[News/Rumor] Rumored Intel Kaby Lake-G Series: Modular, Multi-Die, HBM 2, AMD Graphic

[StyM]

https://www.techpowerup.com/232067/r...md-graphics-ip

Rumors have been making the rounds about an as-of-yet unannounced product from Intel: a Kaby Lake-G series which would mark Intel's return foray to a multi-chip module in a singular package. The company has already played with such a design before with its Clarkdale family of processors - which married a 32 nm CPU as well as a 45 nm GPU and memory controller in a single package. Kaby Lake-G will reportedly make away with its simple, low-data rate implementation and communication between two parts, instead carrying itself on the shoulders of Intel's EMIB (Embedded Multi-die Interconnect Bridge), which the company claims is a "more elegant interconnect for a more civilized age."

Instead of using a large silicon interposer typically found in other 2.5D approaches (like AMD did whilst marrying its Fiji dies with HBM memory), EMIB uses a very small bridge die, with multiple routing layers, which provide a good measure of price/data paths for the interconnected, heterogeneous architecture. This saves on the costly TSV (Through-Silicon Vias) that dot the interposer approach.

[Darakian]

I'm probably the only one, but I think this would make for an amazing small form factor build.

[zanzabar]

I'm probably the only one, but I think this would make for an amazing small form factor build.

i dont know about SFF but a nuk or micro pc. if you run SFF you should have space for a real gpu.

[Darakian]

Ya, nuc size is my idea. Maybe a custom enclosure to deal with the tdp.

[AliG]

The idea of low cost alternative to TSVs is interesting. I doubt we'd ever be able to see a head to head, but I'd be curious to see what the performance sacrifice is in exchange for manufacturing feasibility.

If nothing else, HBM2 has proven to be really costly to scale up. Wouldn't be surprised if the TSVs turned out to be a major pain point.