I can see the reason why AMD won't show us the die for now, but why showing a fake one instead?
To confuse competition i guess.
It's the real die guys. Just photoshopped - heavily - to obscure the internal structures so you can't figure out what they are if you were say, an enormously sized competitor trying to model your processor in simulation to see how it stacks up months in advance. ^_^
To keep us talking...
It's the real one that has been altered quite a bit. The structures inside are blurred and the modules are "resized" in order to mask the ratios inside the core.
The big joke is probably on the Intel engineers who have been pouting over these photos :P
Last edited by hurleybird; 09-01-2010 at 02:19 PM.
covering the real cores with something else then bluring them makes a lot of sense... can't wait to see the real die shot and some samples![]()
Last edited by 570091D; 09-01-2010 at 01:51 PM.
It is a real die shot, not a fake. But, to keep the competition from knowing what is really under the covers you change it. This is a pretty common tactic in the industry.
Well, that makes things less cut and dry. Did you change the *shapes* of the modules and L2 cache or not? that's what everyone wants to know. I mean, if you just blurred and obscured the sensitive stuff it's obviously still legit, but it seems that if you would go as far as changing up the shapes and sized of cache and cores that would make it 'fake'.
Last edited by hurleybird; 09-01-2010 at 01:55 PM.
Now I remember when Intel revealed Nehalem for the first time, the die-shot they presented was actually a shot from one of the underlying interconnect layers of the chip, not the top level with all the visible logic and cheesy details. I guess it makes sense.
Hans made back then an overlay diagram of that die-shot and he missed by a mile the L2 cache locations/sizes and lots of other stuff.
Last edited by fellix_bg; 09-01-2010 at 01:55 PM.
Who am I?
''From that die shot I can tell that the IPC/TDP/mm2/frequency/L2/L3/socket pins is definitely much lower than Phenom II, plus the '32nm Orochi Die' description is clear evidence that Bulldozer is DELAYED by 3 quarters and will launch in Q3 2012. It's all there.''
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