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ever think it?
A water block with a hsf on top of it?
or a waterblock with fins?
mebbe like welding a waterblock with no top to a sk7?
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If one was to use a teflon seal and only a half waterblock (top-side only), wouldn't this work? Anyone try it?
Surely you'd want to have a good drain-type pump system so pulling a processor doesn't turn into a system soaker.
Don't you think you'd get better thermal transfer with the water
in direct contact with the processor?
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One more note. This would have to be for a processor that has quite a bit of surface area like a P4.
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It's been done before but I'm sure once you've gotten down to ambient temps a hsf would do very little if any good.
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