Thank you, that's an excellent photo. It doesn't look like regular runny TIM, it seems more like hard, crumbled ceramic.
Printable View
Ha! Here is a crude drawing of what I typed:
http://s19.postimage.org/48uj2vqpf/quick_pic.jpg
My hypothesis is that when the caulk is removed (black dots) the headroom above the die (red arrows) decreases by that same distance. So if you lap the bottom of the IHS, you will decrease further the internal headroom perhaps to the point of crushing the die when locked in place. Just my thought. Others?
Precisely the point I was trying to make in post 181. If you can measure the gap with a feeler gauge once the black glue is cleaned off then one must expect that the IHS and the die are in good contact. If however the gap is so small or non existent then there may be some advantage to "lapping" the edges of the IHS (nearest the circuit board) to ensure the good contact.
What's the best method to apply the TIM between the IHS and the die? I'm assuming 2 drops (since the die is rectangular) of TIM on the bare die, and let it auto-spread when the IHS is clamped back on?
More update with change to new TIM by Coolab Liquid Ultra
http://img.techpowerup.org/120802/001_resize.jpg
before i used GC-Extreme from Gelid an image show for how the contact it look good(after testing)
http://img.techpowerup.org/120802/IMG_4253.jpg
result from GC-Extreme
http://img.techpowerup.org/120802/gelid.png
Change to Liquid Ultra
http://img.techpowerup.org/120802/IMG_4264.jpg
result from Liquid Ultra
http://img.techpowerup.org/120802/coolab.png
Graph results
http://img.techpowerup.org/120802/Copy-of-Clip.png
Conclusion
So it can more less temperature around 9-10C from GC-Extreme and for total from stock intel TIM to now seem
i can less temperature around 20C after change to Liquid Ultra that cool ! and now my chip can benching at 5GHz
before this chip never can benching at 5GHz :)
Some great info here Zolkorn. Really appreciate your effort :up:
Just a heads up Zolkorn do not put that cpu under cold with that liqued ultra it will die i did that and hwen it gets very cold the liqued ultra contracts and there is no contact on the IHS no more and the cpu wil burn..
Thansk ChaosAD ;) and big thanks Riska for your sharing about details it helpful to me :up:
btw. i think if i will playing with sub zero i will install by without IHS maybe it will better :)
Why not use vapor chamber type cooling, borrow one from a GPU...
Attachment 129095
http://www.hardwarezone.com.sg/tech-...uper-overclock
Thanks for the results ZoLKoRn. 10C difference between "normal" TIM and Liquid Ultra is actually pretty significant, considering the difference between the best air cooler and a mediocre air cooler only gives like 5C difference. It's amazing only TIM can have such a difference.
Would also be nice if you had Liquid Ultra compared to Liquid Pro.
Just did mine, 40°C lower on one of the cores :eek:. If I average temps from all cores before and after the mod, then it's 79.25°C before IHS removal, and 59°C after IHS removal. That's still 20°C difference, which is quite amazing. I just got a really bad chip out of the box. It couldn't even run stock voltages because one of the cores hits over 100°C. After undervolting to 1.07v @ 4ghz OC, one of the cores still hit 98°C, so this mod was pretty much required for me to get good temps.
http://www.youtube.com/watch?v=XXs0I5kuoX4
Eh, 79-59=? 40? :D Still very much worth it imho. I have already ordered Liquid Ultra. Having done a few AMD cpu's in the past it shouldn't be too hard. With AMD cpu's one has to be very carfull not bend the pins, something you don't have to worry about with these cpu's.
Hoping to get 5GHz fully stable, now it's only 32M stable.
My bad, sorry. I haven't had enough coffee. ;) I can't believe you're still seeing 98ºC on one of the cores, that's rediculous!. I haven't watched your video, what tim did you use?
edit: Just watched your video, nice to see.
One more happy (and lucky) person to join the IHS-successful-removal gang. 3770K in my case. My max load temps (prime95 with in-place FFTs) decreased by 12C from 75C to 63C.
