Applying Shin Etsu X23-7762 and G761

[GBR]

I've been trying the G751 and X23-7762 for 6 weeks now.

I still think that Jah's application guide is the best technique"

http://amdforums.com/showthread.php?...ht=Application


And,suprisingly, Artic Silver's application guide also works...

but in reverse......

...with the Shin Etsu it works best applied to the heatsink and rubbing some into the core with a finger covered in plastic wrap.


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Today I tried my new Barton 2500 so I cleaned it with isopropyl alcohol, and rubbed a thin coating into the core with Saran Wrap on my finger. The layer is so thin its almost like staining the core...just trying to rub the compound into the surface.

I started with a warmed syringe of X23 and a warmed heatsink.

I cleaned the heatsink and marked the contact area and taped off the area with Post-Its.

Then I rubbed some X23-7762 into the heatsink. Again, almost like staining.

Then I dabbed many small dots like in Jah's guide and patted them down with the cut down smooth plastic card and used a straight edge on another plastic card to trim the surface even with the thickness of the Post Its.

I also cheated and dabbed a bit more with my plastic wrapped finger.

This definitely produced the thinnest most consistent application I have achieved.

I do think that a cycle of high temp burn-in and cool operation makes most thermal compounds work their best...especially true with Shin Etsu.

Started the Barton at 2.2 Ghz and quickly went to 2.4 Ghz after some Prime 95 runs and vCore increases. Quickly achieved 32 Idle and 41 Prime 95 according to MBM 5.3 Compu Nurse thingey reads 5 degrees C lower than that at load.


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I've started to form opinions on when to use X23 or g751.

There are lots of variables, but here are my rules of thumb.

Intel cpu: X23-7762

AMD cpu: G751 or X23-7762

Rough surface: G751

Lapped or polished surface: X23-7762

GPU, Northbridge, Southbridge, MOS -FET: G751

Not a very skiiled person applying the compound: X23-7762

X23 is newer and easier to apply, and with higher termal conductivity theoretically should work slightly better.

My personal experience and recent reviews tells me that X23-7762 is the first choice for Pentium cpu's since it is a larger chip and application is an issue.. G751 equal or better for AMD cpu's.

But this only refers to ease of application and how it affects getting a thin even 3 mil coating on a large die.

G751 is clearly better for Northbridge, Southbridge and GPU chips, since they are rarely flat chips and the heatsinks for them are also rougher and have more runout....so the filler quality of G751 is more important than ease of smooth application..