Figuring out G.Skill's SNs

[Shiranui Gen-An]

Finally managed a freaking 2400 Cas8 run with tWCL6 on some PSC (G.Skill Pi 2000C6).

[Don_Dan]

Congrats!

[bmbenx]

hi everyone
I have a new memory kit from rma, it's samsung HCH9 ?
thanks for any help

[websmile]

Seems to be dual sided, Samsung D most likely, HCH9. If it is single sided, these are most likely B, I cannot judge perfectly from view I have on the picture

[bmbenx]

@websmile yes, dual sided on this memory
i will try to test next week, after my processor back
thanks for your help

[jimba86]

does anyone know what IC would be in a gskill 2666 cl11 tridentX kit made may 2014? MFR?

I dont have serial numbers and this is all info the shop gives me..

[Shiranui Gen-An]

does anyone know what IC would be in a gskill 2666 cl11 tridentX kit made may 2014? MFR?

I dont have serial numbers and this is all info the shop gives me..

Over at OCN, in the big memory thread, SamOCX says it's MFR now: http://www.overclock.net/t/1268061/o...#post_22662151

[filmbot]

Any idea what Samsung some double sided, black PCB F3-2400C10D-8GZH with 13382500 SN could be?

[Shiranui Gen-An]

Probably Samsung 2Gbit D-die, 1600MHz JEDEC bin.

[filmbot]

Chance they use the same JDEC bin Corsair does on Dominator Platinum's? I assume not but out of curiosity, what does Corsair use? HYK0? HCH9?

[Shiranui Gen-An]

Both actually. The JEDEC speed bin isn't really important, as long as it's Samsung 2Gbit D-die.

[Shiranui Gen-An]

Have we figured out the SNs for DDR4? Looks like xxxx3400 is Hynix, but there also is xxxx3300 like with this kit.

[Don_Dan]

Any idea what Samsung some double sided, black PCB F3-2400C10D-8GZH with 13382500 SN could be?

I think most 2400C10 kits made G.Skill are made with Samsung 4Gb B-rev chips.

Have we figured out the SNs for DDR4? Looks like xxxx3400 is Hynix, but there also is xxxx3300 like with this kit.

Thanks for the link!
3400 (= x40x) is Hynix, I've already added it to the first post in October. The review is already 2 months old, so it can only be Hynix or Micron, right? Since Hynix is already taken and so far there's no code for Micron, I guess x30x is Micron.

[Don_Dan]

The first post has been updated with some info about the DDR4 kits.

[Don_Dan]

I made some changes in the OP again.

[TheHoof]

These should for sure be PSC:
http://www.abload.de/img/1321256873fnun4.gif
https://abload.de/img/img_20180903_1837125173e0q.jpg
I believe the "0240" should be a typo, although if that did end up being Hynix I feel bad for "pissdrunx1987". They are the HardwareLuxx user who owns the kit.
The "41D" seems consistent, as I have seen another 2018 kit with the same last part of the serial. I believe it is Powerchip 1GBit Revision D.
https://www.ebay.com/itm/165015396234
What's interesting is that this kit was not a "PSC bin" at all, but it's likely that PSC D is all G.Skill had available.

[Don_Dan]

DDR3-2400 CL8-11-11-30 @ 1.65V for sure is an odd bin for Hynix, but so far the codes have been very reliable (for future reference Ripjaws Z 11030240xxxxx).
Maybe 2Gb BFR can do it?

I've already added the "41D" for PSC in the first post.

[TheHoof]

Think that 2400c8 set might be from Fredyama originally, need to go check my bookmarks from my desktop. BFR or CFR maybe could do this bin, as could maybe a few other non-Hynix ICs, although I'm pretty sure this is just one of those weird mislabel type cases.

[Don_Dan]

It might be interesting to try and replicate those specs on a kit of F3-19200CL9Q-16GBZHD (4GB DR DDR3-2400 CL9-11-10-28 @ 1.65V) and check if it can come close to DDR3-2400 CL8-11-11-30 @ 1.65+V.

[Don_Dan]

The first post has been updated.

[Don_Dan]

Update in first post.

[trans am]

what is this? 5600 hynix kit from gskill. not showing in CPUZ. Any ideas?

[Don_Dan]

Hey mate, I can't open the attachment, it's giving me an error. Can you tell me the code written on the label?

[Don_Dan]

Update in first post.

[TheHoof]

Both of these kits are Samsung 1GBit G-Die, the lesser known sibling of Samsung 2GBit D-Die. Telltale visuals are dual-rank PCB, Samsung code, and early 2013 date. Seems this IC is relatively uncommon outside of OEM modules.

Binning strategy is very similar to Samsung 2GBt D-Die. Expect good sticks to need one higher tRP than tRCD. tRFC often does <90 for 2800mhz+. Will do one lower tWRRD as well. Most interesting, it does tRDRD 4! Dual-rank sticks on B63 will usually need a one-dimm-per-channel motherboard to do 1t at >2600mhz.