The primary role of the IHS is to spread the heat out
evenly from the die and to provide a better bondline
control of the interface material. This can be achieved by
increasing the area of the IHS and by using a high thermal
conductivity thermal interface material with low
interfacial resistances. In order to meet thermal dissipation
targets, Intel introduced polymer thermal interface
materials (PTIM) initially with 3-4 W/moK bulk thermal
conductivity and then successfully transitioned to Pb-free
solder-based thermal interface material to meet the ever
increasing demand for thermal cooling capability as
shown in Figure 16.....
thermal conductivity and the mechanical compliance requirements resulted in
the development and qualification of low melting
temperatures (157oC Tm), low mechanical yield strength
(4-6 MPa), and relatively high thermal conductivity (~87
W/moK) pure Indium (In) metal for STIM applications.
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