I was about to post that; BikerKS doesn't sound like an end user at all :clap:Quote:
Originally Posted by massman
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I was about to post that; BikerKS doesn't sound like an end user at all :clap:Quote:
Originally Posted by massman
Found a Asus board that looks like A Lotes socket design.
Asus P7p55 Ws Supercomputer
http://forum.nexthardware.com/galler...T_COMPLRTO.jpg
Online warriors ?Quote:
stupid online warriors too.
Thanks for link !, I was wonder where can I buy it ? :shrug:Quote:
Originally Posted by Nelly
dg
raja is very well known and trusted in the scene and most manufacturers have worked with him or do work with him now... who are YOU if i may ask? whats your profession and what makes you think this is all made up?Quote:
Originally Posted by BikerKS
Many high credible peeps have reported this burn phenomena (Massman, SF3D and now Raju) when doing high overclocks that something really goes wrong... And yes these guys usually don't do 24 hour prime sessions just raw LN2 or Phase benching...Quote:
Originally Posted by BikerKS
There's a design flaw and their intention is NOT to bring a particular brand down, but to help the identify the problem. So it can be corrected before more end users(read overclockers) are being involved... :up:
And really 2 volts for a boxed cooler under stress, that's a video I would love to watch, even on youtube... :D
Plz don't act silly as you really are making a fool out of yaself... we got an issue here , just like it started with the Hyper rams ; believers and non believers at start... manufacturers withdrawing their products and so on...
The truth is out there, it's up to you if you want to see it : yes or no :shrug:
Seems like this nonsense is being posted because of a certain motherboard manufacturer that is using the socket rather then the socket itself.Quote:
Originally Posted by massman
yeah, all posts are GB centric from that user.Quote:
Originally Posted by Praz
fair enough, maybe we should ask staff to change the thread title to foxconn 1156 socket burn?
i dont know if anybody only reads the thread title, but if they do, they probably get the wrong idea...
this isnt a gb problem... well, until they confirmed they switched sockets it kinda is indirectly... but yeah, im sure you get what i mean.
the focus should be on 1156 socket, and maybe foxconn as well, not board makers...
If you don't have anything useful to say here, then be quiet and stay our of this topic.Quote:
Originally Posted by BikerKS
Make fun of some respected overclockers on this forum or trying to make them look like idiots isn't appreciated, so watch it.
Yes, because this is an online gaming MMORPG isnīt it?Quote:
Originally Posted by jmke
Oh, wait, no, this is Xtreme Systems. :shrug:
What's the difference? In MMORPG you need to increase experience points, on XS you need to increase posts.
//edit: fyi, above was not meant as a joke.
Itīs more like XS works for experience too. Posts mean nothing or they? :up:Quote:
Originally Posted by massman
Just to confirm, Iīve got ECS P55, ASRock P55 also and they donīt do very well contact. Just letting now since not many users try this brands here.
Regards.
Quote:
Originally Posted by saaya
He's sounds like he's involved in the design and is pee'd off that this thread has exposed some serious flaws.
Which one Asrock P55M or Pro ?Quote:
Originally Posted by Kain XS
Thanks,
dg
P55 Deluxe and P55H-A from ECS.Quote:
Originally Posted by powergiga08
Regards
But most p55 boards do use foxconn don't they?Quote:
Originally Posted by saaya
As for the problem itself, I have a few p55 boards available (foxconn) and I would gladly test and contribute to the topic but I am not ready to burn them all on my expense since my retailer will not RMA them 100% if they have physical damage visible
You could always try just mounting the CPU and checking the pin-pad contact. Other than that, you would be exposing it a little.Quote:
Originally Posted by kiwi
Haha holy crap, so are we actually going forward with the DIY LOTES socket now?
I mean I'm all about DIY, but this is probably the most nervous I would be. 2nd most would be bridge painting in 2002 lol.
raju,Quote:
Originally Posted by raju
Many thanks for this information, I wonder if anyone has the before and after pictures of the socket if it was changed? If there is a new version out, how do we spot it.
hello I'm worried that buying a evga ftw p55 and i5 750.
Fedex delivers Tomorrow I buy it at Amazon store.
Do if not do overclocking or sell parts in sealed box
Doc -Quote:
Originally Posted by dctokyo
Are you sure that's the LOTES Socket?
This is mine on my UD4P -
http://img195.imageshack.us/img195/162/img1366d.jpg
and it's a FOXCONN.
I think my eyes are going anyway.
Anyway. Whoever made the socket on my board did some piss poor work.
I rechecked it 3 times and it's all good on the clampage but I don't like that offset at all. I'm sending GIG a pic.
