles I tried 3.8 but it wasn't stable.http://valid.x86-secret.com/show_oc.php?id=248132
    Last edited by Alik4041; 09-28-2007 at 10:28 AM.

  4. #4
    Xtreme Enthusiast
    Join Date
    Aug 2007
    Location
    South Wales
    Posts
    651
    i havent tried my cpu at anything lower than 1.4 yet

    i tried 400x9 and it loaded windows but wasnt stable

    someone said i might want to drop FSB voltage to try x9 multiplier. on the weekend im going to try dropping the cpu voltage and see if its stable at 8x multiplier.

    still new to the overclocking of C2D, am i right in thinking if i go 9x 400 i might wanna try upping CPU voltage?

    "Never under estimate the predictability of stupidity"


    =======
    Q6600 @ 3.6 / TRUE (both lapped)
    P5Q Deluxe
    4Gb Corsair DominatRIX 1066Mhz
    1Gb HD 4870 + HR03-GT
    2 x 320gb WD3200AAKS RAID-0
    Thermaltake Toughpower 850
    X-Fi Fatality / SR-71 Amp > Sennheiser HD650's & Logitech Z-5500
    HP W2207 TFT

    and me??? Powered by absolut, kebabs, tramadol & a new liver

  5. #5
    Xtreme Member
    Join Date
    Jul 2004
    Posts
    391
    Quote Originally Posted by it_burns_when_i_pee View Post
    have to ask, are you seeing that your paste has mushed out by lifting the heatsink after applying it?

    the as5 squished out nicely for me - noticed after remounting the heatsink when i changed case layout.

    your temps seem very high if you have lapped. im getting 25 celcius on idle @3.2ghz 1.4v ..... 44ish CPU load or 51 if in a game - extra heat contribution thanks to a large GPU heatsink next to the processor!!
    Yeah I've checked a few times. The AS5 spread out, but not nearly as well as the MX2 does. Currently application is the best temps I've seen yet out of this setup.

    When I Prime 3.5 GHz at about 1.36v (measured by Everest) 1.45v BIOS I see almost 80 C on one of the cores. There can be about a 10C difference between cores. This hasn't changed with lapping or different paste. Primeing at 3.2 GHz 1.23v (Everest) 1.325v BIOS or so, one will sit at around 69C while the other is at 63C. This is with Prime95 25.x running small FFT (really bakes like nothing else lol). When idle at 3.2 GHz / 1.23v, I see 26C or so on that strange non-core temp reading while the cores themselves are at 33-35C or so.

    I'm recalling these readings from memory cuz I'm at work . They should be close tho.

    This board has some crazy Vdroop combined with maybe poor voltage readings (no way lol). When I set 1.325v in BIOS, I get 1.23-1.24 at load in Windows. To get up to a 1.4v reading, I have to run about 1.5v in the BIOS.
    Last edited by swaaye; 09-28-2007 at 01:00 PM.

Bookmarks

Bookmarks

Posting Permissions

  • You may not post new threads
  • You may not post replies
  • You may not post attachments
  • You may not edit your posts
  •