Monk, yes you are correct but you are missing some key issues. First, you have 3 barriers between the bottom of the WB and the top of the cores with an IHS CPU. You've got TIM1, IHS and then TIM2. On a bare die CPU, there is one barrier, TIM, period. With bare die CPU flat to flat is where it's at (ooh ima rapper now). With an IHS and the core(s) being underneath, we have discovered that it isnt necessarily flat to flat that works best, as a matter of fact it does NOT. If we can apply more PSI to the CENTER of the IHS without the outer ridges of the IHS interfering, we get better results.





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As far as the mfgrs go, I do believe they want quality so long as it doesn't send them into the RED in doing it... Swiftech stuff has always for the most part been of very high quality, sometimes I question the materials used but fit and finish is always top notch there.


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