Real Temp - New temp program for Intel Core processors

[rge]

It should throttle at DTS=0 and shutdown at temps 20-25C above that.

When DTS=0, coretemp will read temp of 100, ie at tjmax setting, and Realtemp will read 95C. But that will tell you nothing, unless you are verifying/measuring the temperature in an independent way (and if you are doing so, ignore this, I missed it). If you want to approximate core temp, need to measure Tcase...
1) with heatsink off, otherwise you are cooling tcase and creating gradient.
2) at idle steady state to minimize any gradient (slowly bring to idle...with E8400, .9v and 6x200 works well, with q6600 dont know how, or if possible to bring up slowly)

The gradient from core sensor to between the cores across die...is less than 0.1C at idle steady state, and ~15% of tested programs at load steady state, and nearly 1/3 tested programs at load steady state had less than 1C gradient...figure 5...but read whole paper from intel
http://arxiv.org/ftp/arxiv/papers/0709/0709.1861.pdf

The gradient from thermocouple on die (via hole drilled to it) to casing temp was measured in one experiment...and found to be 0.4C
http://www.overclockers.com/tips443/

Or you can estimate the gradient at steady state idle from die to tcase (first paper shows gradient across die is <0.1C at steady idle), from reading several intel papers. One was
http://www.flomerics.com/flotherm/te...apers/t324.pdf
Thermal conductivity [W/m-&#176;K], die is 120.4, die attach adhesive is 0.9, mold compound is 0.63, air is 0.0261. Gradient measured from tj4 (68C) to tc (67.9C) was 0.1C across ~130um of mold cap. Temp gradient should also be nearly 0.1C across 75 microns of die attach adhesive (higher conductivity and thinner).

It would be hard to believe a gradient higher than 1C then by just increasing the thickness of the IHS, especially given intel has been researching for years/making improvements to reduce this gradient. Though Intel in various papers test and list thermal conductivity for silicon die, ceramic die, die attach adhesive, IHS compound, etc, no proof exists they are using these exact ones, but I doubt they are using ones less effective than ones they have published/successfully tested.