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This is interesting as heck! I cant wait to get time to play with the E6600 I have been running on D7 since the 4-5-08! that would be 3 weeks come tuesday and from the looks of it I will start my testing/playing that afternoon. :) I will make note of all load temps before I start. I cant remember exactly what temps were before I took the chip and board to the barn but I can tell you I was happy because temps dropped 2 or 3 degree :D
This ought to be interesting...waiting for Riptide. :D :ROTF:Quote:
Originally Posted by littleowl
well I am not going to tell him to come and make fun of me :rofl: :rofl:Quote:
Originally Posted by SiGfever
We are all learning a lot from this. Your viewpoint has taught me a few things and led to good improvements, particularly my mount performance consistency. The pea glob is my friend....:rofl:Quote:
Originally Posted by tastymannatees
High res of the D7 pic you used above will be in your email shortly.
I also think your suggestion on the center contact not allowing the TRUE heat pipes to be optimum makes sense too. I'll be interested to see what happens when I use your edge lap suggestion.
I've learned a few things from my teammates here too. Good stuff folks! :up:
So, like the best of scientific collaboration, we all win from this. We couldn't ask for more than that...:up:
Regards,
Bob
Another impression from Anandtech. Insidious ran 3 impressions- increased pressure, lapped sink, lapped IHS
http://home.comcast.net/~swright38/lapresult.pdf
Quote:
Originally Posted by tastymannatees
hum thats funny. you look at the impressions and he will be using D7 to make a full gap between his heat spreader and heat sink.
Yeah, well I found out from the forum testing that the pea size was best for most users and now from the forum testing I can say pretty much why.Quote:
Originally Posted by 123bob
One the quintessential questions on universally all forums is "how much paste do I use"? and everybody throws out a different method and amount.
I think the question can now be answered as far as amount - It Depends :)
If you have a lapped IHS and sink you can use 1/2 a pea size and it will work fine. because you have fewer valley's and voids to fill.
If you have a sink and IHS with lots of irregularities, depressions, voids, Valley's you need a pea size to fill those gaps. I am being the master of the obvious here which is pretty much what thermal compound is intended for.
The fine tuning is really up to the individual.
Fantastic stuff! being able to put spotlight on this certainly has helped me considerably. Thanks again for the time and effort/ great job all
My films will be in the mail tomorrow.
A different kind of print but kind of the same as 123bob's CPU: Intel Q6600 (B3)
HSF: Kingwin RVT-12025
http://www.ocforums.com/showthread.php?t=555270&page=4
lol, when I talk to my wife her eyes glaze over and roll back in her headQuote:
Originally Posted by littleowl
that depends on what grit you lap too. i did mine to 800 so it shouldn't be much different from stockQuote:
Originally Posted by tastymannatees
Good point - I have asked him to do another "before" test with the original compound so we have a full comparison.Quote:
Originally Posted by littleowl
lol so we are back to full pea?Quote:
Originally Posted by 64dragon
not necessarily, like you said, it depends, if you lap it to a fine grit like 1200 or 2000 probably a half pea but 600-800 is what i've heard that thermalright laps to so when i lapped my heatsink i just made it flat and didn't change the size of the "valley's" much if any but did change their direction
I think I am back to the full size pea as kind of a cover any contingency to get best results and leave it the cognoscenti to work optimum amounts for themselves.
Tried the carbon paper today and it was a no go, not sensitive enough over a broad area did not leave a mark. Staples has some clear film similar at least in look to the pressure film I might try that this week. Roller and ink? aluminum foil? Play dough? tape? I've got to read up on forensic crime scene stuff . There has got to be a simple way to take impressions.
I think on my next giveaway beta test I'll include the contact paper from the beginning although I won't do the full digital imaging, great stuff
Andrew, when do you want to have your pressure test samples back? I've got one that's done right now, but I'm still waiting for the sample I ordered so that I can do a second test on my other machine.
I have just received the film. I'll have the pressure test done tomorrow, but I wont be able to mail it until next week (1-3rd May are national holidays in Poland).
I got 2 back today so on some kind of bell curve probably take 2-3 weeks to get all of them back.Quote:
Originally Posted by Martijn
So I plan to be sending them back out in batches as they come in. just depends how fast you guys want results. first batch goes tomorrow for imaging.
That is definitely possible I think.
i mail out mine couples days ago, i am not sure if you received them yet.
Yours was the first I got back from this groupQuote:
Originally Posted by Bail_w
I am hoping to do some testing tomorrow afternoon and if all goes well then I will send mine out wed. :) Don't hold me to that yet. :p:
well, it might take me a little longer to get the pressure film in the mail. I found out I punctured my radiator on my water cooling loop the day before I got the film in the mail and then I got sick so I couldn't test. I'll get this done ASAP
Sorry for the delay
Wesley
I got only one today in the mail.
Be careful to send only the printed image do not send donor part back, especially in the same envelope as the print
I have edge lapped results on Farm-09 and pics I'll post up tonight. Didn't have time due to the day job getting in the way....:eek:Quote:
Originally Posted by tastymannatees
I have two films left to press and then I'll send them back. Probably Thursday in the mail, for all the films, at the latest.
Bob