Hi chuck,
As I mention, looks like A Lotes socket design if you compare it to these pictures that Lathode very kindly posted here. LOTES Socket on top and FOXCONN below I think :shrug:
Maybe that is the new FOXCONN socket design?
http://home.comcast.net/~lathode/misc/lotes.jpg
http://home.comcast.net/~lathode/misc/foxconn.jpg
Quote:
Originally Posted by chuck4456
Hey, looks like the retention lever isnt sitting evenly on the IHS?
You can see it in the P7p55 picture a little too (notice indentation tabs is longer indicating its a different socket).
Heh I have a nice HD camera so you can see the contact burnout in full HD 1080P, I have the proper tools and I have the foxconn socket and an 860......Quote:
Originally Posted by raju
I would be more than happy to video my board catching on fire and give the rights to Anand. :D
I have not been given any real tech specifics on the change at all yet. If/when I find anything out I'll update here straight away..Quote:
Originally Posted by dctokyo
Ok my evga ftw if you say lots will have no problem help :shrug:Thanks
I know one thing if your socket is damaged/burned Asus for one will not replace/repair under their warranty, not sure about other motherboard manufacturers but it seems wrong if it's an actual defect of the foxconn retention plate.
Will Intel replace under warranty CPU damage? I doubt it because warranty doesnt cover overclocking.
All my pins are indented on my CPU so hopefully mine is fine but if anything happens to my CPU/Motherboard I will take up a case with Trading Standards Institute for selling defective hardware.
I wonder what the UK Goverment trading standards would say in regards to manufacturers selling defective motherboards that can cause damage to the board & CPU which breaches their warranty due to a defect of their own.
It's quite possible that TSI could force a full product recall here in the UK anyway . . . . . .
so what, the problem is the top frame of the socket not pushing the cpu down hard enough? 0_o
that doesnt make much sense to me... like somebody pointed out before, theres actually a plastic frame the cpu package sits on.
so it cant go lower no matter how much pressure you put on it... and even IF it could, why would the cpu have to be pushed lower for vss pins to make propper contact?
shouldnt they make contact at the same time/pressure as vcc pins? :confused:
and yes, most 1156 boards use the foxconn socket... i doubt other socket makers could actually produce enough sockets to replace foxconn sockets entirely...
but there should be enough sockets from other makers to replace foxconn sockets on highend boards?
You'd think so, but it is possible that there is some "warp" happening below the plastic frame the CPU sits on due to pressure applied by the retention bracket, heatsink and/or just from heat when it was all soldered together.Quote:
Originally Posted by saaya
I'm sure overclocking simply speeds up the process and this would happen anyway several years down the line. If it were to happen within the warranty of the board and chip while running stock would we get a replacement?
Stance from companies using Foxconn sockets is that there's no real problem. The tech dept's of some companies are putting it down to operator error/extreme OC (some are telling users they've never even had an issue..lol).
That being said, it is possible ASUS may move their P55 line up over to another socket vendor (they are looking at qualifying other sockets). The Foxconn sockets did pass Intel qualification back in June. So it's really a case of - are there sockets out there from pre June qualification that should not be, or is the overhead of the Foxconn socket limited by deisgn in comparison to those from LOTES or TYCO AMP?
I had a big conversation with one of DFI's tech guru's about this and he's as stumped about the cause as anyone (they've had a socket burn issue on their end too). Every reported case has happened under overclocked state so far. Until we get this happening at stock it's going to be difficult get answers from those in the know. The only way to test the sockets themselves would be to use tools that only Intel have access to (a transient load tester deisgned around the socket to measure the voltage drop via the socket).
I've got one Gigabyte board here using the Foxconn socket and it has not burned out under extreme OC, so it's still random I'm afraid.
regards
Raja
yeah but look at the vss pads... those are diagonal lines on the cpu package... so a warp wouldnt explain this...Quote:
Originally Posted by STEvil
and im not surprised the mainboard makers dont see this as a problem...
though id have thought that more than just dfi and evga would use another socket... if only for marketing... :D
but yeah, who knows if non foxconn sockets actually are better?
maybe testing on a grand scale would show that theres is the same chance getting this problem on a lotes socket... only time will tell...
What code have the burned foxconn sockets?
The p7p55d pro of my 2nd pc have FOXCONN 115XDBP 976
Hi!
In fact, I'm not worried about my P7P55D Deluxe, it does not intend to OC higher than 4.0GHz, simply because don't need all this clock.
Neither will use LN2 or others, to see if the material used in the socket FOXCONN resists temps very negative, etc...
What scares me so far, based on the facts reported, mainly in the XS, is the poor settlement of the CPU. That is, the contact between the pins of the socket and CPU. What causes small "sparks" and consequently the short-circuit and melt the socket, pins and CPU. This is very serious!
