Well, it's not exactly scientific testing methodology, but I just used some MX2 and found its thinness to be very beneficial to getting that super thin layer you want. It's cooling better than the last few applications of AS5, and I applied the pastes the same way each time (AS's line-of-paste across cores method) and always use Articlean. The MX2 squished out into a translucent layer whereas the AS5 was more an opague layer that didn't spread as well.
With AS5 I was seeing 70-72C on one of the dies. This was about the same as before I lapped, btw. With the MX2 it's holding at 66-67C. That die sure does run hotter than the other. Lapping didn't really help with that difference. I kinda suspect that one die has higher leakage power than the other... Could be more solder on one too, I guess. Who really knows....
I'll probably use MX2 from now on after getting this improvement and really liking its ease of application. It's cheaper too I believe.
AS5 may possibly work better if you spread it thinly yourself. But I've used up so much paste and pulled my heatsink on and off so many times in the past week that I'm a bit burned out. lol
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