H50 backplate fits fine but if you want to be careful, I would trim some of the plastic so none of the nearby chips could be crushed under pressure.
Like this:
http://yfrog.com/n0p1010416j
Modding the backplate removed my ability to install it on a socket 1366 motherboard, but I don't mind since it will be staying with this system.
I think someone asked about mosfet heatsinks for underneath the board. Those silver heatsinks are 8mm high. They are from sidewinders.
http://www.sidewindercomputers.com/mimi.html (black) or
http://www.sidewindercomputers.com/misimi.html (silver).
I also changed my fan recently on the H50 to a Feser Triebwerk TK-121 (it was on sale for $20 so I decided what the hell). Running at full speed (~1200) while sucking air from the front of the SG06 my temps are 56-57C running at 3255mhz while running BOINC. Voltage is at 1.1V.
Pic of the fan (it is huge lol):
http://yfrog.com/5bp1010418gj
Fan almost butts up against the memory modules with the H50 installed in the SG06.
Also, if anyone wants to change their chipset heatsink. The distance between the mounting holes (using the inner edge of the hole) is 47mm (not sure if that is how you measure it :shrug:). I changed my chipset heatsink to a Zalman ZM-NB32K chipset heatsink. I had it floating around in my drawer so I decided to use it. Hard to say if the temp difference is the heatsink or more airflow from the fan (I changed the fan and heatsink at the same time) but my chipset load temps are now 63C compared to 74C with the stock heatsink. Only issue with installing the zalman heatsink is the shape of the heatsink. It cannot be rotated since it bumps with the SATA connectors and nearby capacitors.
Chipset heatsink:
http://img299.imageshack.us/i/p1010415i.jpg/