more proof that the grain of rice theory is a load or horse crap.
more proof that the grain of rice theory is a load or horse crap.
please explainOriginally Posted by MaxxxRacer
....
In saying this, are you insinuating that if you put more paste you will get better temperatures? If you are then for me you are not correct. The amount of paste only needs to be enuff to create a thin layer between the IHS/Core and heatsink/block anything more is simply wasted, this is simple thermodynamics, not rocket science. Any results showing otherwise are because of other circumstances, this is my opinion, and its not open for discussion, lolOriginally Posted by MaxxxRacer
Ender17, to be really sure you need to lap both the IHS and Zalman 9500, seeing tht the Zalman 9500 performs fine on your X2, then a lapping of the Opty would be needed, problem here is tht u loose your warrenty. I have found tht the A64 CPU's I have had, are not getting pressure from the heatsink in the correct place i.e. in the center of IHS because of shape of IHS and heatsink. Just imagine wht happens if the the corners of the IHS are higher than the center if IHS, the heatsink will be applying pressure to the corners, creating a 'vaccum' of pressure in the center. I think this is the reason we find many IHS with corners sanded down from the factory.
Ofcourse you may do everything you can to decrease temps, but in reality your chip is a not one, i think it all comes down to how much u want to know, wht the cause is![]()
Last edited by mongoled; 12-23-2005 at 01:38 AM.
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No, he is referring to the contact patch.Originally Posted by mongoled
Well, you'd be wrong too. What you really need is a thin layer that fills any pockets or shows you bumps/uneveness in the heatsink base and/or IHS. If you lap both then you dont even need a TIM when you are using an IHS (and technically when using an IHS it doesnt help anyways if the heatsink base or the IHS are deformed).If you are then for me you are not correct. The amount of paste only needs to be enuff to create a thin layer between the IHS/Core and heatsink/block anything more is simply wasted, this is simple thermodynamics, not rocket science. Any results showing otherwise are because of other circumstances, this is my opinion, and its not open for discussion, lol
Might be he isnt supplying enough air from outside the case. ThermalTake Big Typhoon has problems as well if it isnt getting enough fresh air since air being continually recycled within the case has no chance to cool down... just keeps getting hotter.Ender17, to be really sure you need to lap both the IHS and Zalman 9500, seeing tht the Zalman 9500 performs fine on your X2, then a lapping of the Opty would be needed, problem here is tht u loose your warrenty. I have found tht the A64 CPU's I have had, are not getting pressure from the heatsink in the correct place i.e. in the center of IHS because of shape of IHS and heatsink. Just imagine wht happens if the the corners of the IHS are higher than the center if IHS, the heatsink will be applying pressure to the corners, creating a 'vaccum' of pressure in the center. I think this is the reason we find many IHS with corners sanded down from the factory.
Ofcourse you may do everything you can to decrease temps, but in reality your chip is a not one, i think it all comes down to how much u want to know, wht the cause is![]()
All along the watchtower the watchmen watch the eternal return.
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