#626 coordinates to the thermal data in my post #493 (Thermals are the same as post #480 since this was only a retest of the film with a different screw order.)
#626 coordinates to the thermal data in my post #493 (Thermals are the same as post #480 since this was only a retest of the film with a different screw order.)
Last edited by tastymannatees; 06-05-2008 at 08:03 PM.
Note: to edit/add thermal data later
Note: to edit/add thermal data later
Anantech thermal result progressive lapping
Initial result 0 then -5C
Last edited by tastymannatees; 06-02-2008 at 05:24 PM.
Note: to edit/add thermal data later
Test comments from PM
Re: pressure result
the cut corner of my films is where the gold corner is on my processor.
cpu: amd am2 x2 4200 65W
board: asus m2n-sli deluxe
heatsink: thermalright ultima 90 - added 1 washer to spring
case: silverstone tj07
temp results prior to film testing (so, these would be seeing pressure in 37A)
AS5 - ambient of 25C
WCG 100% load temps
core 1: 35
core 2: 40
Shin Etsu X23 - ambient of 22C
idle temps:
core 1: 29C
core 2: 34C
WCG 100% load
core 1: 36C
core 2: 41C
IC D7 - 22C ambient
idle
core 1:25-26C
core 2:32-34C
WCG load
core 1:34-36C
core 2:40-42C
temps after adding another washer to heatsink mount, so i have a total of 2 washers. pressure in 37B:
ambient 25C
idle
core 1: 26-27C
core 2: 33-34C
WCG load
core 1: 35-36C
core 2: 40-41C
Last edited by tastymannatees; 06-05-2008 at 08:53 PM.
I will add the thermal test data and system specs over the next couple of days as I get time to sort it all out
Feel free to comment
older data on it can be found in this post and the one linked in it.
so after 2 weeks on D7 I see
Core 0:30c
Core 1:29c
and room temp was 70f or 21.1c
I did some work on the chip and decided to take out the drimel .
What do you guys think of my work bench:
I did an overlay on your drimal result- Looks like the areas with the most material removed have the best contact. What is interesting to me with pretty substantial changes the results seem pretty static.-
You guys are pretty compulsive my lab on a good day comes no where near being that organized
hahaha you should see the rest of the room!!! I was very interested in that also. I like the overlay you did. nice work, your overlay is exact! I did the same thing with the sheet after I see it.
something I forgot to add. I put 24c diamond past on the chip after I got done playing around and found that the temps were down some 28 and 27
that was after 10 full load mins. I will check it again here really soon because I need the chip for a little testing of some other products. then I will do a 2 week run on D24
Last edited by littleowl; 05-31-2008 at 04:05 AM.
added some of the thermal data - waiting for 123Bob and 64dragon to help me sort some of it out as well as a couple on hardwarelogic
XSWCG Disclaimer:
We are not responsible for the large sums of money that you WILL want to spend to upgrade and add additional equipment. This is an addiction and the forum takes no responsibility morally or financially for the equipment and therapy cost. Thank you and have a great day.
Sigmund Freud said... "Failure to CRUNCH is a sign of Sexual Inadequacies".
XS WCG Rules: #1: don't pull fart_plume's finger #2: Dave aka Movieman, don't give him your phone number if you like your hearing
XS WCG Note: There are 2 sets of points, WCG and Boinc. WCG = 7x Boinc
Project: Dark Matter (<- link) - Asus Maximus II Formula, Intel X3330 3.4ghz @1.32v under load, corsair ddr2 1066 8gigs, evga gtx260 core 216, pc p&c 750W, EK Supreme HF Nickel, iandh 175 res, Swiftech MCP355, Black Ice GTX G2 240, Lian Li v1200b
silverstone tj07 build log
Got reffered to this thread and I must say it was very informative. Iv'e been useing IC7 for a few months and think it's great and with all the inputs to this thread it seems to be others opinion as well. I might have missed something but did anybody try lapping a cpu and a water block before useing a pressure test strip.
Peace
CCL
Cosmos 1000 case
EVGA 790i P04 Tim mod+80mm Evercool fan on N/B fins
PC Pwr & cooling 750W
QX9770 @4.0GHz
W/C D-tek FuZion, MCP655, Thermochill PA120.2, Micro Res
2-EVGA 9800 GX2s only 1 installed till quad crap gets fixed
2-WD 150GB Raptors
2-2GB G Skill F3-12800CL7D-4GBHZ
Vista Ult 64
24" SOYO LCD W/S
Logitech Z5500 Spkrs
G-15 keyboard
I have a couple that are lapped and I have found that even when we lap we don't get them any better then they were before lapping. The only reasons our temps seem to drop a couple of degrees when we lap is because we get a little closer to the die and a slight bit more of a gap so we rely on the tim to do the trans instead of contact.
Tasty, I also see I have PM but can't access it. Just got back from the coast so I've got a lot of catching up to do with, and for, you. I'll get on it as soon as I can.
(SIDE NOTE - It was nice to see the farm score well while I was out.... It did it all by itself....)
clwoodwork, I have farm-09 sprinkled through here that underwent "edge" lapping and temp re-testing. There are before and after posts all over the place. I'll try to pick them out to make it easy for you, and to allow Tasty to coordinate my data with the previous pressure imaging results. A few of them are mine.
Littleowl, interesting result on your edge trial. Is the center really that concave as to not show up after the lap? Or is there more edge material further in from where you dremeled? A machinist ruler might show it. BTW, great bench. 10 times neater than mine......I'm about to break down and build up some back shelves like yours. Right now, I don't have them, I just keep piling stuff on top of my toolbox...
