Thuban delidded

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Originally Posted by BeepBeep2

I could maybe see eight squeezed in there. The die could definately get a little wider...Or maybe a small boost in L2 or L3. ? maybe I speak nonsense because there is no spoon. Who knows? :D

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Matrix fan :p:

Anyone ever try to use that freeze spray to freeze the glue around the IHS? I've managed to shatter rubbing insulation with that stuff before, might aid in the removal of the heatspreader.

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Originally Posted by apt403

Anyone ever try to use that freeze spray to freeze the glue around the IHS? I've managed to shatter rubbing insulation with that stuff before, might aid in the removal of the heatspreader.

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Or dip the chip in LN2? :)

I had to :ROTF:

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Originally Posted by apt403

Anyone ever try to use that freeze spray to freeze the glue around the IHS? I've managed to shatter rubbing insulation with that stuff before, might aid in the removal of the heatspreader.

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Originally Posted by BeepBeep2

Or dip the chip in LN2? :)

I had to :ROTF:

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So the experiments continue but i already know the answer to this one, theres a reason that other deneb core cracked ;)

Ln2 dipping test take 10.


Right after defrosting

http://chew.ln2cooling.com/890FXA-UD...0delid%207.jpg

Wiped mosture off.

http://chew.ln2cooling.com/890FXA-UD...0delid%208.jpg

http://chew.ln2cooling.com/890FXA-UD...0delid%209.jpg

http://chew.ln2cooling.com/qdig-file...delid%2010.jpg

looks very bad :/

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Originally Posted by FatAlbert

looks very bad :/

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yah looks like cores preety fragile. I wouldn't reccomend LN2 dipping to remove IHS, core will crack in 8 places :rofl::ROTF:

:rofl:

hmm wonder what it looks like under there ;)

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Originally Posted by crazydiamond

hmm wonder what it looks like under there ;)

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ahh shall i tear apart silicon now? Why not.

Dead chips aren't useless. I found out F3 Windsors were soldered that way:D

Are Regor chips soldered too, btw?

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Originally Posted by knopflerbruce

Dead chips aren't useless. I found out F3 Windsors were soldered that way:D

Are Regor chips soldered too, btw?

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I believe since all chips are native denebs for he most part now the answer is yes.

So on to the photo shoot. I might actually break out my macro lens if i can find it.

Lets see what i can pull off without the macro lens with my point and shoot however.

Dialing in zoom white balance is not correct yet.

http://chew.ln2cooling.com/thuban/th...delid%2012.jpg


Lets try a smaller piece.

http://chew.ln2cooling.com/thuban/th...delid%2011.jpg

even smaller

http://chew.ln2cooling.com/thuban/th...delid%2013.jpg

Tad to much white balance.

http://chew.ln2cooling.com/thuban/th...delid%2014.jpg

There's the money shot :)

http://chew.ln2cooling.com/thuban/good%20shot%20.jpg

Ah, those just came out... you heartless murderer, killing babies like that....! They're only kids... KIDS! http://forums.extremeoverclocking.co...s/azcrying.gif

So much eager life lost.... :mad:


:p:

Holy :banana::banana::banana::banana:. that is scary. It feels like I'm looking at something that I'm not supposed to.

that last shot is just awesome! thanks!

awesome chew, last shot is really epic :) looks cool. a worthy sacrefice for sure!

Cool :banana::banana::banana::banana: chew* so what about heating and rapidly cooling?

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Originally Posted by cdawall

Cool :banana::banana::banana::banana: chew* so what about heating and rapidly cooling?

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I imagine it would make it worse.

If anything you would want to slow down the cooling/warming process so everything has time to adjust.

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Originally Posted by chew*

cores are fragile and easily cracked?

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YES!

it's basically glass. i can teach you how to do die deprocessing if you would like. ive done it on some chips.

edit: too late :(

you can further process the metal layers.

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Originally Posted by Chumbucket843

YES!

it's basically glass. i can teach you how to do die deprocessing if you would like. ive done it on some chips.

edit: too late :(

you can further process the metal layers.

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I have another dead deneb here that it can be tried on but from my experience they have a lot harder core.

I just pounded one into oblivion earlier.

I couldn't even get as close to a clean die shot as i was able to with thuban.

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Originally Posted by chew*

I imagine it would make it worse.

If anything you would want to slow down the cooling/warming process so everything has time to adjust.

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makes sense i guess the blow torch method for taking apart lga775 chips is a no go?

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Originally Posted by cdawall

makes sense i guess the blow torch method for taking apart lga775 chips is a no go?

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well even if blowtorched, cutting the IHS seal is near impossible withoutnicking smd's. Add the fact that the core is fragile ( like 50% more fragile than deneb )chances are core will crush even if delid is sucessfull.

i have never tried using LN2 to remove the die so idk if it's a good idea. you can use a blow torch to melt the solder bumps that connect the die to the pins or you can sand through it. i think the fumes when you do this are toxic so be careful. do it in a fumehood or outside b/c it stinks.also i have not deprocessed a cpu past p4 so i cant help get off the IHS on newer cpu's.

after this you need to do is epoxy the die to a hard flat surface then sand it with 2000 grit sandpaper. before you try doing it to cpu's practice sanding skills on DRAM's. it isnt going to be perfect because humans cant sand down with 1 micron of accuracy. a good way to test how well you are sanding is by how many levels you have exposed at once. if you are 3 or over be careful. look out for cracking. this will be your number one enemy because it will only get worse and bigger die are more prone.

i'm kind of confused with what happened to your thuban. it looks like you ripped the bottom silicon layer of the wafer off and the transistors and metal layers stayed soldered onto the packaging.

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Originally Posted by chew*

well even if blowtorched, cutting the IHS seal is near impossible withoutnicking smd's. Add the fact that the core is fragile ( like 50% more fragile than deneb )chances are core will crush even if delid is sucessfull.

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i guess your right sanding down would work best. have you tested to see if there is large temp difference with a heavy lap vs none? and have you sucessfully sanded through a IHS yet?

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Originally Posted by Chumbucket843

i have never tried using LN2 to remove the die so idk if it's a good idea. you can use a blow torch to melt the solder bumps that connect the die to the pins or you can sand through it. i think the fumes when you do this are toxic so be careful. do it in a fumehood or outside b/c it stinks.also i have not deprocessed a cpu past p4 so i cant help get off the IHS on newer cpu's.

after this you need to do is epoxy the die to a hard flat surface then sand it with 2000 grit sandpaper. before you try doing it to cpu's practice sanding skills on DRAM's. it isnt going to be perfect because humans cant sand down with 1 micron of accuracy. a good way to test how well you are sanding is by how many levels you have exposed at once. if you are 3 or over be careful. look out for cracking. this will be your number one enemy because it will only get worse and bigger die are more prone.

i'm kind of confused with what happened to your thuban. it looks like you ripped the bottom silicon layer of the wafer off and the transistors and metal layers stayed soldered onto the packaging.

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I'm not confused. I hit it with the ban hammer 10 times for dying on me.

What you see is what was left after 10 blows with a 10lb hammer.

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Originally Posted by chew*

I'm not confused. I hit it with the ban hammer 10 times for dying on me.

What you see is what was left after 10 blows with a 10lb hammer.

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well its obvious to me you have no idea what you are doing :rofl: