http://www.amd.com/us-en/assets/cont...docs/30430.pdf - pg.29......Originally Posted by uOpt
Thermal Design Power (TDP) is measured under the conditions of TCASE Max, IDD Max, and VDD=VID_VDD, and include all power dissipated on-die from VDD, VDDIO, VLDT, VTT, and VDDA.![]()



then it's going into heat.
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