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Thread: Figuring out G.Skill's SNs

  1. #376
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    Any OC numbers from these, stunni?

  2. #377
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    Sorry no OC by the way. I will not do this because I have no time

  3. #378
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    Hello,
    I went to a shop today to buy some Trident X 2400 10 12 12 31, hoping to grab some Hynix.
    So i checked the serial numbers and the kits were really brand new. June and July 2013.

    SN were :


    1324150............
    1327150............

    I haven't the full serials because i believed only the first ones were relevant. It was not a 0 digit right after.

    150 could be enough to tell if it is Samsung ICs ?

    Thanks a lot.

  4. #379
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    150 should be enough to tell these are Samsung, but you might be careful, at 2400cas10 these can also be single sided B 4gbit IC = bad oc

    P.S. If these are 8GB sticks, they will be most likely B Sams anyway^^
    Last edited by websmile; 07-15-2013 at 10:46 AM.

  5. #380
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    Thanks for the fast reply.

    Hynix MFR seems discontinued on these kits ? Should i move to 2666 11 13 13 35 to get the right ICs ? (F3-2666C11D-8GTXD)

    My rig is based on a Haswell CPU.

  6. #381
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    Quote Originally Posted by TRD View Post
    Hello,
    I went to a shop today to buy some Trident X 2400 10 12 12 31, hoping to grab some Hynix.
    So i checked the serial numbers and the kits were really brand new. June and July 2013.

    SN were :


    1324150............
    1327150............

    I haven't the full serials because i believed only the first ones were relevant. It was not a 0 digit right after.

    150 could be enough to tell if it is Samsung ICs ?

    Thanks a lot.
    1500 means they're Samsung and most of the Trident X 2400 CL10 kits are Samsung 4Gb B-rev chips anyway.

    Edit: I'm slow...

    If you're looking for MFR chips look somewhere else and not in these kits.
    Last edited by Don_Dan; 07-15-2013 at 10:51 AM.

    Quote Originally Posted by chew* View Post
    You can never have enough D9's.

  7. #382
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    2666cas11 and 2800cas11 4GB sticks are usually dual sided Hynix CFR - what you are looking for, MFR, is single sided 4gb sticks and dual sided 8gb sticks with hynix, 2666 cas12, 2800cas12 for example and lots more. 2400(except from cas9) and below specced kits leave the opportunity for lots of ics, and gskill seems to change these frequently at least on some of these

  8. #383
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    In fact, i have read in another OC forum (i don't know if i can link the post) :

    2400 9 11 11 can only be Samsung and,
    2400 10 12 12 are Hynix Timings.

    Websmile, you are telling me it's the opposite ?

  9. #384
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    2400 cas10 are Timings MFR can do, but GSkill used Samsungs on these from the start - there are lots of reviews that prove this as well as tests - as the 2400cas10 were released long time ago, when MFR was not popular, and lots of cfr failed these specs, Samsung were used, and are used today, single and dual sided Samsung. On the 2400 cas9 I agree, because Samsung D are eol, these are getting down in availability as well.

  10. #385
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    Sure, link the post, but it's incorrect.

    2400 CL9 are Samsung 2Gb D-rev chips, 2400 CL10 on Trident X are mostly Samsung 4Gb B-rev chips, though other manufacturers and even G.Skill might be using Hynix MFR chips for this bin.

    Edit: ...

    Quote Originally Posted by chew* View Post
    You can never have enough D9's.

  11. #386
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    Quote Originally Posted by websmile View Post
    2400 cas10 are Timings MFR can do, but GSkill used Samsungs on these from the start - there are lots of reviews that prove this as well as tests - as the 2400cas10 were released long time ago, when MFR was not popular, and lots of cfr failed these specs, Samsung were used, and are used today, single and dual sided Samsung. On the 2400 cas9 I agree, because Samsung D are eol, these are getting down in availability as well.
    ; too bad i am looking for single sided MFR ; i guess i should move to Trident X 2666 CAS 12 dual sided at least to get Hynix MFR. I have browsed Caseking and in particular TeamGroup Xtreem memories ; on the paper, specs are similar than Trident X for a lot frequencies.

