I don't want to talk with these misc anymore ... Just one thing , the key point is how ocz and mushkin sorting out these bad utt chips ... No matter how they have done it in chip level or module level or whatever testing they done ...
But it does have common standard in memory chips testing company ... Sure you can change the testing standard if you want it ... But there is general standard ... Here is what I found the speed binning/chip level burn in in kingmax related article ...
Speed Binning Process machine , Advantest T5585H ...
http://www.hardwaresecrets.com/fullimage.php?image=672
http://www.hardwaresecrets.com/fullimage.php?image=673
http://www.hardwaresecrets.com/fullimage.php?image=674
http://www.theddrzone.com/images/kingmax/KM-testing.jpg
This is what ocz and mushkin claim they have expensive machine to do that which I think it's impossible for them ... Each speed binning machine cost around USD 5 million , and many units are required to do different level of testing ... They are not chip testing or chip branding company and they won't buy something like this to produce their own brand labeled chip ...
After the speed binning process is completed , chips will be seperate into different groups ... But that only means that it's functional and meet the electrical spec ... But the reliability is still " UNKNOW " after the speed binning is completed ...
So burn in process is required to ensure chips reliability ...
The Burn in machine ... JEC Profit 1600 ...
http://www.hardwaresecrets.com/fullimage.php?image=675
http://www.hardwaresecrets.com/fullimage.php?image=676
http://www.hardwaresecrets.com/fullimage.php?image=677
http://www.theddrzone.com/images/kin...ting-trays.jpg
http://www.theddrzone.com/images/kin...M-testing2.jpg
The chips will be working under over voltage and over temp enviroment with specific working pattern for a long period to find out those bad chips ... This is the main reason I am told it's almost impossible for module maker to do that becasue these specific testing pattern under over voltage and over temp is specially designed and can not be found in module level testing machine or motherboard level tetsing ...
Their general testing standard is 1.4 * VDD and 125~130 degree celcius enviroment temp for DDR I chip ...
Once this step is completed , the chip is not UTT anymore
And the memory chip company will gurantee anything within the product spec once this step is finished ...
Before this step , they won't gurantee anything , they sold these UTT chips to you and they won't calling back if these chips are not ok because the cheap price already cover the replacement cost ...
After the burnin process , chips will be send to chip labeling ...
http://www.hardwaresecrets.com/fullimage.php?image=678
http://www.hardwaresecrets.com/fullimage.php?image=680
So there is no so called very very secret in chip level brun in testing ...
Mushkin or OCZ can simply show something or picture about their standard or equipment if they did not want to describe it in very detail level ... But they can show something to us and clear the problem of the UTT chips because they have done a good testing and found out those bad chips , the chip is not UTT anymore but OCZ chips or mushkin chips !!!