My cooler is the first version of the Thermalright VenomousX (about 2 years old I think). With a better cooler the temps should be even lower. I'll get a new one soon as I want to OC this beast to the max on air.
If any of you fine folk who have de-lidded already have the capability, could you please measure the thickness of the metal that is the IHS.
I want to do some testing/calculations before I take down mine and do this.
Hmm... very interesting Leeghoofd ! but what you mean for Shamino try ? already try for without IHS right and result not different ?
Well i have some discussion with my team mate today, he told me maybe intel stock TIM under IHS problem with sub zero or maybe
bad contact because his check temperature under LN2 benching about 5.xGHz and LN2 full pot that mean -185C+ right ! but he
looking to Realtemp and it show big jump of temperature after cpu has load to 80-90C !!! that wrong because Realtemp shouldn't
big jump of temp like that
So i thought maybe all our problem with Ivy Bridge can't go high clock under LN2 because two issues, bad TIM or bad contact
between die and IHS
btw. Thanks for you info Leeghoofd ;)
Just went through this as well on my I7-3770k.
Dropped the highest core from 92c to 69c with the same ambient temps. The rest of the cores droped between 18-20 degrees as well.
This was running at 4.4GHz originally and now quickly testing 4.5.
Intel absolutely blew it with the TIM on the K versions. So much better with CL Liquid Ultra.
By the way, CLLU is veeeery easy to apply, you just "airbursh" the liquid metal around.
Do NOT use a regular double sided razor blade. It is too thin and too flexible. It will bend on you and it will cut the PCB!! Use the thicker blade WhiteDragon used in his video.
5Ghz @ 1.296v stock TIM/GC Extreme
Attachment 129314
5Ghz @1.296v identical except Liquid Pro/Liquid Pro RESULT = -27C,-28C,-26C, and -23C = -26C avg difference :eek::eek::eek::eek:
Attachment 129315
5Ghz @ 1.288v
Attachment 129316
IMHO, Liquid Pro is definitely the way to go; used on all 4 surfaces (all surfaces need to be "wetted"). Use a very small drop on die and underside of IHS - a little goes a long ways. BTW, I didn't have to lap the IHS, after cleanup, it was resting on the die. Highly recommend using a single sided safety razor. Very thin blade, will cause the least amount of PCB distortion. Just rock it back and forth and you can be done in less than 5 minutes.
Unbelivable temps and cpu :up:
Time to push it further.
dr_dx, unless you are using a chiller or it's freezing in your room your temperatures are off. I don't mean to take anything away from you and yes, i am jealous at your cpu but 13ºC idle on the lowest core is impossible with normal water or aircooling.
Still some good overclocking on your part and a truely awesome cpu!
Just top-chopped mine. I can't believe how easy it was. Literally 3 minutes and it was off. I used one of those razor blades that are used in hobby knifes to scrape of paint or something.
When i lay the heatspreader on top of the cpu it is "floating" on the die, the edges of the heatspreader are not touching the PCB so no need for lapping the edges of the spreader.
I'm gonna put Liquid Ultra in between and glue the spreader back on.
2 year old $100 homemade chiller - 60F~75F
http://www.xtremesystems.org/forums/...memade-chiller
I will update chiller thread with my current setup.
Ambient in my room is 27C.
Ok Doctor, thanks for clearing that up. :up:
I already have the Ultra and it was the only Liquid Metal i could find locally. Pretty sure it will still be better than AS5 and co, right?
Absolutely!
Just finished the assembly. Added a small bead of rubbery black adhesive that's rated up to 90ºC onto the edge of the spreader, carefully placed it back on top and removed the excessive glue with a couple of q-tips.
Put the clamp on and now we wait for 24 hours. :D
Just got my liquid pro...and tomorrow is a holiday for me...
Any last minute tips?
