3770k IHS Removals - CPU temp dropped from 79C to 71C

[Zeus]

dr_dx, unless you are using a chiller or it's freezing in your room your temperatures are off. I don't mean to take anything away from you and yes, i am jealous at your cpu but 13ºC idle on the lowest core is impossible with normal water or aircooling.

Still some good overclocking on your part and a truely awesome cpu!

[dr_dx]

dr_dx, unless you are using a chiller or it's freezing in your room your temperatures are off. I don't mean to take anything away from you and yes, i am jealous at your cpu but 13ºC idle on the lowest core is impossible with normal water or aircooling.

Still some good overclocking on your part and a truely awesome cpu!

2 year old $100 homemade chiller - 60F~75F

http://www.xtremesystems.org/forums/...memade-chiller

I will update chiller thread with my current setup.

Ambient in my room is 27C.

[Zeus]

Just top-chopped mine. I can't believe how easy it was. Literally 3 minutes and it was off. I used one of those razor blades that are used in hobby knifes to scrape of paint or something.

When i lay the heatspreader on top of the cpu it is "floating" on the die, the edges of the heatspreader are not touching the PCB so no need for lapping the edges of the spreader.

I'm gonna put Liquid Ultra in between and glue the spreader back on.

[dr_dx]

Just top-chopped mine. I can't believe how easy it was. Literally 3 minutes and it was off. I used one of those razor blades that are used in hobby knifes to scrape of paint or something.

When i lay the heatspreader on top of the cpu it is "floating" on the die, the edges of the heatspreader are not touching the PCB so no need for lapping the edges of the spreader.

I'm gonna put Liquid Ultra in between and glue the spreader back on.

Just FYI - Liquid Pro has at least 2x the conductivity of Liquid Ultra - see post #298

[Zeus]

Ok Doctor, thanks for clearing that up.

I already have the Ultra and it was the only Liquid Metal i could find locally. Pretty sure it will still be better than AS5 and co, right?

[dr_dx]

Absolutely!

[Zeus]

Just finished the assembly. Added a small bead of rubbery black adhesive that's rated up to 90ºC onto the edge of the spreader, carefully placed it back on top and removed the excessive glue with a couple of q-tips.

Put the clamp on and now we wait for 24 hours.

[andressergio]

Just finished the assembly. Added a small bead of rubbery black adhesive that's rated up to 90ºC onto the edge of the spreader, carefully placed it back on top and removed the excessive glue with a couple of q-tips.

Put the clamp on and now we wait for 24 hours.

wow what a neat job what glue u used mate ?

[ZoLKoRn]

wow what a neat job what glue u used mate ?

I suggest of three choice for you, all are same compound with intel used

Permatex 81158 Black Silicone Adhesive <<< best one (Recommended )


Shin Etsu KE-45W (they have five color > Transparent, White, black, Gray, red


3M 08011

[mav2000]

Just got my liquid pro...and tomorrow is a holiday for me...

Any last minute tips?

[dr_dx]

Just got my liquid pro...and tomorrow is a holiday for me...

Any last minute tips?

Make sure and "wet" both/all surfaces.

[mav2000]

Make sure and "wet" both/all surfaces.

Thanks did that the second time around and even though the best core didnt move much in temps (as compared to wetting only the die and not the underside of the IHS) the worst core did improve in performance. I think I may have put a bit more than I required, but with 12 degrees in avg temp drop, I guess I am happy with the way it turned out.

[MikeMurphy]

Make sure and "wet" both/all surfaces.

What exactly does this mean? Thanks

[dr_dx]

What exactly does this mean? Thanks

Instead of just applying a small drop to the center of the die or underside of the IHS, you actually want to spread out the drop (very small) on both surfaces to a mirror like finish, then put the 2 together. In my case, I did the same for the top of the IHS (larger surface) and the bottom of my waterblock - hence all 4 surfaces. If you go to Colaboratory's web site, they have video's on how to do it. If you are using Pro, use a very tiny drop; a little goes a long ways.

[Xero99]

OK, first let me say that since the 3770k was released I have been saying that Intel was the biggest douches for allowing such a poor excuse of a processor to be released!
Last week a buddy asked me to build him a new comp with this chip and then asked me to do this mod with the liquid Pro! I asked him was he out of his mind but figured why not.

Well slap me on the ass and call me Susan cause after I finishing his I drove to Micro center and bought myself one. Just finished this mod on MY new chip and its registering...what for it...42c max on Prime95 in asus suite and max core of 64c in Real Temp!!!

Before the mod: 98C Real Temp @ 4.7 GHz @ 1.29v, ambient 31C On Water
After the mod: 64c Real Temp @ 4.7 GHz @ 1.29v, ambient 31c On Water

34 DEGREES DROP!!!

I followed the above post and applied it on all four sides and intentionally left a extremely tint bit more on the center of both the IHS and the die and the top of the IHS and the block!

Thanks to all of you on the ground work on this!!! Now I'm off to push for 5.0 GHz.
And I still haven't changed my mind about Intel recent decisions!

[Zeus]

I found out the glue had cured so i'd put the cpu back in place and tested. I am oficially shocked!

See for yourself:


Before:



After:



If you think this is impressive i have to add that ambient today is 5ºC higher than when i tested with the stock tim. So basically i gained over 20ºC on the hottest core!

