Quote Originally Posted by MaStA View Post
Hmm...so they use thermal pads and not a paste? Also, if you remove the pad and use a paste like AS5 will there be a gap since the space before was larger than what a thin layer of paste will be? My heatsinks always are hot.

Thanks,
Jared


The northbridge was paste but MOFETS and Southbridge is a thermal pad.
I also had the same concern about contact so I did a test first by installing the copper then removing to see if everything is touching as desired.

Looked fine as the copper had TIM residue on it.