I found out the glue had cured so i'd put the cpu back in place and tested. I am oficially shocked! :eek:
See for yourself:
Before:
http://img.photobucket.com/albums/v6...ots/Before.png
After:
http://img.photobucket.com/albums/v6...hots/After.png
If you think this is impressive i have to add that ambient today is 5ºC higher than when i tested with the stock tim. So basically i gained over 20ºC on the hottest core!
I used Coolabratory Liquid Ultra between the IHS and die and Prolimatech PK-1 between the IHS and my waterblock.
Now i have to find out if it gained me any overclocking headroom but first i'm gonna enjoy my temps. :D
Thanks mate. It's called Rubson FT101. Not sure if it's available outside of Europe though.
Delided!!!!!!!!
http://www.erodov.com/forums/attachm...1&d=1344956342
Before temps at 4.5 Ghz 1.20V, max temp after two rounds - 72
http://www.erodov.com/forums/attachm...1&d=1344956342
After temps at 4.5 Ghz 1.20V, max temp after 2 rounds - 60
http://www.erodov.com/forums/attachm...1&d=1344956342
Awesome temp drop on 3 out of 4 cores, but I think maybe a clean up and re mounting is required. Used Collaboratory Liquid Pro.
I should have used Linx, but in my hurry I ran IBT.
Hy Guys
Here is my rig after 11 minutes of Linx with Coolllabolatory Ultra on both die and IHS.
Yes you're not beeing wrong, my CPU is a crap: 1.48 for 4.8 GHz but who gives a dame I enjoy those low temps :p
I find LinX to warm the CPU more then Prime blend within first minutes test.
From observations only I would say that the cooler the cpu runs, be that through chilling, new tim or just plain old ambients, the lower the voltage needed for a given overclock.
As the weather got warmer here my MOAF cooled 3770K has needed more voltage. I need winter to come around to see if this is really true or if I am seeing degredation.
Hi, finally arrived liquid ultra and put it to die and ihs, the temps went down around 10 degrees more from as5+as5. Anyway this chip is quite crappy and will stick it to 4.7 with 1.4v ish.
Im thinking to use it with gtx480 and accelero twin turbo 2, do you think will have some problem? Not sure the ihs and anchorage materials. Thanks in advance and soz for offtopic.
Sent from my iPhone
I wonder if Liquid Ultra is just about as good of an option for IB die as Liquid Pro is.
The reason being that its structure resembles paste and, thus, is more likely to work better in cases with uneven surfaces and poor contact, while Liquid Pro makes a very thin layer.
Or am I wrong in this assumption?
As long as it does not come in contact with aluminum it will be fine. Liquid Pro worked very well back when I used it on 8800 Ultra, and Liquid Ultra generally seems much safer.
Everyone who struggles whether to use CL Ultra, look at the screenshot below.
I mean 1.505 Vcore shall I name quite nasty for a liquid cooling (it tops a notch during full load 1.512). Sorry I don't have a screenshot for this, but with IC Diamond on both IHS and die it was impossible to reach even 1.495 due to 98C.
Right now I have 80C on the hottest core with 1.505 Vcore, so CL Ultra is worth the try.
At the moment I don't have time for this, but in a while I will try lapping the inner side of IHS. The reason for this is this "stain" of residue (I guess everyone observe on their samples after the IHS removal) which might affect the overall thermal conductivity.
Last comment concerning temp reports. I think one should mention his/her ambient temp during the tests, as IMHO this temp is also crucial for CPUs thermal measurement.
So below your post, give us your ambient temp.
My ambient for the measurement below was 22C.
