The Freezone CPU Cooler is the only liquid chilling solution that provides unsurpassed performance and uncompromising reliability. It is quiet, compact, easy to install, and affordable. CoolIT products do not use a radiator, but rather a patented technology called MTEC. By using MTEC technology, the liquid is actually refrigerated (using multiple TECSs or Peltiers) then used to cool even the hottest processors in today’s computing devices. The result is unparalleled overclockability, reduced system level noise and increased reliability. In addition to providing superior performance to water cooling, the CoolIT products are pre-plumbed, factory sealed and maintenance free allowing for very simple installation and worry-free. The FreezeZone is universally compatible with all current processors.
Why should you choose the Freezone CPU Cooler? Unlike water-cooling products, the Freezone does not use a radiator. Instead, it uses a proprietary ‘Chiller’ which incorporates multiple TECs (also called peltiers) to chill the liquid coolant. This increases thermal capacity and provides for faster heat absorption at the source.
Features
* Liquid cooling is simply much better than air when it comes to dissipating heat. So say goodbye to your old air-cooling fan.
* Great for Overclocking
* Easy to install and maintain.
* Provides quiet operation.
* Maintenance Free Operation
* Universal Compatibility
* Fits in a standard mid-tower case.
CoolIT is Supercool
The CoolIT system consistently reduces the temperature of vital components, such as the CPU, well below specified operating temperatures. This results in improved computer performance and reliable operation under any conditions.
Processor temperature is certain to remain low even when processor capacity has been maxed out and/or external ambient temperature is excessive. Moreover, testing has proven that processors will run very stable when voltage is increased beyond specification due to the significant headroom in temperature differential, which can be obtained with this cooling solution.
With the CoolIT system employed, high-end components function reliably in relatively smaller cases, including desktop and small form factor designs. The alternative is failure or damage from the heat generated within a confined space.
The CoolIT system efficiently dissipates heat away from vital components and exhausts the heat outside the case. This helps preserve other system components, such as the hard drive.
Specifications
CPU FHE (Fluid Heat Exchanger):
Design Monolithic copper, multi-cell, single channel
Dimension 42 x 42 x 17 mm
Weight 195g
TCM (Thermal Control Module):
Design Dual IC SMT PCB w/outboard IC sensor
Input 12VDC, 5VDC
Weight 89 x 53 mm
Function Thermal controller to adjust TEC and fan power output
Chiller and Pump Module:
Heatsink:
Design Dual dissipation plate, anodized alloy, laminar flow array
Dimension 89 x 53 mm
Weight 850g
TECs:
Design Six solid-state heat pump wafers
Dimension 40 x 40 x 3.5 mm (each)
Weight 20g (each)
Function Active coolant thermal reduction
Chiller FHE’s:
Design Dual anodized alloy distribution, multi-channel w/laminar flow
Dimension 121 x 41 x 12 mm (each)
Weight 80g (each)
Fan:
Noise 26dBA – 37dBA
Bearing Type Enhanced life ceramic
Life Cycle 50,000 hrs
Dimension 92 x 92 x 25 mm
Function Heatsink convection, chassis exhaust
Pump and Reservoir:
Design 12VDC coreless outrunner pump w/integrated expansion vessel
Bearings Dual in fluid sapphire bearings
Noise <15dBA
Life Cycle 50,000 hrs
Dimension 50 x 50 x 75 mm
Weight 360g
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