defect9. . . . .where the hell was this post when I started this topic?
First time I've heard of that site. I poked around some and wow...those folks are a little scary the way they debate the finer points of electronics (like metallized vs foil foil caps). Kind of like the way some of the LC guys debate pump or fan noise.
I'm pretty happy with the way things have turned out though, I just have a major decision to make on if I go ahead with the original plan to prototype using the breadboard and then do the real one or dump that idea and go to one of three plans.
Plan one is to go ahead and finish getting the parts I need to finish the breadboard and use that as is.
Plan two is to build a custom board and use the parts that were to go on the breadboard.
Plan three is to drop all the through hole parts and replace everything possible with a custom SMD board design. I'll still need the power amp chips I got but mounting them on SMD pads isn't going to be a problem and should actually make them sturdier for mounting the water block.
I'll probably have to price out each option to make the decision though.
Got two questions for anybody that can answer it. 1. Is dropping from a 0.12uF aluminum electrolytic cap to .1uF aluminum electrolytic cap going to make a noticeable difference for the one channel? I'm thinking that I likely won't be able to tell the difference. 2. I've been lining up Nichicon KW series for the aluminum electrolytic caps, would these a good choice?









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