Attachment 129332
Yes, thats the problem, not sure the materials involved, would say copper nickeled for ihs but not sure about the accelero anchorage. Really doesnt seem Al but could be an alloy and could have some Al. I sent mail to arctic cooling and they told me I should use mx4 or my 480 ihs could be damaged
Sent from my iPhone
I suggest of three choice for you, all are same compound with intel used
Permatex 81158 Black Silicone Adhesive <<< best one (Recommended :up: )
http://ecx.images-amazon.com/images/...500_AA300_.jpg
Shin Etsu KE-45W (they have five color > Transparent, White, black, Gray, red
http://www.szjiandao.com/cpen/html/i...1312081615.jpg
3M 08011
http://www.thisoldtractor.com/gtbend...s/3m_08011.jpg
;)
No. As far as an IB die is concerned, Pro will be better (if properly applied). The die surface and underside of the IHS are flat, and after removing the black adhesive, you will find that the IHS will rest on the die without touching the PCB - so you know there is no gap between the 2 flat surfaces. Just apply a very thin layer to each (use a very small drop, smoothed out to a mirror finish on both) and you will have the very thin layer that makes Pro so effective. Ultra, which has less than half the thermal conductivity of Pro, won't be as effective. Pro is pure liquid with no bulk. Ultra uses a graphite copper matrix (small particles of graphite and copper mixed together) to add bulk to fill in gaps. Pro works best on flat, even surfaces, Ultra best on uneven surfaces. Regarding safety, they both contain gallium and are harmful to Aluminum, so I don't consider Ultra any safer than Pro.
I wouldn't. Yes, I had the "stain" as well, but I cleaned the IHS underside with IX's cleaner (also 70+% alcohol works too) and removed any last bit of the stock TIM (and the stain was still there).
The underside of the IHS is flat, if you "lap" it to remove the stain, it won't be flat anymore and won't make as good a contact with the "flat" die surface. I think the stain is a result of a chemical reaction between the nickel and the stock TIM, not because there is any TIM residue.
3770K @ 5.0GHz HT 1.44v
IHS off + Arqtic MX-4:
http://i458.photobucket.com/albums/q.../IVY/507gb.jpg
IHS off + Coollaboratory Liquid Ultra:
http://i458.photobucket.com/albums/q...0linxultra.jpg
35C ambient Malaysia
http://i458.photobucket.com/albums/q...40F6899B38.jpg
Thanks did that the second time around and even though the best core didnt move much in temps (as compared to wetting only the die and not the underside of the IHS) the worst core did improve in performance. I think I may have put a bit more than I required, but with 12 degrees in avg temp drop, I guess I am happy with the way it turned out.
owikh84, are running without the IHS or did you place the spreader back on? 5GHz LinX is stable is what i'm after but i think 1.44V for daily use is a bit much. Pretty both my 3770K chips are gonna need that too for stable operation.
It's without the IHS I put the TIM directly on the bare naked die.
This 3770K batch L220B196 is my best chip I've owned many pcs before all of them needs 1.5v+ for 5GHz.
My water cooling gears are HF + D5 EK Top + EK X2 250 Res | EK FC7970 | 2x RX360 + 12x GT
Ambient is hot here 35C sigh
Thanks for the info man. I've been trying to find what it takes to get 5G 4c 8t on my chip but even 1.44V isn't cutting it for Cinebench 11.5 Cinebench 11.5 is a very fast method to determine stability and it's an absolute sucker for volts. I can run prime for an hour and even have CB 11.5 fail on me.
That is a pretty hefty watercooling setup you have there, i hope you don't have 12x GT 1850 rpm's at full speed running? If you have it will be noisy i guess. I am running a feser 480 with 4x GT 1450, the case is on top of my desk so the fans are pretty close to my ears and even 4x 1450's at full throttle are far from quite.
I have A 3770k 3218C176 Costa Rica here that runs awefully hot, i am still undecided wheter i will delid it or not. It seems a decent clocker but not sure if it is a 5G daily chip. I have to say that i did not see a lot of improvement in terms of overclocking headroom with the chip i'm running right now but the other chip might be different.
A proper way to run prime95 is custom blend, min FFT 128k, full available mem detected in Task Manager. Not the small FFT :banana::banana::banana::banana:s of course.
My GT 1850s are running at full speed but I'm used to the noise because I got another rig blasted with 16x GTs haha...
http://i458.photobucket.com/albums/q...DSC_0459-1.jpg
Nice rig man. Why did you remove the pic of the benchtable? I liked that one too.
