I tested rev 1, in the past I have tried the rev 2 and saw no real difference, usually it's more about resolving clearance issues. I think the MSI has glue on top of the inductors and so VRM results may get worse in general.
I believe that the active one is the passive one plus the heatpipe that connects to the bridge. The heatpipe will be compatible with the backplate, but the bridge which needs to connect to the block is extremely unlikely to be compatible with the EK block.
I do think it would close the gap but not sure how much - the thermal pads will most likely have to be thicker as the AC backplate comes closer to the PCB in those areas I think. Thicker is of course more thermally resistive, but you could counter this by buying better thermal pad quality to lower the resistance.
Bookmarks