i7 3770K intel TIM | AS5 | MX4 | PK1 | LQP | IX

Hi guys.

I've done a little review about the 3770K TIM replacement. The original is in spanish, but here are the results:

7 3770K L152B693
Asus Maximus V GENE Z77
2x4GB Samsung 30nm green 1600 @ 2133 C10 1.5v
Samsung 830 1280GB
Corsair H100 + 2x Nidec Gentle Thypoon 1450rpm 51cmf (solo Push)

Artic Silver 5
Artic MX4
Prolimatech pk-1
Coolaboratory Liquid Pro
índigo Xtreme

Ambient temp 23-34ºC

http://img821.imageshack.us/img821/5...0522144259.jpg

http://img140.imageshack.us/img140/5388/tempsw.png

Here the full review at Noticias3D:

http://foro.noticias3d.com/vbulletin...d.php?t=391334

bye!

valuable information!
Thank you friend for all of the work. I bet it took you some time..

+1 Excellent work.

Did you try Liquid Pro-Liquid Pro? Just wondering if the IHS is too uneven

EDIT: I just realised this is with a Corsair H100 + 2x Nidec Gentle Thypoon 1450rpm 51cmf (solo Push) on Prime95 and LinX

http://translate.google.com/translat...p%3Ft%3D391334

nice :up:

Fantastic work man! =)

Why do you ppl post this :X you make me want to throw 300€ away and pop the HIS... grrr

We are trying to put a good thermal paste on the core, then put a thin copper sheet over it (cutting at the size of core of course), add tin over the copper thin, and then place the IHS again .. . the transfer of heat is instantly amazing and great temperature drop

Hello again,

I looked at the wonderful pictures in your article, and was wondering (my apologies do not know Spanish) -
how did you put the IHS back on? did you just put it there or did you use thermal adhesive? or anything else?

Quote:

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Originally Posted by hersounds

We are trying to put a good thermal paste on the core, then put a thin copper sheet over it (cutting at the size of core of course), add tin over the copper thin, and then place the IHS again .. . the transfer of heat is instantly amazing and great temperature drop

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you need to skip directly to fastening a vapor chamber right onto the die. how many times do I have to repeat this ~~~~~~~~~~~~~~

in the thread I'm about to link, the water cooler gets 10 degrees C better when the heat spreader is removed. fasten the vapor chamber I suggest directly to the die with your favorite thermal interface and see how much better performance gets. http://www.xtremesystems.org/forums/...t=#post5101145

Thanks everyone

Quote:

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Originally Posted by rouvio

Hello again,

I looked at the wonderful pictures in your article, and was wondering (my apologies do not know Spanish) -
how did you put the IHS back on? did you just put it there or did you use thermal adhesive? or anything else?

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I've just put the liquid pro over the die, the IHS on it, and carefully put the CPU in the socket. The retention bracket gives all the pressure necessary. It seems that liquid pro can cure, "soldering" with the IHS. I haven't seen that during the review. I don't konw if it will.

I'm not going to move the CPU for a long time, maybe next time I move the CPU to another mobo it'll be glued.

That "soldering" possibility is why I didn't use the liquid pro for the IHS-H100.

Well done and good work there. So we can now safely say Intel kind of screwed us over....thanks.

BTW, how hard was it to take the IHS off. I wish I could do it, but it kind of scares me.

You just need patience, a cutter and a mouse pad. Attack the corners first, starting with the easier one you think for calibrating the pressure you must use in the rest of them. After that try to join the corners carefully, the cutter blade must not enter too mucho under the IHS (watch out the upper and bottom sides where the rectangular die is closer), and pop it.

Yo can see a few pics in the link I've posted.

Quote:

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Originally Posted by OldChap

+1 Excellent work.

Did you try Liquid Pro-Liquid Pro? Just wondering if the IHS is too uneven

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Hi,

^^^^^ what he said

Great bit of work & very good results :up:

I too would like to know if you tried Liquid Pro on both the bare core & the IHS?

I also note your GFLOP's are very low..... were you using a non AVX operating system an old linpack binary or was this because your chip would only run single channel?

Thanks man...think I am not going to try this for now atleast.

Quote:

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Originally Posted by C-N

Hi,

^^^^^ what he said

Great bit of work & very good results :up:

I too would like to know if you tried Liquid Pro on both the bare core & the IHS?

I also note your GFLOP's are very low..... were you using a non AVX operating system an old linpack binary or was this because your chip would only run single channel?

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I didn't use the AVX version of linx beacuse I didn't know of it at the time I started the review. The low GFLOPs of the indigo xtreme acptures is because the CPU was bad seated and I only cloud use Single channel (if I used dual, q-code 55 at the mobo led). After reseat the CPU with other TIMS, I could use dual channel again. See the PK1 results.

