Quote Originally Posted by Calmatory View Post
No, but that would make some sense. If the pads aren't being shrunk, then anything below the current size would make the chip pad limited. 40 nm parts are 25 % smaller, 800 -> 960 is the closest match which would increase the shaders 25%(1000). However, the shader area of the core isn't too big, so they probably could do +35% increase in shaders(1080 and beyond) whilist keeping the chip under current size.

What will be done? If it is direct increase in shaders, I wouldn't be surprised if they went +1100 for RV790 and +1500 for RV870. If they are pad limited with 256-bit MC w/ GRRD5, they can not reduce the die area too much without being pad limited again, they can only make the chip bigger. The question is, how far are they willing to go with the die size? Obviously big dies do not fit their strategy. Their superior strategy is biting them right now?

For me it seems that both cores are going to be at least as big as RV770 is. RV790 - 5-10 % bigger, RV870 - 20-33 % bigger would be my bet. Now just calculate how many shaders fit to that area and that would be my bet.
How did you come up with 25% smaller? You are going from 55 nm. to 45 nm. and then to 40 nm. and I'd say you would end up about 45% smaller than at 55 nm. at least.
As for die size, they can make a smaller die by ditching Sideport and reducing power draw. The latter would mean that you would need less VDD and GND pins, which will also reduce your minimum necessary die size. So I don't think that a die size of about 200 mm^2 for RV790 would be too far off and entirely possible while still increasing unit count.