    EDIT : or check for a recent 2400 C9 kit.

    Quote Originally Posted by Don_Dan View Post
    Sure, link the post, but it's incorrect.

    2400 CL9 are Samsung 2Gb D-rev chips, 2400 CL10 on Trident X are mostly Samsung 4Gb B-rev chips, though other manufacturers and even G.Skill might be using Hynix MFR chips for this bin.

    Edit: ...
    I hope i have interpreted the post correctly :

    http://www.overclock.net/t/1285652/o...nfo-thread/730

    #738
    Last edited by TRD; 07-15-2013 at 11:36 AM.

  12. #387
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    On the 2x4GB teamXtreem 2666c11 - these are single sided mfr of usually good quality... - proven by several benchers, and I had a kit here as well - maybe this could be an option apert from the cas12 tridentx, these are also competetively priced

  13. #388
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    There is an offer with the 2X4Go 2666 C11 TeamGroup at Caseking : 130 to 100 euros.

    In germany the Trident X are more affordable (175 euros) than in France (195 euros)

    This is the kit you are talking about, right ?

    http://www.gskill.com/en/product/f3-2666c12d-16gtxd

    It's a 99,99% sure, with MFR ICs (dual sided) ?


    Thanks a lot

  14. #389
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    The Team are 100% single siided MFR, never seen nor heard anything else. On the GSKill, these have to be MFR, 16GB dual sided kit with these specs usually is Hynix. Samsung B 4gbit, the only other alternative that GSkill could use, usually opt out below 2600, meaning they can?t do these specs. If you have a chance to see SN, should be typical Hynix like x400

  15. #390
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    Oops, i found the TeamGroup at 75 euros in UK

    This is the correct reference "TXD38G2666HC11CDC01" ?

    Thanks indeed for your help

  16. #391
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    This is the partnumber of the 2x4GB 2666 c11-13-13-35 MFR based kit, nice price - yvw, hope they do a good job if you get them

  17. #392
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    Yep, then the binning process


    EDIT : another reference for the TeamGroup 2666 C 11 here :


    http://www.overclockers.com/forums/s...d.php?t=728364


    TXD34G2666HC11CBK

    I am definitely lost. Two differents references for a same kit. Both MFR ?


    Last edited by TRD; 07-15-2013 at 12:56 PM.

  18. #393
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    TXD34G2666HC11CBK is a single stick, TXD38G2666HC11CDC01 is the kit consisting of two of these sticks.

    Quote Originally Posted by chew* View Post
    You can never have enough D9's.

  19. #394
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    Quote Originally Posted by TRD View Post
    Yep, then the binning process


    EDIT : another reference for the TeamGroup 2666 C 11 here :


    http://www.overclockers.com/forums/s...d.php?t=728364


    TXD34G2666HC11CBK

    I am definitely lost. Two differents references for a same kit. Both MFR ?
    There is two batches of TeamX2666c11 [MFR] ............green PCB (linked above) is older and little harder to clock as recent Black PCB<- this is just my opinion (I had them both and both are great for the price )



    http://valid.canardpc.com/show_oc.php?id=2850460
    Last edited by XBrytanX; 07-15-2013 at 07:01 PM.

  20. #395
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    Thank you dear overclockers for your help.

    @ XBrytanX, where did you get these one with the black PCB ?

    What voltage for your validation ?
    Last edited by TRD; 07-16-2013 at 03:29 AM.

  21. #396
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    ^^ 1.85 was upper limit on this set (Air)

  22. #397
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    Pretty sure now....these early batches of 2800 are high binned samsung
    Last edited by Dumo; 07-20-2013 at 09:45 AM.

  23. #398
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    what makes you think so?
    1400 11-13-13 makes perfect sense for good CFR

  24. #399
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    With haswell some can run 2900+ CL9, trfc90s and trdrd4 cold

  25. #400
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    1450 MHz CL9 on cold? What can they do on air? And what about CB?
    I think some Hynix can do it, I mean Nick Shih has already shown 1600 MHz 8-11-10-18 with MFR on LN2. tRDRD=4, but tRFC=200.

    Quote Originally Posted by chew* View Post
    You can never have enough D9's.

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