Do you prefer Prime over LinX? I think LinX makes the cpu run even hotter but maybe i'm still using an outdated version of Prime?
this pic is outdated because it was taken on a Arqtik quad TEC. The TEC is broken & it's under RMA right now so using back my trusty HF.
So here's the pic again :D
http://i458.photobucket.com/albums/q...Y/DSC_0003.jpg
I prefer LinX as it detects errors faster & 1 hour is enough for 20 loops. For prime95 you need to use the latest version 27.7 build2 (of course on win7 SP1) then stress it for at least 3 hours. Anyway it's not like i'm gonna use my IB for 24/7 lol it's just for benchmark purpose so doesn't really need to run stress test anyways..
@owikh84 You do some of the cleanest, and best looking builds I have seen on any forums.:up:
I see some of you ran the cpu without the IHS. What heatsink/cooler did you use? I imagine not all all of them work because some assume there is an IHS 2-3mm tall and hence will never touch the bare cpu die. Am I wrong?
I just orderd the Noctua NH-C14. Will it work without the IHS? I noticed it has mounting brackets that seem to act as spacers ...
Cheers
p.s. I replaced the stock tim on my 3770K and even though temps dropped with 12C, I think I have one of the crappiest CPUs out there. On stock speeds, my load temps are about 65C (they used to be 75-76C). With the TIM replaced, I hit 90C quickly on 4.7 GHz @ 1.30v. I was so hopeful that after replacing the TIM I would be able to get at least 4.8GHz ... I have a Thermalright Venomous X and hope the NH-C14 will do a much better job.
^ You would need to remove the retention bracket in order to run it without the IHS.
Dr_Dx | Core i7 3770K [4C/8T] @ 5100.0MHz | 1.328v | ASUS Maximus V Formula| Water | L221B009 | LinX 0.6.4 AVX w/ Linpack 10.3.11.019 | Liquid Pro
Attachment 129386
5.2Ghz @ 1.4v LinX stable
Attachment 129391
5.3Ghz @ 1.488v LinX stable
Attachment 129398
32M SUper Pi @ 5.5Ghz
Attachment 129399
Did this on mine too.
Setup:
CPU: 3770K @ 4500Mhz - 1.224v (1.2v DMM)
MB: Asus Maximus V Gene
Cooler: Antec Kuhler 920
Results:
IHS on with STOCK paste + Artic Ceramique 2
http://forum.lab501.ro/attachment.ph...9&d=1345390280
IHS on with Arctic Ceramique 2 + Arctic Ceramique 2
http://forum.lab501.ro/attachment.ph...0&d=1345390280
IHS on with Coollaboratory Liquid Pro + Arctic Ceramique 2
http://forum.lab501.ro/attachment.ph...1&d=1345390280
STOCK:
IDLE: 28 25 19 26
LOAD: 70 73 74 72
Ceramique 2:
IDLE: 24 23 16 21
LOAD: 62 66 66 64
Coollaboratory Liquid Pro + Ceramique 2
IDLE: 23 22 14 21
LOAD: 53 56 58 57.
STOCK:
IDLE: 28 25 19 26
LOAD: 70 73 74 72
Peak GFlops - 71.58
Ceramique 2:
IDLE: 24 23 16 21
LOAD: 62 66 66 64
Peak GFlops - 76.38
Coollaboratory Liquid Pro + Ceramique 2
IDLE: 23 22 14 21
LOAD: 53 56 58 57
Peak GFlops - 86.00
The difference is a ~20% jump in Peak GFlop output from 71.58 to 86.00 just by reducing the already lowish core temps (well below stated throttle triggers)... incredible huh?! :eek:
Dont know why are that differences .. Dont think its about the throttling .. At 76 and 86 i had rams at 2000, at 71 dont know exactly, 1600 or 1800 or even 2000 too :).