The reports noted that until now, speak over the 8XX series CPUs, perhaps because these are the most sought after by so inclined OC, really extremes.
With my combination of P7P55D Deluxe + i5 750, reports have not noticed yet ... but I'm watching.
I contacted Asus Brazil reporting the case, including informing this links (from XS, Anandtech etc) and asked for explanations when a possible RECALL, from Asus. They responded but, I thnk, which was sent over a "standard mail response" to all who ask about warranty of any Asus product that is not manufactured in the Brazil. How to uses warranty, when it's is possible etc.
No objective response on this case specifically.
Now, I contacting FOXCONN Brazil, to ask then about this issue... soon I post news.
This is mine "version" of FOXCONN socket:
http://img198.imageshack.us/img198/7027/img0475k.th.jpg http://img26.imageshack.us/img26/294/img0511ni.th.jpg
... and sorry my poor english, I'm an illiterate, almost.
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I noticed that the hold down plate used in Asus Maximus III is different from other Foxconn sockets:
http://img8.imageshack.us/img8/7723/asusfoxconn.jpg
Those bits that push cpu down are bigger and closer to the IHS.
Maybe it's a new revision or something?
edit: Looks like it's the same socket as on the P7PP WS photo posted by dctokyo, and only those 2 Asus motherboards use it - even Maximus III Gene and Sabertooth 55i share "standard" hold-down plate.
User here says he did this @ stock. Posts 1 & 15 are of interest.
http://forums.hardwarezone.com.sg/sh....php?t=2540820
Yes, is true.Quote:
Originally Posted by raju
But, again, it happened to a 860.
Maybe the 8xx's need much more energy, so these electrical contacts, perhaps because they were made with an cheaper material (we have seen dozens of cases of Chinese companies, and others, that lower costs, used cheap raw-material), are not supporting this load?
I'm not a expert, but I'm trying find what's the problem...
Today, send mail for Foxconn, and "all" ASUS (Europe, Asia etc)... Will see the responses.
Thanks!
Hi Raju,
You mention that you tested the Asus Maximus III and it had problems, after reading the post by Koen that I quoted here, would it be possible to post a picture of the socket of the Asus Maximus III or could you kindly look at the picture that I posted here of the P7PP WS and comfirm if the boards that you used have the socket in the P7PP WS picture? Many thanks again for your help into looking into the socket problems with the new P55 boards.
Quote:
I noticed that the hold down plate used in Asus Maximus III is different from other Foxconn sockets:
Those bits that push cpu down are bigger and closer to the IHS.
Maybe it's a new revision or something?
edit: Looks like it's the same socket as on the P7PP WS photo posted by dctokyo, and only those 2 Asus motherboards use it - even Maximus III Gene and Sabertooth 55i share "standard" hold-down plate.
Here's the board that suffered a burnout; it uses the regular Foxconn top plate.
http://img194.imageshack.us/img194/9836/asusrogsock.jpg
Hi Koen,Quote:
Originally Posted by Koen
It looks like you might have the new version after looking at the picture raju posted here. I really wanted to get the board.
Would you have any marking on the retail box that you could share with me in a IM? As it would help me to look for the type that you have.
Also, look at the location of the "CPU Level Up" print, different location. Different versions of the board?
Many many thanks raju, after looking at that picture and the one Koen posted, it looks like Asus have changed the socket version, now the problem is, does the new version fix the problem of the pins making contact?Quote:
Originally Posted by raju
I got a brand new P7P55D with Foxconn socket yesterday. I mounted the CPU in the socket and then umounted it and checked the pads. All of them had the same scratch marks in the middle from the pins making contact. So, my board does not seem to have any, or atleast not any severe, contact issues.
My buddy bought the same board and did the same test and his socket also seems okay.
Unfortunately, I forgot to take a picture of the socket before mounting the cooler. I'll probably be taking it off next week, though, so I can return with a picture then, if anyone's interested.
This dropped in the mailbox today from Foxconn. We'd been asking Gigabyte UK about the issue with the Foxconn sockets and they apparently weren't aware of it, so they wrote to Foxconn and this is what they replied.
http://www.images.clunk.org.uk/artic...ity-letter.png
Unfortunately I don't have this board. The picture I posted comes from this bit-tech article. It might be that raju's board is the production version and the one I posted is some prototype. You can also see that ram slot colours are in different order and there are some white stripes under mosfets.Quote:
Originally Posted by dctokyo
Can you ask him if this is a Foxconn or TYCO AMP socket George?
