Do you think this could overtake the Storm as the single die performance leader? The cooling area looks pretty small to me, so I don't think it'll work too well on todays quad cores.
Do you think this could overtake the Storm as the single die performance leader? The cooling area looks pretty small to me, so I don't think it'll work too well on todays quad cores.
Nothing can really beat the Storm design when it comes to small, single die. It's extremely efficient and complex, and although micro channels as seen in the NeXXoS XP, MP05 Pro/LE, and now this block, come extremely close to the storm in testing, they aren't quite good enough to beat it, and they are usually even more restrictive.Originally Posted by Shlomo
However, for large/multiple dies, we know the Storm does not really compete well against other blocks with larger cooling patches. But what about a Storm with double or even triple it's current cooling base ( a la G7-G9?)? Or, how bout a micro channel block with a larger cooling patch than any of the previous micro channel blocks we've seen before, such as this offering from thermalright? I think it shows promise.
Formerly XIP, now just P.
Before you can do that you need to smack Foxconn upside the head and tell them to get better machining tools for the IHS. And then get Intel/AMD to figure something out to get the thermal resistance between the IHS and die down.
And then have AMD/Intel reduce the IHS thickness.
Here is a good process for AMD/Intel to ensure a good mount.
1. Produce IHS with tighter tollerances (also make it thinner with thicker nickel plating)
2. Lap the IHS before nickel plating
2. Nickel plate (extra thick)
4. Re-lap the IHS (after mounting to processor)
5. dont laser engrave the IHS. (make the IHS with smaller dimmensions and put the laser etch on the edges of the substrate)
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