https://www.techpowerup.com/232067/r...md-graphics-ip
Rumors have been making the rounds about an as-of-yet unannounced product from Intel: a Kaby Lake-G series which would mark Intel's return foray to a multi-chip module in a singular package. The company has already played with such a design before with its Clarkdale family of processors - which married a 32 nm CPU as well as a 45 nm GPU and memory controller in a single package. Kaby Lake-G will reportedly make away with its simple, low-data rate implementation and communication between two parts, instead carrying itself on the shoulders of Intel's EMIB (Embedded Multi-die Interconnect Bridge), which the company claims is a "more elegant interconnect for a more civilized age."
Instead of using a large silicon interposer typically found in other 2.5D approaches (like AMD did whilst marrying its Fiji dies with HBM memory), EMIB uses a very small bridge die, with multiple routing layers, which provide a good measure of price/data paths for the interconnected, heterogeneous architecture. This saves on the costly TSV (Through-Silicon Vias) that dot the interposer approach.
Bookmarks