Just wondering if heavier heatsinks somehow causes the boards, cpu plate, etc., to wrap a little. These wrapping (even though small) coupled with overclocking might be pushing the contacts to the limit, the spacing of which appears to be smaller on the 1156 based CPUs.
EDIT: My theory is easily disproved though if the same socket burn occurs on a water cooled 1156 based CPU.
You do understand the CPU sits on top of the bottom plastic of the socket, it is impossible to make it sit lower, unless you use a hammer, so a heat sinks weight is not the problem.Quote:
Originally Posted by cyclo
Unless the plastic bends, of course?
those ftw burn marks seem to have happened on a different part of the socket... is that still vcore?
If the socket was not pressing the CPU tight enough and there is an unequal pressure brought to bear by the HSF on the CPU which is heavy on the bottom/south side of the CPU, light on the top side (I am thinking of the big tower type HSFs with vertical heat pipes), then it is possible that there might be "less contact" on the top part of the CPU. "Less contact" in this case might mean a small gap might even be forming towards the top part of the CPU/Pins compared to the bottom part which under pressure.Quote:
Originally Posted by dctokyo
The scenario I am describing is the result of a combination of factors including, the tighter spacings (and tolerances) of the pins on the new CPUs, the "loose fitting" Foxcon sockets, and top heavy HSFs that overclockers are using to cool the CPU. Note that most of these arc burns appear on the pins on the upper end of the CPU.
Again I am just throwing out my 2 cents here based on observations of pictures I have seen on this thread and in the Anandtech article.
So, I took some MACRO HIRES pics from socket, just to observe yours details.
Front and back plate:
http://img198.imageshack.us/img198/7027/img0475k.th.jpg http://img26.imageshack.us/img26/294/img0511ni.th.jpg
All views:
http://img198.imageshack.us/img198/693/img0478xy.th.jpg http://img16.imageshack.us/img16/7922/img0490hz.th.jpg
http://img196.imageshack.us/img196/5...g0487az.th.jpg http://img5.imageshack.us/img5/7081/img0485ep.th.jpg
http://img5.imageshack.us/img5/8522/img0484zm.th.jpg http://img12.imageshack.us/img12/3767/img0483qp.th.jpg
http://img196.imageshack.us/img196/7497/img0482n.th.jpg http://img30.imageshack.us/img30/6940/img0481m.th.jpg
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Very interesting, I understand what your saying, just wish we had more details on the setup`sQuote:
Originally Posted by cyclo
So apart from the original author of this thread & Raja, has anyone else suffered socket burn on their setup? If so has your motherboard manufacturer accepted RMA & replaced your board? same goes for your Intel CPU?
When you get hardware for free it doesn't really effect financially does it? :yepp:
There are a couple of consumer burnouts linked over the last few pages of this thread (you must've missed them).
Just some more thoughts here as I know the plastic injection molding process that is used to make the plastic housing is a complete crap. These are out sourced to the lowest bidder who just don't care and will speed them up causing warp and other issues. It could also be a tool & die issue where one side just wasn't made the same. A lot going on here.
If its a clamping pressure issue as they are saying. I think once we mount our heat sink it would eliminate this issue. Hell half of us tighten down the sink till it warps the motherboard. I'm sure that's more pressure than any clamp would exert.
so if that's my theory than the only alternative would be something is limiting the downward movement of the cpu in the socket. The only thing that might cause a issue of downward movement might be a broke detail or maybe the socket isn't so level on the flat surface that the bottom of the cpu sits causing unevenness.
Someone needs to set their cpu in the socket apply pressure and see if it sits level no high sides or rocks back and forth someone may have to rip the black piece from the board to check it properly.
New upcoming models(USB 3.0,SATA 3,SLI or CrossFireX) P55A (EX58A?) coming with LOTES socket.:up:
http://www.xtremesystems.org/forums/...&postcount=174
Also could this be a hardware design problem?
The LGA 1156 Socket has only 66% of the current capacity of the LGA 1366 Socket.......because it only has 175 VCC pins instead of over 250 VCC pins on the LGA 1366........... therefore each of the VCC pins on the LGA 1156 carries more of load then the LGA 1366 socket.
In terms of absolute maximum current handling and assuming similar pin/pad strutcure, yes 1366 has more current capacity than socket 1156.Quote:
Originally Posted by dctokyo
Trouble is that some of these burnouts have taken place under the load of a single thread of super pi 32M. Bear in mind that at 5GHz and the CPU IHS around -100, power draw is no more than 50-60w to VCC.
later
Raja
Lol @ me for being an early adopter. Updated USB3.0/SATA spec, and to add insult to injury, LOTES socket (and no more Foxconn). I thought I could avoid the revision game by avoiding Asus, but I just re-entered it with my first Gigabyte purchase.Quote:
Originally Posted by stasio
Hello all,
I have ordered just last weak a new Intel i5 and Asus P7P55D. And then I read article about burned processors and motherboards on 1156 Foxconn chipsets.
