P55-UD6 socket burn

[Raja@ASUS]

raju,

Many thanks for this information, I wonder if anyone has the before and after pictures of the socket if it was changed? If there is a new version out, how do we spot it.

I have not been given any real tech specifics on the change at all yet. If/when I find anything out I'll update here straight away..

[CARLOS*A1]

Ok my evga ftw if you say lots will have no problem help Thanks

[Nelly]

I know one thing if your socket is damaged/burned Asus for one will not replace/repair under their warranty, not sure about other motherboard manufacturers but it seems wrong if it's an actual defect of the foxconn retention plate.

Will Intel replace under warranty CPU damage? I doubt it because warranty doesnt cover overclocking.

All my pins are indented on my CPU so hopefully mine is fine but if anything happens to my CPU/Motherboard I will take up a case with Trading Standards Institute for selling defective hardware.

I wonder what the UK Goverment trading standards would say in regards to manufacturers selling defective motherboards that can cause damage to the board & CPU which breaches their warranty due to a defect of their own.

It's quite possible that TSI could force a full product recall here in the UK anyway . . . . . .

[saaya]

so what, the problem is the top frame of the socket not pushing the cpu down hard enough? 0_o
that doesnt make much sense to me... like somebody pointed out before, theres actually a plastic frame the cpu package sits on.
so it cant go lower no matter how much pressure you put on it... and even IF it could, why would the cpu have to be pushed lower for vss pins to make propper contact?
shouldnt they make contact at the same time/pressure as vcc pins?

and yes, most 1156 boards use the foxconn socket... i doubt other socket makers could actually produce enough sockets to replace foxconn sockets entirely...
but there should be enough sockets from other makers to replace foxconn sockets on highend boards?

[STEvil]

so what, the problem is the top frame of the socket not pushing the cpu down hard enough? 0_o
that doesnt make much sense to me... like somebody pointed out before, theres actually a plastic frame the cpu package sits on.
so it cant go lower no matter how much pressure you put on it... and even IF it could, why would the cpu have to be pushed lower for vss pins to make propper contact?
shouldnt they make contact at the same time/pressure as vcc pins?

and yes, most 1156 boards use the foxconn socket... i doubt other socket makers could actually produce enough sockets to replace foxconn sockets entirely...
but there should be enough sockets from other makers to replace foxconn sockets on highend boards?

You'd think so, but it is possible that there is some "warp" happening below the plastic frame the CPU sits on due to pressure applied by the retention bracket, heatsink and/or just from heat when it was all soldered together.

[[XC] Oj101]

I'm sure overclocking simply speeds up the process and this would happen anyway several years down the line. If it were to happen within the warranty of the board and chip while running stock would we get a replacement?

[Raja@ASUS]

Stance from companies using Foxconn sockets is that there's no real problem. The tech dept's of some companies are putting it down to operator error/extreme OC (some are telling users they've never even had an issue..lol).

That being said, it is possible ASUS may move their P55 line up over to another socket vendor (they are looking at qualifying other sockets). The Foxconn sockets did pass Intel qualification back in June. So it's really a case of - are there sockets out there from pre June qualification that should not be, or is the overhead of the Foxconn socket limited by deisgn in comparison to those from LOTES or TYCO AMP?

I had a big conversation with one of DFI's tech guru's about this and he's as stumped about the cause as anyone (they've had a socket burn issue on their end too). Every reported case has happened under overclocked state so far. Until we get this happening at stock it's going to be difficult get answers from those in the know. The only way to test the sockets themselves would be to use tools that only Intel have access to (a transient load tester deisgned around the socket to measure the voltage drop via the socket).

I've got one Gigabyte board here using the Foxconn socket and it has not burned out under extreme OC, so it's still random I'm afraid.

regards
Raja

[saaya]

You'd think so, but it is possible that there is some "warp" happening below the plastic frame the CPU sits on due to pressure applied by the retention bracket, heatsink and/or just from heat when it was all soldered together.

yeah but look at the vss pads... those are diagonal lines on the cpu package... so a warp wouldnt explain this...

and im not surprised the mainboard makers dont see this as a problem...
though id have thought that more than just dfi and evga would use another socket... if only for marketing...

but yeah, who knows if non foxconn sockets actually are better?
maybe testing on a grand scale would show that theres is the same chance getting this problem on a lotes socket... only time will tell...

[Dami3n]

What code have the burned foxconn sockets?
The p7p55d pro of my 2nd pc have FOXCONN 115XDBP 976

[So_BAD]

Hi!

In fact, I'm not worried about my P7P55D Deluxe, it does not intend to OC higher than 4.0GHz, simply because don't need all this clock.
Neither will use LN2 or others, to see if the material used in the socket FOXCONN resists temps very negative, etc...

What scares me so far, based on the facts reported, mainly in the XS, is the poor settlement of the CPU. That is, the contact between the pins of the socket and CPU. What causes small "sparks" and consequently the short-circuit and melt the socket, pins and CPU. This is very serious!

The reports noted that until now, speak over the 8XX series CPUs, perhaps because these are the most sought after by so inclined OC, really extremes.

With my combination of P7P55D Deluxe + i5 750, reports have not noticed yet ... but I'm watching.

I contacted Asus Brazil reporting the case, including informing this links (from XS, Anandtech etc) and asked for explanations when a possible RECALL, from Asus. They responded but, I thnk, which was sent over a "standard mail response" to all who ask about warranty of any Asus product that is not manufactured in the Brazil. How to uses warranty, when it's is possible etc.
No objective response on this case specifically.

