https://www.techpowerup.com/224864/m...tion-handhelds

Micron Technology, Inc., (Nasdaq:MU) today introduced the company's first 3D NAND memory technology optimized for mobile devices and its first products based on the Universal Flash Storage (UFS) 2.1 standard. Micron's initial mobile 3D NAND-based 32GB solution is targeted specifically for the high and mid-end smartphone segments which make up approximately 50 percent of worldwide smartphone volume[1]. As mobile devices bypass personal computers as consumers' primary computing device, user behaviors heavily impact the device's mobile memory and storage requirements. Micron's mobile 3D NAND addresses these concerns, enabling an unparalleled user experience that includes seamless high definition video streaming, higher bandwidth gameplay, faster boot up times, camera performance and file loading.

"Micron continues to advance NAND technology with our introduction of 3D NAND and UFS products for the mobile segment," said Mike Rayfield, vice president of Micron's mobile business unit. "The improved performance, higher capacity and enhanced reliability of 3D NAND will help our customers meet the ever-growing demand for mobile storage and will enable much more exciting end user experiences."
  • Industry's first mobile product built on floating gate technology, a universally utilized design refined through years of high-volume planar flash manufacturing
  • Micron's first memory devices with UFS 2.1 standard, which enable best-in class Sequential Read Performance for the mobile market
  • 3D NAND-based multichip packages (MCPs) also include low power LPDDR4X, providing up to 20 percent more energy efficiency than standard LPDDR4 memory
  • Industry's smallest 3D NAND memory die, measuring only 60.217 mm?, allows tiny memory packaging ideal for ultra-small form factor devices; Micron's 3D NAND die is up to 30% smaller than planar NAND die of the same capacity.