Well, it is quite obvious that water-based compounds will dry out in minutes.
Water has relatively bad thermal conductivity, thus the conductivity might possibly even increase after the "burn-in". Though, I don't know what will happen when the stuff starts molding(or is it moltng?). Also as STEvil said, corrosion will be a problem. Not for me though, as I can relap the CPU and HSF when needed, and they won't be used for 24/7 anyway.
I think I will run some GPU testing aswell with my GeForce (OC'd of course.
). 3DMark06 run should take the GPU to the max.
Originally Posted by Calmatory
Well, it is quite obvious that water-based compounds will dry out in minutes. Water has relatively bad thermal conductivity, thus the conductivity might possibly even increase after the "burn-in". Though, I don't know what will happen when the stuff starts molding(or is it moltng?). Also as STEvil said, corrosion will be a problem. Not for me though, as I can relap the CPU and HSF when needed, and they won't be used for 24/7 anyway.ok buddy
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