I used Coolabratory Liquid Ultra between the IHS and die and Prolimatech PK-1 between the IHS and my waterblock.

Now i have to find out if it gained me any overclocking headroom but first i'm gonna enjoy my temps.

[Zeus]

Thanks mate. It's called Rubson FT101. Not sure if it's available outside of Europe though.

[mav2000]

Delided!!!!!!!!



Before temps at 4.5 Ghz 1.20V, max temp after two rounds - 72



After temps at 4.5 Ghz 1.20V, max temp after 2 rounds - 60



Awesome temp drop on 3 out of 4 cores, but I think maybe a clean up and re mounting is required. Used Collaboratory Liquid Pro.

I should have used Linx, but in my hurry I ran IBT.

[MaynardX]

Hy Guys
Here is my rig after 11 minutes of Linx with Coolllabolatory Ultra on both die and IHS.
Yes you're not beeing wrong, my CPU is a crap: 1.48 for 4.8 GHz but who gives a dame I enjoy those low temps :p
I find LinX to warm the CPU more then Prime blend within first minutes test.

[OldChap]

From observations only I would say that the cooler the cpu runs, be that through chilling, new tim or just plain old ambients, the lower the voltage needed for a given overclock.

As the weather got warmer here my MOAF cooled 3770K has needed more voltage. I need winter to come around to see if this is really true or if I am seeing degredation.

[RBS]

Hi, finally arrived liquid ultra and put it to die and ihs, the temps went down around 10 degrees more from as5+as5. Anyway this chip is quite crappy and will stick it to 4.7 with 1.4v ish.

Im thinking to use it with gtx480 and accelero twin turbo 2, do you think will have some problem? Not sure the ihs and anchorage materials. Thanks in advance and soz for offtopic.


Sent from my iPhone

[zalbard]

I wonder if Liquid Ultra is just about as good of an option for IB die as Liquid Pro is.
The reason being that its structure resembles paste and, thus, is more likely to work better in cases with uneven surfaces and poor contact, while Liquid Pro makes a very thin layer.
Or am I wrong in this assumption?

Hi, finally arrived liquid ultra and put it to die and ihs, the temps went down around 10 degrees more from as5+as5. Anyway this chip is quite crappy and will stick it to 4.7 with 1.4v ish.

Im thinking to use it with gtx480 and accelero twin turbo 2, do you think will have some problem? Not sure the ihs and anchorage materials. Thanks in advance and soz for offtopic.


Sent from my iPhone

As long as it does not come in contact with aluminum it will be fine. Liquid Pro worked very well back when I used it on 8800 Ultra, and Liquid Ultra generally seems much safer.

[MaynardX]

Everyone who struggles whether to use CL Ultra, look at the screenshot below.
I mean 1.505 Vcore shall I name quite nasty for a liquid cooling (it tops a notch during full load 1.512). Sorry I don't have a screenshot for this, but with IC Diamond on both IHS and die it was impossible to reach even 1.495 due to 98C.
Right now I have 80C on the hottest core with 1.505 Vcore, so CL Ultra is worth the try.
At the moment I don't have time for this, but in a while I will try lapping the inner side of IHS. The reason for this is this "stain" of residue (I guess everyone observe on their samples after the IHS removal) which might affect the overall thermal conductivity.
Last comment concerning temp reports. I think one should mention his/her ambient temp during the tests, as IMHO this temp is also crucial for CPUs thermal measurement.
So below your post, give us your ambient temp.

My ambient for the measurement below was 22C.

[dr_dx]

At the moment I don't have time for this, but in a while I will try lapping the inner side of IHS. The reason for this is this "stain" of residue (I guess everyone observe on their samples after the IHS removal) which might affect the overall thermal conductivity.

I wouldn't. Yes, I had the "stain" as well, but I cleaned the IHS underside with IX's cleaner (also 70+% alcohol works too) and removed any last bit of the stock TIM (and the stain was still there).

The underside of the IHS is flat, if you "lap" it to remove the stain, it won't be flat anymore and won't make as good a contact with the "flat" die surface. I think the stain is a result of a chemical reaction between the nickel and the stock TIM, not because there is any TIM residue.

[dr_dx]

I wonder if Liquid Ultra is just about as good of an option for IB die as Liquid Pro is.
The reason being that its structure resembles paste and, thus, is more likely to work better in cases with uneven surfaces and poor contact, while Liquid Pro makes a very thin layer.
Or am I wrong in this assumption?

No. As far as an IB die is concerned, Pro will be better (if properly applied). The die surface and underside of the IHS are flat, and after removing the black adhesive, you will find that the IHS will rest on the die without touching the PCB - so you know there is no gap between the 2 flat surfaces. Just apply a very thin layer to each (use a very small drop, smoothed out to a mirror finish on both) and you will have the very thin layer that makes Pro so effective. Ultra, which has less than half the thermal conductivity of Pro, won't be as effective. Pro is pure liquid with no bulk. Ultra uses a graphite copper matrix (small particles of graphite and copper mixed together) to add bulk to fill in gaps. Pro works best on flat, even surfaces, Ultra best on uneven surfaces. Regarding safety, they both contain gallium and are harmful to Aluminum, so I don't consider Ultra any safer than Pro.