Originally Posted by
dave_graham
ok, just to cut the crap in this mess.
here's the steppings list:
A0/A1 - not relevant
B0 - early DVT. these were simply to qual the platform, not much more. obviously that's also done at the A1 level, but, this was less of such. Some early benchmarks made use of this.
B1 - late DVT, sent to partners for final config and platform testing. Also the steppings used for the catastrophe that was AMD marketing. Contains several errata, most notably 281 which was a northbridge error that impacted Stream, FPU, Int performance. Required a BIOS workaround.
BA - production release stepping. resolved errata 281 in silicon and is shipping for profit in Q3. Partner release only (essentially) as it will be superceded by B2 stepping in Q4.
B2 - production release for high speed SE and 95w parts for Q4. Will be announced in November with revenue shipping and availability either at the end of Q4 or beginning of Q1. will supercede ALL part codes that utilize BA stepping. fixes more noted errata.
B3 - as yet unannounced stepping release probably coinciding with Shanghai release (if on schedule next year). if it is the Shanghai refresh, will contain min. 6mb L3 and mask improvements along with further RAS refinements. supposedly partners are receiving early silicon of this as well, but i'd state it'd probably be early fab. spins for compat. purposes.
hope that clears things up and puts this whole issue to bed.
dave