What should I do? I don't have in plan to overclock processor but still as people say it can happen once. And no warranty will be there.
Do you think it will work since I won't overclock a processor?
Thank you.
Safaxs
http://img4.imageshack.us/img4/8081/s6302673.jpg
http://img4.imageshack.us/img4/238/s6302674.jpg
http://img689.imageshack.us/img689/7053/s6302675.jpg
Yeah, (swear bypass removed - STEvil) onn rulz!! :rofl::rofl::rofl:
That pictures are from a customer's new ride, what a shame.
It's shame,but for FOXCONN.:rolleyes:Quote:
Originally Posted by TOOL_CHILE
Hello everyone,
I just got my new Asus P7P55D and i5 so please tell me what do you think:
http://www.shrani.si/f/1K/7D/27XS5vcc/pini.jpg
The red area does not have a contact in my opinion.
There's nothing wrong with either of you guys' CPU's.
Well I uninstalled the CPU today on my Gigabyte UD5 to check and for me all pins made contact. Damn it sux checking through all those small 1156 pins ("I see pins!" O_o). :)
But then I've been having another issue tho, random reboots without any bsod despite memtest, and linx are fine and OCCT PSU stress test and also tried with my old TT 750W PSU without luck but then I started suspecting my Samsung F3 hdd incompability as that's a very new device for me and swapped from the intel ICH to gigabyte GSATA ports and at least for 3~4hrs straight it's been able to play games without a reboot.
I did suspect the Foxconn socket issue at first but all pins made contact and don't find any burnt pins etc either.
Any chance they could update the original p55 ud3r with the lotes socket? While the P55A version has nice features, I don't want to spend extra on something that hardware doesn't exist for yetQuote:
Originally Posted by stasio
Well critical "kernel-power" issue random reboot issue still persists making me think it has to be the mobo (already ruled out PSU by testing with my old TT 750W PSU and memtest doesn't report any probs when running it over the night so it can't be ram, it could possibly be CPU that's taken a toll by the 1.4v vcore but I'm 70% sure it's a mobo issue) with all the foxconn socket failures around I wouldn't be suprised if this is the issue for me too but then again at least the pins looked all ok for me and made contact etc.
Would I have known the trouble this would follow I had definitely went i7-920 route instead. :down:
So which mobos aren't using the foxconn socket except for EVGA?
EDIT: BTW, I wonder if some1 with a Gigabyte P55 can mention what the CPU-Z reads for vcore contra what's set as BIOS value, I think I may have a similiar problem as http://www.tomshardware.com/reviews/...d,2436-15.html For me there's quite a difference between what's set in BIOS and what cpu-z reads and becomes bigger the higher I go, at say 1.44 - 1.45v bios set, it reads 1.408v in CPU-Z at idle but only 1.36v during load at "standard" LCC setting? That can't be right? The random reboots when playing happens also at stock settings now but I think it may happen more rarely.
But then I don't know why I'm able to run for example LinX or OCCT without getting any reboots, only when playing games.
http://img204.imageshack.us/img204/3...itytest.th.jpg
Any1?
EDIT: OMG this drives me crazy with all the restarts for no reason, prolly gonna dump p55 and buy a proper i7 setup, ie X58.
Just make sure you are pushing with the right pressure on the top of the socket.
1) too much pressure is not good
2) asymetrical pressure is not good.
3) not enough pressue is not good.
For those who remove the bottom metallic plate, make sure the board does not bend.
If you pay attention to all of this, there is no problem at all, with Thermal dummy CPUs, this socket can work up to 2V without issues. (Just don't play stupid on the voltage ... )
For those who like it very technical: http://download.intel.com/design/pro...nex/322167.pdf (Page 13, and 32)
Francois
Gigabyte engineers told us the early socket models had a bad mix of plastic composites, that couldn't resist to the heat... it has been fixed... it was a bad batch , problem has been recitifed... move on... there's far too much speculation and theories floating around...
so the problem was the plastic? 0_o i find that hard to believe...
if plastic inside a -100C socket melts, then its not a problem of the plastic melting too quickly, its def a problem of the pins getting too hot...
Talk to Hicookie then, this is what we officially got at the Giga event as explenation for this... you don't have to believe me... there was a bad batch of sockets, which tended to deform slightly under heat/cold and massive Vcore use : this leading to bad contacts : even more heat generated. End result : finally socket burn... and damaged CPU's
How many in here complaining about bad contacts have ended up with burned sockets ?
This is a snowball effect in action here. The same with VTT in few years back...
One starts a respectable theory and then suddenly everyone looks at their cpu's sees "bad" contacts and want an RMA... lol ...
I'd be more re-assured if there was an updated revision, something, anything that would guarantee that these problems do not arise again. Saying that it was a bad batch and that "it was rectified" isn't giving me an inch of confidence in Gigabyte. I bought my board at Newegg (late Sept) and considering they're one of the biggest retailers, who knows how many stock in their warehouses were "bad batch" and which ones were "rectified".
More likely Windows 7 mysterious reboot problems..Quote:
Originally Posted by RPGWiZaRD
Could be drivers like chipset, audio, GPU etc..
Powersuply problems like bad contact, rail issues..
Incompability software..
Me too but dont wanna buy "antic" x58 stuff :ROTF: X58 need new mobos and cpuīs like 32nm quads or this i7 930 (Got i5 750 & UD3R combo.. awesome price/performance ratio.. With this system it's good to wait something new and better :))Quote:
Originally Posted by RPGWiZaRD
Doesn't that make sense?Quote:
Originally Posted by saaya
Pins are attached to socket plastic; pins get hot and heat up plastic. Plastic can't hold heat and melts.
My problem is as follows:Quote:
Originally Posted by Migi06
Randomly will restart when I'm about to login to Windows without any warning/BSOD or when playing games (well I have only played UT3 and Borderlands lately basicly and it happens for both of them), sometimes I can play for 1 - 2hrs and sometimes it restarts 3 times in 1hr. No minidumps received but evenlog reports "critical" issues: "Kernel-power" Event ID 41, and basicly means unexpected powerloss or something like that.
Well here's everything I've tried:
- Running Windows XP [no change]
- Reinstall of Windows 7 due to I used a vlited Win 7 copy before [no change]
- Reverted to default BIOS settings + some increased vcore to ~1.265v and 1.2v VTT to make sure it's not a degraded CPU [no change]
- Swapped PSU to my backup Thermaltake ToughPower 750W [no change]
- Stability testing; OCCT PSU tester, LinX, MemTest [OK]
- Temperatures are fine, not using a comp case, CPU @ 1.4v: 55~59C typical for gaming, 68~72C in LinX, GPU @ 60~75C depending on game (fan @ 61%), mobo sth like 32C.
- Tried different drivers for GPU, NIC and audio card [no change]
- Removed CPU to check for burnt pins or bad contact => no burnt pins and all pins seemed to made contact (my eyes after systematicly checking 1156 pins O_o).
However since it happens mostly when playing UE3 based games I think it's most likely a GPU failure, if it was bad contact or mobo voltage regulation issue of some kind it would more than likely cause errors in stability tests as well. The funny or should I say unlucky thing is that when I tried to give my backup card 8800GT a try then ofc the thing freezes in UT3 after a few mins and basicly broke as after the restart I had white dots all over the bootup dos screens and Windows 7 won't install drivers for it cause it says the device is not workign properly and now it doesn't even boot into Windows with it, damnit! :mad:
Then the only other gfx card I have here is an old 6800GT and playing UT3 is NOT funny with a 6800GT and a i7-860 with very stuttering gameplay at 640x480 and lowest quality (7 ~ 30 FPS) but it's like a video that swaps between slowmotion and fast-forward mode, so it's really a pain to even whitstand running some test sessions for say 3hrs to see if it's not rebooting. However with this card it doesn't ever seem to fail at login, I've already made like 10 successful logins in a row.
How common would it be to recieve such issue (kernel-power) of a gfx card though? This EVGA GTX 260 SC 55nm is not following standard design AFAIK so it's more likely to happen IMO. In fact I managed to find another user with a EVGA GTX 260 SC that's got this "kernel-power" issue as well but for him it also can happen while browsing web and there were no reports if issue got fixed and how he fixed it in the thread.
Just dunno if I should buy a new GPU right now or wait for 8800GT RMA to be completed which prolly will take more than a week.
makes a lot of sense to me =oQuote:
Originally Posted by massman
problem solved i guess
In my case it turns out to be GPU clock instability lol. I've run these clocks at over 6 months perfectly stable and then suddenly it starts rebooting at them? Normally I would expect seeing artifacts or bsods if GPU overclock stability degrades, not getting random reboots without any warning and "kernel-power" issues. I ran UT3 for like 4hrs without a prob already at standard clocks which hasn't been possible the last 1― weeks.
safaxs, how did you checked the contact between both parts?
