Edit: Looks like these chips will be available in Q3 2017 from the presentation.Specs:
- 815mm2 die
- 12nm FinFet
- 21B Transistors
- 15 FP32 TFLOPS
- 7.5 FP64 TFLOPS
- NEW 120 Tensor TFLOPS
- 16GB HBM2 @ 900 GB/s
- 5120 CUDA cores
Link to full article
Edit: Looks like these chips will be available in Q3 2017 from the presentation.Specs:
- 815mm2 die
- 12nm FinFet
- 21B Transistors
- 15 FP32 TFLOPS
- 7.5 FP64 TFLOPS
- NEW 120 Tensor TFLOPS
- 16GB HBM2 @ 900 GB/s
- 5120 CUDA cores
Link to full article
Last edited by EternityZX9; 05-10-2017 at 01:12 PM.
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