Quote Originally Posted by Gogar
would this help?
http://www.jasco-help.com/products/prod_rem.htm

I'd be careful using that close to the core though. IIRC the core is glued to the chip with epoxy as well.
Maybe a bit of that stuff on a q-tip, lightly and take a lot of time.

The public A64 materials docs just say "epoxy." They also say BT Resin:

ADDITIONAL INFORMATION / ADDITIONAL MATERIALS
The following materials are not listed in EIA’s Material Declaration Template, but are contained in this package.
Material Wt% ppm mg
Aluminum < 0.39 < 3,900 < 155
Barium Titanate < 0.27 < 2,700 < 108
BT Resin < 2.6 < 26,000 < 1,036
Epoxy < 0.87 < 8,700 < 347
Iron < 0.087 < 870 < 35
Phosphorus < 0.0019 < 19 < 0.76
Silicon < 0.85 < 8,500 < 339
Silicone elastomer < 0.34 < 3,400 < 136
SiO2 Filler < 0.30 < 3,000 < 120
SiO2 glass mesh < 3.2 < 32,000 < 1,275
Tin < 0.14 < 1,400 < 56
Zinc < 0.0038 < 38 < 1.5
Zinc oxide < 0.14 < 1,400 < 56

Also, on page 375 of the "BIOS and Kernel Developer’s Guide for the AMD Athlon™ 64 and AMD Opteron™ Processors" it says this:

"New FID (NewFID)—Bits 5–0. This field is the new FID to transition to. If an attempt is made to write a NewFID value greater than MaxFID in the FIDVID_STATUS register then the MaxFID value is written instead. See Table 80 for FID code translations."

So we want to hide the maxFID value, or change it. I'm sure I'm not saying anything that hasn't been said.