i posted this on another M2F thread but was unanswered, so i figured this thread is bigger and is more apporpriate. i read a few posts on this mobo's cooling, but i still need some clarifications
http://img.photobucket.com/albums/v2.../heatsinks.jpg
1) these circular foam pads (circled in green) next to the NB screw post can be taken off to lower the heatpipe assemble in order for the NB to fit more secure? can the circular foam pads on the mosfet sinks also be taken off also?
2) can the 4 squared rubber pads (boxed in blue) on the NB's sink be taken off to also lower the whole assembly closer to the NB chip?
3) the screw posts circled in red are missing the circular foam posts that the NB and SB post has. is anyone else missing these too or is it just my board? would i need them?
4) at area 4, should there be a big thermal pad similar to the right of the NB or am i missing it?
5) in addition to all this, add some washers to the bottom of the board for the NB screws right? i don't get how adding these washers would tighten up NB contact if the screws can still be screwed in all the way with these washers.