Why do you guys insist on repairing defective CPUs? Why not use the forum to launch a class action suit? Kick some butt for a change..
While we all would love to get an IB using Intel's fluxless solder for the TIM, it would be very difficult to prove that the IB doesn't perform within it's designed parameters.
If you think about it, it's genius on Intel's part. They are willing to sell overclocking insurance to any sucker that wants it, knowing full well the IB can't be damaged by overclocking. In stock form, TJ will be reached long before any lethal voltages can be applied for any amount of time and if modified, the warranty is null and void, so it's a win/win for Intel. Brilliant!
Then that's why you have different GFlops... temperature alone won't affect that.
I did a before and after with only a TIM change. The after was, on average, -26C cooler, but the GFlops remained the same. All throttleing had been disabled on both runs:
Before w/ Stock TIM
Attachment 129448
after w/ Liquid Pro
Attachment 129447
OMG, 5ghz @ 1.3v @ 51c under linx. Thats crazy. Is this water? I need this :-)
Sent from my GT-I9000
I am now a very firm believer in Prime95 27.7 v2 (AVX) stability testing. I found I could pass AVX Linx or IBT for 30 max memory runs, pass superpi 32m and pass cinebench rendering, but Prime95 would fail within 50 minutes, especially when running 8 threads on 3770k. Had to bump vcore a few times to make it truely stable. So I no longer consider any screenshot valid unless it has a 16+ hour latest prime95 stable run in it.
I agree, P95 custom blend has always been a much better way to test stability. But I wont be doing anymore 16hr runs, too lazy for that now.
Initially I removed the IHS on my 3770K (batch L221A999) and replaced the TIM with MX-4 between the core and IHS and also between the IHS and the heatsink -- an almost 2 year old Thermalright Venomous X.
My max Prime95 temps for 4.7 GHz @ 1.30v, ambient 26C were 91C on the hottest core. Quite disappointing.
Then I bit the bullet and purchased and applied that Coollaboratory Liquid Ultra stuff that people kept raving about. I'm stunned.
Hottest core temp under Prime95 decreased from 91C to 75C (same 4.7 GHz @ 1.30v, ambient 26C) ... that's a freaking 16C drop just from changing the thermal paste! (I applied it again both between the core and the IHS and between the IHS and the heatsink).
I just upped vcore to 1.50v and clocked to 5.0 GHz and wPrime 1024M with 8 threads ... max temps are 87C with an ambient of 26.3C. This is absolutely great.
One reason the temps dropped so much might be that Thermalright builds (or used to build) the heatsink base with a small bump in the center, in an attempt to draw heat from the center of the CPU at an accelerated rate. See a pic here:
http://www.xbitlabs.com/misc/picture...x_qrov_big.jpg
Maybe due to that, the MX-4 was thicker on the outside of the CPU, maybe withholding heat. This Coollaboratory stuff being effectively metal, conducts heat much better than the MX-4 when the layer is thicker.
Another reason might be the plating itself. It's nickel plated but ultra shiny and flat -- no sign of lapping whatsover, see here:
http://www.xbitlabs.com/misc/picture..._q_big.jpg&1=1
This cooler also has a screw in the center which, when tightened, applies a lot of pressure. It may just be that with so much pressure, the thicker MX-4 just weeps out of the center (I did notice when removing the heatsink that in the center there were spots n both the cpu and the heatsink where the metal was directly visible).
Maybe the above helps others. In any case, I'm quite happy as you can imagine. Getting 5.0 GHz on air with an old cooler made me grin big time :D
I also had removed the IHS and used MX-4 on my 3770K. I just replaced the MX-4 with Coollaboratory Liquid Ultra between the core and IHS and also between the IHS and the heatsink and my hottest core dropped temps from 91C to 75C ... this is crazy. I'm at 4.7 GHz @ 1.30v vcore with 26C ambient, which is fairly high.