Yes there was a problem with the manufacturing of these sockets but I don't believe it's exactly what they are saying. Look at the socket and exactly how the pins make contact. If you notice all the contacts around the outside of the cpu socket point inwards, leaving the only way to make contact for the outside edge to be made by the little straight piece of contact that moves and raises to contact the cpu right next to the angled pins(this is what puts the dents in the bottom of the cpu not the angled fingers). I marked a pic with red on the pins that I am talking about. If it was as they are saying that after the cpu heats up the plastic is warping, making the angled fingers loose contact then there would not be any issues before the combo is even ran pins would all make contact and then start loosing contact as the parts heated and warped. Don't settle for the answers they are giving us at this point and time.
The good news is that the new P55A series from Gigabyte has LOTES socket. Let's freeze them :D!
So after doing a lot of looking at the pics I have a few questions that you guy's will be able to investigate. I attached another pic and marked areas of concern. The area that is marked you can see little impressions where the ejector pins of the tool that produced the socket are sunk into the part. (pins are to long or the part was ran to fast causing the pins to push into the part and this would cause distorted/warped sockets) When this happens ejector pin flash is not far behind. Any flash in this area would cause the cpu not to sit properly flat in the socket making it harder for the pins to make contact. I can see flash on the top left but I'm not sure how close the cpu is to the these pins (top left and right)
After big delay, last friday received my Core i5 750.
To be sure that nothing was wrong, before I did a contact test between pins and CPU socket. I fit it with my water Block, for few hours.
I dismantled them and made these pictures HIRES in MACRO.
Notice the circled areas, which are the marks mess electrical contact...
http://img4.imageshack.us/img4/2678/img0654xd.th.jpg
http://img4.imageshack.us/img4/7504/img0653mm.th.jpg http://img4.imageshack.us/img4/619/img0661f.th.jpg http://img4.imageshack.us/img4/3709/img0659tk.th.jpg http://img4.imageshack.us/img4/4978/img0660oz.th.jpg http://img4.imageshack.us/img4/2835/img0658n.th.jpg
Well, I am now terrified!
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Did you also talke pictures before you had fitted the CPU ? were there no marks on it already ? or doesn't Intel pretest these CPU's beforehand... c'mon lads move on... The issue has been discovered and analysed, with thanks to Massman, SF3D and Raju. It should be corrected in the current range of mobo's...
No, I didn't.Quote:
Originally Posted by Leeghoofd
But, I have had dozens of Intel CPU (775, 1366) and don't saw this marks before. If Pretest or not, I don't know. But no marks are visualized before.
By the way, double marks in contacts, is not caused by two pins contacting the same electrical contact into CPU, like a afraid. It makes when the pins is bended over fit pressure (probably).
I "discover" it right now, because a tooke some HIRES MACRO pics of older PentiumD 915 and Pentium4 531, both 775. And in this are the same marks (double contact) and also, NO CONTACT MARKS IN SOME CPU CONTACTS...
(I will upload this pics ans post here latter)
But these CPU is perfect working for many years... any troubel is detected...
Well, I've more confused now....
P.S.: sorry my poor, very poor english...
Doesn't really suprise me. I reckon Intel adds more VCC pads than the bare minimum just as a safety precaution.Quote:
Originally Posted by So_BAD
Ah, ok. Understand.Quote:
Originally Posted by massman
As said:
Pentium 4 531
http://img25.imageshack.us/img25/699...ium5314.th.jpg http://img25.imageshack.us/img25/895...ium5313.th.jpg http://img25.imageshack.us/img25/334...ium5316.th.jpg http://img25.imageshack.us/img25/138...ium5315.th.jpg http://img25.imageshack.us/img25/970...ium5317.th.jpg
Pentium D 915
http://img25.imageshack.us/img25/359...umd9153.th.jpg http://img25.imageshack.us/img25/969...umd9154.th.jpg http://img25.imageshack.us/img25/677...umd9155.th.jpg http://img682.imageshack.us/img682/1...umd9157.th.jpg
No, you're looking at the wrong marks. The highly visible marks are not caused by insertion in the socket, those are there from the factory. If you look closer at your own pictures, you can see faint dark spots in the middle of most of the pads on your CPU. Those are the marks that your socket has made.Quote:
Originally Posted by So_BAD
There is no way for the pins in the socket to cause the sharp marks that some of you seem to be looking for.
You is 100% right!Quote:
Originally Posted by Mikael
I "paint" with permanet pen (pen to write in DVD's) some CPU electrical contacts and remount. When dismantled it, there is marks, exacly you told.
Good job, Mikael :up: !
Well, return to zero point of my observations... and more frustade. Tomorrow I will UP the system, will see!
