Come on man lets keep this technical, instead of a bunch of rumors that showed up on a blog about how everything is automated and AMD is doomed because their chips use up 20% more space and lose 20% more performance. If you can show me the places where BD's die space can be reduced by 20% and where performance can be increased by 20%, please show me.
There's plenty of solid proof that the GloFo 32nm process is borked, primarily how there's no clock or VID difference between 32nm BD and 45nm Stars, while Stars was designed for efficiency and BD was designed for high clocks and there's a tradeoff between both.
Compare TSMC's 55nm and 40nm process with 4870 and 4770 GPUs.
http://www.gpureview.com/show_cards....=564&card2=612 4770 is at the same clock, yet uses almost half as much power. These are the kinds of things we should be seeing with GloFo 32nm, but we're not. I doubt BD is that messed up where it would use twice as much power as Stars. I'm not saying it should use half, they are different archs and 4770 and 4870 are the same, but for power consumption to go up pretty much shows that there's serious issues with GloFo 32nm.
Because of this, I don't see 32nm Stars being much better than BD. Explain to me why a leaky and lossy manufacturing process is going to care about what architecture it's running on. From trinity it looks like BD is good when it's not leaking and running away with power consumption at higher volts.