Quote Originally Posted by meanmoe View Post
I've never seen anyone show that we've reached a theoretical limit for heat transfer through a radiator. I've seen it said a couple of time, but not shown. Have I missed this?

It seems as though they've applied an industrial solution with what seems to be some science in it. I'm very curious. I'm extremely curious to see if the possible improvement justifies the expected price tag. In my experience, good engineering effort can usually always come up with a better solution. The real problem is usually justifying the cost (including development time). If you take their previous line as a benchmark though, we may see anything spectacular except a price and another effective pre-release campaign.
OK, giving the benefit of the doubt, let's say these rads are copper tubes. It's still the same transfer method within the the loop as if you had an X-changer. Copper base block sucks the heat away from CPU and transfers to water, water then carries to copper tubes in rad where it transfers to the tubes which in turn transfer to air. . .this process hasn't changed...I can't really see where there is room for improvement using the same materials. The only wild card(s) here is the flow rate within the loop because it is now going through a round tube instead of a flattened oval one and how well the rifling can do it's job in creating turbulence within the entire tube...hmm, a thought just occurred to me as I was typing that. The flow may become laminar in a spiral motion if certain conditions are met, what those conditions are I'm not sure (high or low flow rate) just yet but, it does seem theoretically possible.

The Nano plating shouldn't even be considered as having any effect on thermal transfer because it's just that, plating on a nano level from the info I've been able to find.