By the way, I make contact with LOTES headquarter, talking about this socket 1156 issue. Me and some friends want to buy some complete LOTES LGA 1156 socket (PN: ACA-ZIF-082-K01), to replace Foxconn. Ms. Hellen Chen, tell me that they haven't a officer in Brazil. So they couldn't sale any parts here. See below.
But they others sales representative officers, in Asia, Europe and USA. If we could buy a hundred of units, its solve the problem of many people, with the same afraid.
Someone would contact they, to talking about this issue?
Quote:
De: Hellen Chen <sa11@lotes.com.cn>
Para: Marcelo Gomes <sobad_br2@...>
Enviadas: Segunda-feira, 2 de Novembro de 2009 4:59:12
Assunto: RE: Socket 1156 Issue
Hi, Marcelo,
Thanks for your e-mail. We don't have any sales representative in Brazil
For our business model, we will not direct business to end -user or retailers. Please contact the motherboard maker or shop for the replacement.
Should you have any questions, please let us know.
Thanks & Regards,
Hellen Chen
Marketing & Sales Dept.
Lotes Guangzhou Co., Ltd.
DID: 86-20-8468 6190
Fax: 86-20-8468 2478
E-mail: sa11@lotes.com.cn
Website: www.lotes.cc
Maybe togheter we could help us.
Thanks!!
No problem. :)Quote:
Originally Posted by So_BAD
The problem is that the socket can't just be replaced. All of those 1156 pins in the socket are connected to the motherboard, probably through a ball grid array or similar. Removing the socket from the board would require heating the socket and board so that the solder points melt. You'd then need to restore the balls before putting on the new socket and once again heating it all up.Quote:
Originally Posted by So_BAD
This process is very delicate and cannot be done without expensive machinery. Simply put, it needs to be done at a PCB assembly house. The problem is that it would be expensive and I doubt anyone would even take on such a job. Besides, the likelyhood of failure (i.e. destroying the board in the process) is high.
So, unfortunately, the best solution is to simply get a board with a LOTES socket already on there.
2 weeks ago I got a P55-UD3R.
Same exact issue.
I ran it with an i5 750 at 4GHz (20x200), now it is no longer stable at that frequency. Can't run it at anything higher than 160x20... It also won't recognize all ram (sees 2GB out of 4).
At least it still (kind of) works.
and your issue is directly related to the socket you think ? What did you test ?
First case I discovered at pcghx.de: http://extreme.pcgameshardware.de/ko...ml#post1258061
Settings used: 4.3 GHz, 1.43 V Vcore, 1.25 V IMC @ Prime (water-cooled)
According to the user he switched to 4.6 GHz and then BIOS/CPU-Z-detection went wrong. Then he looked at the bottom side of the CPU:
Pic 1
Pic 2
Edit: Mainboard = Asus Maximus III Formula
I can't say that that this is the issue with complete confidence.Quote:
Originally Posted by Leeghoofd
What I can say is that the board worked overclocked for two weeks no problem, Prime95 stable and was able to pass 10 iterations of intel burn test on a high setting. Then one random day I get BSODs out of nowhere, and the motherboard will no longer recognize all RAM. Thinking that my RAM has gone bad, I try a few other sticks, but I have the same issue. Flashing the BIOS to the newest beta one doesn't help.
So I do a google search on why it wouldn't recognize all my memory. I find a few P55 threads saying that the pins on the socket might be bent. So I take off my heatsink and the CPU and what do I find... Warped pins. I can't take any pics since I don't have a camera, but some of the pics in this thread seem awfully close to what I saw.
Lotes.
I think this is far from over yet. Question is what is really causing this now.....1156 power design? Faulty cpus? or intels 1156 socket spec?
http://www.ocforums.com/showthread.p...63#post6295863
Note: some companies used the Lotes holddown, but Foxconn socket.
Thought EVGA p55 FTW was strictly Lotes?Quote:
Originally Posted by massman
Here is my guranteed 100% foxcon.
http://chew.ln2cooling.com/I7%20860/IMG_1737.JPG
And here's the one on this particular board in above post.
http://chew.ln2cooling.com/qdig-file..._DSC01065a.jpg
Note: The molds are completely different.
Crap, I had a sneaking suspicion that this might come up. Now what? Ahhhhh
Ehh, I would not take that screenshot I posted as an end all........Quote:
Originally Posted by Mav451
The location of the burn is rather "interesting" to say the least as it differ from all the others.
Yeah I noticed the molding is different. Even still, people put tons of voltage in C2D (s775) and PhenomII's (AM2+/AM3) - I don't remember hearing a single burn story on the scale we are seeing from this new socket. The different location could be different...vulnerabilities? I dunno. I don't know the native language of that original link.