AS5 vs. toothpaste vs. mustard vs. ketchup vs. Turnip rape oil

[Calmatory]

I did some fast testing today. I have heard myths about someone who had to use toothpaste instead of aftermarket thermal compound, and he claimed toothpaste works better. I wanted to test this and go a bit beyond.

Testing rig in the sig, except that CPU was lapped and running completely @ stock with lapped stock HSF.
Temperatures were measured with the S&M CPU Stresstesting tool, which can be found from here. Testing was made with S&M aswell. Ran L1 cache, L2 cache, CPU Integer and CPU FPU tests, all with 100% CPU load and "short". I took the maximum temperature from the run as measurement. Ambient was around +22C.



All feedback is more than welcome. I am eager to test some more stuff between the CPU and the heatsink. Any ideas?

I have to mention that ketchup/mustard/toothpaste can't be used 24/7, as it already dried out in 10 minutes of running. It was real pain in the ass to clean it up.