Regards,
Bob
While there is a little lull here waiting for a couple of people to get back to me so I can link thermal data to pressure film results I thought I would post this for fun
I have been running some other accelerated tests with some glass slides, we are still roughing out the procedure so take it for what it is, attached Pic of test result was run for 20 hours at 150 C The center picture ICD is IC Diamond. The others are commonly used overclocker performance pastes. Not a drop dead test but it does highlight the stability of ICD7. The picture is back lighted so the void formation is clearly visible
as noted in another test we ran ICD7 for a continuous 1000 hrs @125 C with no change in thermal performance.
I got the Idea from Intel from this /////For example, a TIM in a notebook system might experience temperatures in the 50-90 oC range over its life of three or more years. Under accelerated testing, the thermal stress is enhanced and the TIM is tested in the 125 to 150 oC range for shorter durations. The Mobile TIM Tester is put in a bake chamber and heated at a temperature of 125 oC or 150 oC for about 2000 hours. The TIM performance is measured at every interval as needed (e.g., 100 hours, 500 hours)./////
The refinement on the test I am working on I use IHS sized copper squares lapped to an 800 grit and I then clamp them between two 2X10 glass slides with 10 binder clips. From the raw pressure film it looks to be about 50 psi.
I am running 2 main series of tests here, a thermal cycling test and long term bake out tests through a series of temps. @ 100C a couple of the compounds start to break down after only a couple hours. @ 125C all show some kind of failure with the exception of ICD7 under 20 hours.
as noted in another test we ran ICD7 for a continuous 1000 hrs @125 C with no change in thermal performance.
It's pretty time consuming to get right but other interesting info is coming out of this also related to application, surface finishes, flatness etc. when I finish the series I will post it.
thats cool to see. thanks for the pic tasty.
i was gona try some D7 on my laptop (p4 2.8ghz) cause it was idle at 60C and 2 min of prime 95 brought it up to 80C!!! but i managed to break something while remounting the heatsink and now it doesn't show anything on the screen when i turn it on, hooking it up to an external monitor didnt change anything . stupid overpriced sony piece of crap. it just hit 4 yrs old and had been rma'ed thru them several times.
XS WCG Rules: #1: don't pull fart_plume's finger #2: Dave aka Movieman, don't give him your phone number if you like your hearing
XS WCG Note: There are 2 sets of points, WCG and Boinc. WCG = 7x Boinc
Project: Dark Matter (<- link) - Asus Maximus II Formula, Intel X3330 3.4ghz @1.32v under load, corsair ddr2 1066 8gigs, evga gtx260 core 216, pc p&c 750W, EK Supreme HF Nickel, iandh 175 res, Swiftech MCP355, Black Ice GTX G2 240, Lian Li v1200b
silverstone tj07 build log
Andrew, I should have my samples ready for sending by coming Monday
Main rig:
CPU: I7 920C0 @ 3.6Ghz (180*20)
Mobo: DFI UT X58 T3eH8
RAM: 12GB OCZ DDR3-1600 Platinum
GPU/LCD: GeForce GTX280 + GeForce 8600GTS (Quad LCDs)
Intel X25-M G2 80GB, 12TB storage
PSU/Case: Corsair AX850, Silverstone TJ07
Tasty,
1. Your Post #622 coordinates to the data in my post #167 and #492
2. Your Post #623 coordinates to the data in my post #202 and #417
3. Your Post #624 coordinates to the data in my post #202 and #417 (Same machine, two pressure test samples.)
4. Your Post #625 coordinates to the data in my post #480
5. Your Post #626 coordinates to the data in my post #493 (Thermals are the same as post #480 since this was only a retest of the film with a different screw order.)
Hope this makes sense.....
Regards,
Bob
Tasty, i finally got your pm earlier today and replied a lil bit ago. I did a lil rambling/ just writing down thoughts and i'm posting that here/now. I forgot to add that my heatsink and ihs are lapped to 800 grit.
While i was getting my temp data for tasty i also looked back at my pressure film results. I noticed that when i added the 2nd washer to both sides i gained some contact area and increased the amount of pressure. Looking at the films answered the question that i've always had of why i have such a gap in temp between the 2 cores (a 2-6C gap), the one core is just not getting enough pressure and realized this is caused by my mounting bracket, it applies pressure in the center and not enough to the sides of the heatsink base.
here is how it currently mounts
I just purchased this from frozencpu, they do not list it working with the ultima 90 just the ultra 90, so i gather there will be interfearance with some heatpipes but i'm hoping it just a little and i can use my dremel and get it to work. this bracket should give me better pressure (even if i have to add washers to it too) since it covers the corners and bolts down at the corners too
Using my current mount, i'm also wondering what pressure change i'd see if i used 2 washers on one side and one washer on the other side of my heatsink. I dont think this would solve my uneven pressure because i think (but am totally guessing) that my cores are left and right of each other. having uneven washer pressure should only help if they are above and below each other. but would still be interested in seeing what happens...if i had pressure film
XS WCG Rules: #1: don't pull fart_plume's finger #2: Dave aka Movieman, don't give him your phone number if you like your hearing
XS WCG Note: There are 2 sets of points, WCG and Boinc. WCG = 7x Boinc
Project: Dark Matter (<- link) - Asus Maximus II Formula, Intel X3330 3.4ghz @1.32v under load, corsair ddr2 1066 8gigs, evga gtx260 core 216, pc p&c 750W, EK Supreme HF Nickel, iandh 175 res, Swiftech MCP355, Black Ice GTX G2 240, Lian Li v1200b
silverstone tj07 build log
Bookmarks