I tried 5 GHz but I found I need 1.50v vcore to be wPrime stable with 87C ... prime95 fails within minutes with temps over 94C :(. Granted, I'm using air cooling with an older Thermalright Venomous X which has that bump in the center of the base which may affect things and could be why the temps dropped so much when using CLU instead of MX-4.
My 3770K has batch no L221A999.
I'm seeing some crazy low voltages and temps in this thread for those using water cooling.
Are the above temps and voltages normal for air? Do you think using water cooling will improve things dramatically?
I'm still on air is because I want the system silent at idle, when my fans spin at 500-700 RPM. I tried the Corsair H100 a while ago and I hated the pump motor noise. Are there any pumps that are as silent as a fan at 700 RPM?
Guys
Liquid pro seems to be the favourite for under the ihs. As its good for this why doesn't any one seem to use it between the cooler and ihs? I imagine that gap to be rather small also? So is some other Tim better for that application
I have just covered all my machine in diamond Ic which seems to get slated in this thread??
Any help would be appreciated
3770K @ 5.0GHz 1.416v
http://i458.photobucket.com/albums/q...VY/501416v.jpg
bios set: 1.415v LLC very high
prime95 27.7 needs 0.064v more vCore :stars:
custom blend min FFT 128k
3770K @ 5.0GHz 1.48v
http://i458.photobucket.com/albums/q...VY/prime50.jpg
bios set: 1.47v LLC very high
Daveangel: most of common users don't use liquid pro between base of cooler & IHS because it has tendency of diffusing into surfaces, thus after some time cleaning it might mean sanding/lapping IHS down with loosing cpu's markings/pristine looks (thus maybe harder to resell). And compared to liquid ultra, pro might be a bit harder to apply. If you don't care about both, go ahead and feel free to use it.
Instead of just applying a small drop to the center of the die or underside of the IHS, you actually want to spread out the drop (very small) on both surfaces to a mirror like finish, then put the 2 together. In my case, I did the same for the top of the IHS (larger surface) and the bottom of my waterblock - hence all 4 surfaces. If you go to Colaboratory's web site, they have video's on how to do it. If you are using Pro, use a very tiny drop; a little goes a long ways.
OK, first let me say that since the 3770k was released I have been saying that Intel was the biggest douches for allowing such a poor excuse of a processor to be released!
Last week a buddy asked me to build him a new comp with this chip and then asked me to do this mod with the liquid Pro! I asked him was he out of his mind but figured why not.
Well slap me on the ass and call me Susan cause after I finishing his I drove to Micro center and bought myself one. Just finished this mod on MY new chip and its registering...what for it...42c max on Prime95 in asus suite and max core of 64c in Real Temp!!!
Before the mod: 98C Real Temp @ 4.7 GHz @ 1.29v, ambient 31C On Water
After the mod: 64c Real Temp @ 4.7 GHz @ 1.29v, ambient 31c On Water
34 DEGREES DROP!!!
I followed the above post and applied it on all four sides and intentionally left a extremely tint bit more on the center of both the IHS and the die and the top of the IHS and the block!
Thanks to all of you on the ground work on this!!! Now I'm off to push for 5.0 GHz.
And I still haven't changed my mind about Intel recent decisions!
IB works within specs and is better at stock frequencies, especially in laptops. Enthusiasts (probably <<10% from all IBs sold) simply expected more, but didn't make business case to fix things with TIM1 and if alternative would be rising for by $5 for all the IB owners due better TIM used .. i somewhat understand intel's choice. A bit hard to get such bashing and calling names for intel for it's business choice. It's not exactly end of the world, isn't it? :)
They do charge quite a premium for the K cpu's, maybe spend some of that on "better TIM" ?
Not THAT big of a premium (@newegg 30$ (though 3770 is a bit slower clocked too)), and very probably IHS is put on same line for all. If you sell tens of millions cpus, even meager 5$ saving is enormous. Anyway, yes, when heavily overclocking, IB's cheap/bad stock TIM1 takes its toll, but mod to replace it is simple/affordable enough for me to not care and not start holy wars on subject :)
Ivy Bridge being 22nm technology should run much cooler than my 45nm Phenom II, but in fact my 3570k runs much hotter. That's why I think that Ivy Bridge desktop package is defective. Maybe you enjoy doing mods, but most customers don't want to be unpaid repairmen.
