Hi folks This day is something special - quite fresh new G.skill model of memory. It belongs to new line with extremely efficient heatsinks. It not use any heatpipes, any other technologies like liquid metal or something like that. It's pure custom design of aluminium (not materials almost as aluminiun ). They are quite wide with some wild roller-coasters which cross themselves This memory is really cold! So this new design surely isn't only marketing attack
Pictures and naked photos
From my experience (but there is no rule actually, please study results of Mushkin ), (and please, trust me, I had lots of memory in my hands ), ICs starting from "x" are the best. They prefer lower vdimm and clocks very high. Next are "r", which are in the middle of this branch. They like high voltages (up to 2.35v, they even boot on 2.4v, when "x" or "t" series stop booting at all). And the last one which I possessed ever (mind 2x2 GB sets) where "t" and they clocked acceptably and prefer low vdimm (about 2.15v).
Testing Configuration
E8200 Q808A314
Asus Blitz Formula (latest beta BIOS)
GeCube HD2900XT
Maxtor 80GB SATA
Pentagram 1050W ES
Windows XP (My Hitachi HDD is dead and with it also Vista )
Tests with CAS3 I skipped as minding 2x2 GB sets it is utter nonsense. CAS4 is much more common, but Powerchip 2x2 GB don't like CAS4 so +/- 815 is max.
It's retail set.
But CAS5 is something much different
Barrier 1066 MHz DDR passed 2.25v from bios.
Sum up,
Unfortunately with new design abilities of overclocking didn't raise but still G.skill is keeping up with the others (1080 MHz DDR is very good result!). New heatspreads are very efficient, good looking and without any problems we can mount four sticks in motherboard. Very nice move G.skill
(Personally now I simply must test some Mushkin with eVCI Cooling, the battle begins )
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