1) Normal ES: Available to partners and press before the product actually launches. These are usually close to retail parts, maybe one stepping/node before retails. From my experience (I've had access to AMD & Intel ES CPUs before the official launch around 8 years) normal ES CPUs are actually usually worse than retails because manufacturing process develops all the time and retails keep getting better. Every Phenom II press sample (not even marked as ES but couple weeks earlier than retail parts) I've tested so far have been worse than normal retails.
lol was talking to K|ngp|n a few months back about doing this to an F1EE. Still want to try it but I need to find a few things first Nice job with the plating,looks slick.
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nickel plating is a very very thin coating, I doubt it hinders much of anything.
It won't hinder his pot, unless he did all the way to the internals with it......if anything it will help as long as the "base" internals did not get plated.
Might want to look up the heat and cold analysis of certain metals in the periodic table before you say that it doesn't hinder as it can in the wrong applications....Heatpipes would be one of them...
Gold plating on electrical connections is very thin......and it makes a diff
1) Normal ES: Available to partners and press before the product actually launches. These are usually close to retail parts, maybe one stepping/node before retails. From my experience (I've had access to AMD & Intel ES CPUs before the official launch around 8 years) normal ES CPUs are actually usually worse than retails because manufacturing process develops all the time and retails keep getting better. Every Phenom II press sample (not even marked as ES but couple weeks earlier than retail parts) I've tested so far have been worse than normal retails.
It won't hinder his pot, unless he did all the way to the internals with it......if anything it will help as long as the "base" internals did not get plated.
Might want to look up the heat and cold analysis of certain metals in the periodic table before you say that it doesn't hinder as it can in the wrong applications....Heatpipes would be one of them...
Gold plating on electrical connections is very thin......and it makes a diff
b/c gold doesn't oxidize and therefore maintains its electrical conductivity
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b/c gold doesn't oxidize and therefore maintains its electrical conductivity
Yep but that works for gold plating on brass/copper etc.
Same principle applies for heat exchange as well....even the quality of copper used can effect heat exchange but thats better discussed in another thread.
Bottom line at ambient or ln2 temps nickel has poor heat/cold exchange but in the application duniek is using it in it is actually a +........it might only be a +1% but a + plus bling is a +.....
I can acchieve the same +% just by swapping out my aluminum wall on my pot for acrylic....
1) Normal ES: Available to partners and press before the product actually launches. These are usually close to retail parts, maybe one stepping/node before retails. From my experience (I've had access to AMD & Intel ES CPUs before the official launch around 8 years) normal ES CPUs are actually usually worse than retails because manufacturing process develops all the time and retails keep getting better. Every Phenom II press sample (not even marked as ES but couple weeks earlier than retail parts) I've tested so far have been worse than normal retails.
this plating won't do anything to the thermodynamics. you guys know that the layer is only a few atoms thick right? and besides, the CPU/GPU is not temperature sensitive, especially on extreme temperature scales.
anyways, that plating looks very nice, although bling and benching just hasn't really mixed before
anyways, that plating looks very nice, although bling and benching just hasn't really mixed before
Hard to mix bling, apart from hwbot medals, especially once insulated... though i do recall some gold plated pots that dino and a few others got in limited run.
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seems fine,looks cool but why plate the contact area with nickel???i would have left that copper contact area alone being it conducts better heat vs a nickel barrier coating.diff is prob min at those temps anywayz.
how much would silver cost to do a pot that size?????anyone...guesses?
imo silver would apply better,look better and have a smoother overall finished look vs nickel.i dunno.
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seems fine,looks cool but why plate the contact area with nickel???i would have left that copper contact area alone being it conducts better heat vs a nickel barrier coating.diff is prob min at those temps anywayz.
how much would silver cost to do a pot that size?????anyone...guesses?
imo silver would apply better,look better and have a smoother overall finished look vs nickel.i dunno.
in 0,5-1mm thick of nickel performance will drop
but nickelplating shield is 10um (0,01mm so I am sure in theory and practice you dont see any perfomance loss in extreme low temps (even with waterblocks when every 1*C count
wow...what about performance nickel plat??more better than cooper??
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1) Normal ES: Available to partners and press before the product actually launches. These are usually close to retail parts, maybe one stepping/node before retails. From my experience (I've had access to AMD & Intel ES CPUs before the official launch around 8 years) normal ES CPUs are actually usually worse than retails because manufacturing process develops all the time and retails keep getting better. Every Phenom II press sample (not even marked as ES but couple weeks earlier than retail parts) I've tested so far have been worse than normal retails.
but nickelplating shield is 10um (0,01mm so I am sure in theory and practice you dont see any perfomance loss in extreme low temps (even with waterblocks when every 1*C count
We nickel plate a large number or brass components where I work and the coating can go as low as 3um (0.003mm), however it usually comes in around 7um and gives a similar finish to what you can see in the original post.
Lifes more fun at -190C
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