You have the 6FD 2160 that is 73 Tcase http://processorfinder.intel.com/det...px?sSpec=SLA8Z, and not 6F2 that is 61 tcase http://processorfinder.intel.com/det...px?sSpec=SLA3H ?
Edit, never mind just found your E2160, it is the 6FD with tcase 73. That is pretty screwy. Both have same TDP, and if Tjmax is same, then theta (core to tcase) is different between the two.
plugging in tjmax of 85 for both, 6F2 (L2 with tcase 61) theta is .38C/W which is typical, the 6FD (MO with tcase 73) is 0.18 C/W. If both have tjmax of 85, I wonder if one uses solder and one a die attach adhesive. But the theta of one is twice the other which is certainly plausible given all the white papers describing the different approaches for die attach adhesives.
Now, I really want someone to send you their B stepping quad, or get gigabyte to measure tcase of the e4300 version with other tcase. maybe intel is trying out in mass scale different bond adhesives, ie solder or other.
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