Now, I contacting FOXCONN Brazil, to ask then about this issue... soon I post news.

This is mine "version" of FOXCONN socket:





... and sorry my poor english, I'm an illiterate, almost.
.
.
.
.

[Koen]

I noticed that the hold down plate used in Asus Maximus III is different from other Foxconn sockets:

Those bits that push cpu down are bigger and closer to the IHS.
Maybe it's a new revision or something?
edit: Looks like it's the same socket as on the P7PP WS photo posted by dctokyo, and only those 2 Asus motherboards use it - even Maximus III Gene and Sabertooth 55i share "standard" hold-down plate.

[Raja@ASUS]

User here says he did this @ stock. Posts 1 & 15 are of interest.

http://forums.hardwarezone.com.sg/sh....php?t=2540820

[So_BAD]

User here says he did this @ stock. Posts 1 & 15 are of interest.

http://forums.hardwarezone.com.sg/sh....php?t=2540820

Yes, is true.

But, again, it happened to a 860.

Maybe the 8xx's need much more energy, so these electrical contacts, perhaps because they were made with an cheaper material (we have seen dozens of cases of Chinese companies, and others, that lower costs, used cheap raw-material), are not supporting this load?

I'm not a expert, but I'm trying find what's the problem...

Today, send mail for Foxconn, and "all" ASUS (Europe, Asia etc)... Will see the responses.

Thanks!

[dctokyo]

Hi Raju,

You mention that you tested the Asus Maximus III and it had problems, after reading the post by Koen that I quoted here, would it be possible to post a picture of the socket of the Asus Maximus III or could you kindly look at the picture that I posted here of the P7PP WS and comfirm if the boards that you used have the socket in the P7PP WS picture? Many thanks again for your help into looking into the socket problems with the new P55 boards.

I noticed that the hold down plate used in Asus Maximus III is different from other Foxconn sockets:

Those bits that push cpu down are bigger and closer to the IHS.
Maybe it's a new revision or something?
edit: Looks like it's the same socket as on the P7PP WS photo posted by dctokyo, and only those 2 Asus motherboards use it - even Maximus III Gene and Sabertooth 55i share "standard" hold-down plate.

[Raja@ASUS]

Here's the board that suffered a burnout; it uses the regular Foxconn top plate.

[dctokyo]

I noticed that the hold down plate used in Asus Maximus III is different from other Foxconn sockets:

Those bits that push cpu down are bigger and closer to the IHS.
Maybe it's a new revision or something?
edit: Looks like it's the same socket as on the P7PP WS photo posted by dctokyo, and only those 2 Asus motherboards use it - even Maximus III Gene and Sabertooth 55i share "standard" hold-down plate.

Hi Koen,
It looks like you might have the new version after looking at the picture raju posted here. I really wanted to get the board.

Would you have any marking on the retail box that you could share with me in a IM? As it would help me to look for the type that you have.

Also, look at the location of the "CPU Level Up" print, different location. Different versions of the board?

[dctokyo]

Here's the board that suffered a burnout; it uses the regular Foxconn top plate.

Many many thanks raju, after looking at that picture and the one Koen posted, it looks like Asus have changed the socket version, now the problem is, does the new version fix the problem of the pins making contact?

[Mikael]

I got a brand new P7P55D with Foxconn socket yesterday. I mounted the CPU in the socket and then umounted it and checked the pads. All of them had the same scratch marks in the middle from the pins making contact. So, my board does not seem to have any, or atleast not any severe, contact issues.

My buddy bought the same board and did the same test and his socket also seems okay.

Unfortunately, I forgot to take a picture of the socket before mounting the cooler. I'll probably be taking it off next week, though, so I can return with a picture then, if anyone's interested.

[Clunk]

This dropped in the mailbox today from Foxconn. We'd been asking Gigabyte UK about the issue with the Foxconn sockets and they apparently weren't aware of it, so they wrote to Foxconn and this is what they replied.

[Koen]

Hi Koen,
It looks like you might have the new version after looking at the picture raju posted here. I really wanted to get the board.

Would you have any marking on the retail box that you could share with me in a IM? As it would help me to look for the type that you have.

Also, look at the location of the "CPU Level Up" print, different location. Different versions of the board?

Unfortunately I don't have this board. The picture I posted comes from this bit-tech article. It might be that raju's board is the production version and the one I posted is some prototype. You can also see that ram slot colours are in different order and there are some white stripes under mosfets.

[Raja@ASUS]

Can you ask him if this is a Foxconn or TYCO AMP socket George?

[cyclo]

Just wondering if heavier heatsinks somehow causes the boards, cpu plate, etc., to wrap a little. These wrapping (even though small) coupled with overclocking might be pushing the contacts to the limit, the spacing of which appears to be smaller on the 1156 based CPUs.

EDIT: My theory is easily disproved though if the same socket burn occurs on a water cooled 1156 based CPU.

[dctokyo]

Just wondering if heavier heat sinks somehow causes the boards, cpu plate, etc., to wrap a little. These wrapping (even though small) coupled with overclocking might be pushing the contacts to the limit, the spacing of which appears to be smaller on the 1156 based CPUs.

EDIT: My theory is easily disproved though if the same socket burn occurs on a water cooled 1156 based CPU.

You do understand the CPU sits on top of the bottom plastic of the socket, it is impossible to make it sit lower, unless you use a hammer, so a heat sinks weight is not the problem.

[[XC] Oj101]

Unless the plastic bends, of course?

[saaya]

those ftw burn marks seem to have happened on a different part of the socket... is that still vcore?