I used linx beacuse it gave me 1 more degree than prime 95 27.7 with AVX and FFT.

Today I'll update the spanish review with some test using linx with AVX.


That "soldering" possibility is why I didn't use the liquid pro both the IHS-H100 and die-H100. Not sure about how can cure liquid pro, and too lazy for removing the mounting braket of the mobo, at least now.

Excellent work - thanks for sharing. :up:

Quote:

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Originally Posted by amlett

I didn't use the AVX version of linx beacuse I didn't know of it at the time I started the review. The low GFLOPs of the indigo xtreme acptures is because the CPU was bad seated and I only cloud use Single channel (if I used dual, q-code 55 at the mobo led). After reseat the CPU with other TIMS, I could use dual channel again. See the PK1 results.

I used linx beacuse it gave me 1 more degree than prime 95 27.7 with AVX and FFT .

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Thanks I just wondered why they were 1/2 what I get with my 3570K.

You should be able to get well over 100GFLOP's with Linpack/ITB...... not that this will prove much over what you have already done other than maybe make a bit more heat due to extra load.

Quote:

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Originally Posted by amlett

Today I'll update the spanish review with some test using linx with AVX.

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Great I'll look out for it.

Quote:

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Originally Posted by amlett

That "soldering" possibility is why I didn't use the liquid pro both the IHS-H100 and die-H100. Not sure about how can cure liquid pro, and too lazy for removing the mounting braket of the mobo, at least now.

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I'm not understanding the issue? why cant you use liquid pro on the Die & IHS..... I know you didn't test it just wondering if there was a good reason why you didn't/shouldn't.

Your results are so spectacular I think I'm going to have to pop my IHS....

I've read some reviews talking about issues with liquid pro removal. it "glues" to the heatsink and after separate both, lapping can be necessary for removing liquid from both surfaces. As I was sure that in the die this could be even helpful, with the ISH|heatsink wasn't so sure. With the direct die contact was the same. I don't want to need lap the die for removing liquid pro if it glues to it.

Don't worry about the AVX Linx test, I'll post the results here too. As I'm now with Liquid pro + Prolimatech PK1 (the problem with the single channel took the last indigo application), the test won't be at 4.9ghz, but we can see the differences with other frecuencies and see the final gpflos with AVX.

Quote:

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Originally Posted by amlett

I've read some reviews talking about issues with liquid pro removal. it "glues" to the heatsink and after separate both, lapping can be necessary for removing liquid from both surfaces.

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Thanks for the heads up, I've never used liquid pro but after seeing all sorts of fantastic results with it figured i'd get some. I've googled problems & will look into it a bit more but it looks basically ok other than it stains copper (no big deal for me) & kills aluminium as its basically gallium which don't play nice together.

Quote:

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Originally Posted by amlett

I've read some reviews talking about issues with liquid pro removal. it "glues" to the heatsink and after separate both, lapping can be necessary for removing liquid from both surfaces. As I was sure that in the die this could be even helpful, with the ISH|heatsink wasn't so sure. With the direct die contact was the same. I don't want to need lap the die for removing liquid pro if it glues to it.

Don't worry about the AVX Linx test, I'll post the results here too. As I'm now with Liquid pro + Prolimatech PK1 (the problem with the single channel took the last indigo application), the test won't be at 4.9ghz, but we can see the differences with other frecuencies and see the final gpflos with AVX.

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That is correct Sir :) It is very hard to remove and you will have to lap both cpu and your heatsink. While lapping heatsink is not a very big problem lapping cpu is a bit of a problem because you will most likely lose warranty as long as you have not removed IHS (yet) :D

I've been able to pass a quick Linx with AVX at lunch time. Almost double GFLOPS and a coupe of degrees more:

http://img708.imageshack.us/img708/8...xavxlqppk1.png

If you use a black glue and put the IHS back on would it still pass warranty??

or just cross your fingers it never fails??

Cross fingers.

By the way, I've started the review and tests as soon as I got the components. I'm going to get a 670 soon. For those who have fight with this Ivys, disabling the iGPU, is there any kind of improvement with voltages? I cant try it yet

Quote:

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Originally Posted by iboomalot

If you use a black glue and put the IHS back on would it still pass warranty??

or just cross your fingers it never fails??

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If you can't afford to lose a $300+ chip and are worried about your warranty then don't take off the IHS. Use some common sense.

Quote:

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Originally Posted by amlett

I've been able to pass a quick Linx with AVX at lunch time. Almost double GFLOPS and a coupe of degrees more:

http://img708.imageshack.us/img708/8...xavxlqppk1.png

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67c max at 1.3vcore? What cooling? Still H100?