Just reporting in....
I almost can't believe what I'm seeing.
Originally, 4.6Ghz at 1.275v was topping out at 90C yesterday, stock 3770K with a Raystorm and 27C ambient.
Did the following:
Lapped IHS first
Removed IHS
Cleaned IHS of black adhesive and old paste.
Lapped under side (only the rim where it contacted the green PCB)
Cleaned black adhesive off PCB and old paste off CPU.
Applied Liquid Pro to CPU and VERY thinly to underside of heatspreader (contact area only)
Clamped it down using the force of the socket to secure the IHS, and used PK-3 under Raystorm
The results? Same room temp, same OC.... it went from 90C to 63C!!! Thats unreal!! I expected not quite that drastic an improvement!! 2 of the cores haven't even left the 50s!! That was WELL worth the 20 minutes of "what did i just do to $330 bucks!?"
Seriously though.... this is a completely different processor now. I keep looking at my OC notes, seeing that 90C written down, and rechecking the voltage and speed to make sure I didn't change anything. :up:
ZeroOne is eight on! After the mod it really is a different chip! I'm still running Prime 95 @ 4.9GHz using 1.325v and the hottest core is at 59c!!
This is fricking unreal!!
If 5.0 puts me over 1.4v then I'm gonna leave it at 4.9 especially at these temps!
When I put the IHS back on, after removing the black stuff.... it was SO close, I couldn't tell if it was completely not-touching the green PCB. I wanted to take off the slightest layer to be sure the underside of the IHS was evenly touching the die with no interference whatsoever. It may not have been needed, but I felt better being able to see the light of day between the two before reinstalling.
Really?
I've done two 3770K's now and both had the heatspreader clearly resting on top of the die. Like i said earlier, both had the heatspreader "floating" on top of the die even though the gap between the heatspreader and the pcb is very small.
Your results speak for themselfs so maybe it was needed in your case. ;)
Its possible it wasn't needed. Just being overkill I guess. :) The gap you had between, could you see light through? It felt like it was floating on the die, but i wasn't 100% sure it was doing so evenly, all the way around. I don't have the sharpest finger nails to get that black stuff off either.
I haven't held the cpu against the light but i'm pretty sure there would have been a small ray of light coming through if i did.
Hey everyone. Just wanted to share my result from de-lidding my IHS off of my 3770K. I am currently running it @ 4.5 with 1.32v. using a corsair H100 watercooling unit. When running Linx temps got really hot. I wish I had of taken screenshots of before and after, but I did however write down the temps using coretemp.
So, after running 10 mins of Linx, my temps were as follows
Core0: 83
Core1: 97
Core2: 96
Core3: 90
also note, I was using MX-4 between the IHS, and the H100
After removing the IHS, and using Liquid Pro between the die, and the IHS, and the H100, running Linx for 10 mins using the same overclock and volts were as follows:
Core0: 55
Core1: 71
Core2: 75
Core3: 68
It actually averages almost 23 degrees cooler overall. I can't believe the difference. Anyways, I just wanted to post my findings. Now off to overclock this b****h! lmao
Ok I just finished a 22 hour Prime95 marathon @ 5.0Ghz!!
Max temp in Asus Suite 46c
Max temp in RealTemp 81c
Ambient temp 32c
All on Water!!!
I have now modded 8 chips for various friends (do at your own risk!!!:)) and ill just post the worse of those numbers.
Chip #6 (Costa Rica) @ 4.8Ghz
Max temp in Gigabyte 61c
Max temp in RealTemp 92c
Ambient unknown
Now for on my chip 5.1Ghz!
Again thanks to all posters on this thread!!!! Your Xtreme-ness makes me giddy!!!