CFR scale from cold way better than Samsung, so no wonder these do 1450 CL9 - 1400 11-13-13 is the highest CFR bin ever.
I think there is even a CFR LN2 profile for 1400 CL8 in Maximus VI-series BIOSes.
CFR scale from cold way better than Samsung, so no wonder these do 1450 CL9 - 1400 11-13-13 is the highest CFR bin ever.
I think there is even a CFR LN2 profile for 1400 CL8 in Maximus VI-series BIOSes.
Remember kintaro run on 2800 11-13-13 gskill trident kit with HYNIX BFR
http://www.xtremesystems.org/forums/...fr#post5152981
full pot with hynix BFR did 2720 8-11-9...But for some reason,there are samsungs out there that can do trdrd4 at 2800+ when cold,so you may never know unless naked..
I just tested my CFR - these do 32M at 1400 9-13-11 on air, so 1450 on LN2 looks very realistic.
Yes. I had two of these quadkits, were nothing spectacular.
Stripped 2x2GB kit of G.SKill PK Series. They use exact the same Powerchip IC as DDR3. They're marked 1030 (DDR3 are 1040), I saw other kit (PQ Series 1000MHz) marked 0630, so it means to me, that DDR2 has DDR3 markings minus ten, if they're based on the same IC. Tomorrow I should receive a board, so I'll do small OC test
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Just RMA'd a kit of 2200C7 Pi sticks.
recieved back a new kit, green PCB, 8117
13331200xxxxxx
still PSC from quick boot timings (2600 8-12-8)
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What about this kit, BBSE/PSC?
Overclocking, it's a lifestyle
No, sry should have told that. The seller claims 7-9-7-24. Typical BBSE timings, but I hope for PSC
These ones http://www2.ncix.com/products/?sku=53572
Overclocking, it's a lifestyle
Let's hope for that. Will probably buy them together with 4x2GB G.SKill ECO 1600-CL7-8-7-24
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I hope Samsung comes out with a better 4Gbit IC to challenge Hynix MFR, or at least that can clock like their 2GBit D-die stuff.
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Since HYK0 it is a DDR3-1600 part, I would expect the "prefix" / 5th digit to be a "2", therefore I would expect to see a 2500 in the 5th thru 8th spot of the S/N.
I don't think that whether the part is a 2Gbit (used in double-sided 4GB modules) or 4Gbit (used in double-sided 8GB modules) matters on the GSkill coding scheme, does it? TaPaKaH posted a while back over on OCN about the "prefix" or 5th digit of "1" being for the DDR3-1333 parts like Samsung HCH9 or Hynix BFR and the "prefix" of "2" being for the DDR3-1600 parts like Samsung HYK0 or Hynix CFR and so far that seems to hold up, whether it be on 4GB or 8GB modules (single, or double-sided).
In memory of Gracie, my sweet, sweet wife and mother of my children. Darling, we will miss you dearly. May you rest in peace (born to this world on March 30, 1976; went to her Heavenly Father on Good Friday, April 22, 2011).
http://animoto.com/play/E0wFhd6tN0nA...ent=challenger
Heat
The following is a copy of a post that I made over on OCN shortly after Sam made his comment about the distinction between the "1" and "2" prefix in the IC code part of the S/N.
Could you guys check it out and critique it, or if you have additional info to add, please don't be shy.
Original post:Following that logic then, a 2x8GB kit of Hynix based MFR PBC would have a S/N with a "2400" in it, but one made using the older MFR H9C (if used) would sport a "1400". Would you agree?
http://www.hynix.com/products/comput...=computingDDR3
Over at XS there was a pic posted of the ICs of one of these 2666 C11 kits with the "1400" and it was in fact CFR H9C (a 1333 part if I'm reading the info from the Hynix site correctly).
http://www.xtremesystems.org/forums/...=1#post5153644
Therefore a 2x4 double sided kit with Hynix timings and sporting the "2400" number should be expected to be using CFR PBC...a 1600 bin part?
http://www.hynix.com/products/comput...=computingDDR3
So if you know whether it is a single-sided, or a double-sided module, then based on whether you are looking at a 2x4GB kit, or a 2x8GB kit and whether it has the 1400/2400 for Hynix or the 1500/2500 for Samsung, you have a pretty good chance of guessing what is under the hood.
Does this look right?
For 4GB modules:
single-sided 1400 = MFR H9C (1333 part)
double-sided 1400 = CFR H9C (1333 part)
double-sided 2400 = CFR PBC (1600 part)
single-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 1500 = the Samsung 2Gbit HCH9 (1333 part)
double-sided 2500 = HYK0 (1600 part)
for 8GB modules:
double-sided 1400 = MFR H9C (1333 part)
double-sided 2400 = MFR PBC (1600 part)
double-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 2500 = ??? (I don't know it)
There is also a Hynix AFR that I've gotten on some generic 8GB modules and it is like MFR so it is possible to get these instead of MFR.
http://www.hynix.com/products/comput...=computingDDR3
There are also some Samsung variants to HCH9 that have popped up from time to time, so there are no guarantees, but generally speaking, most Hynix based stufft these days seems to be either CFR or MFR, and most Samsung would be either HCH9 (2Gbit or 4Gbit) or HYK0 (Edit: again, 2Gbit or 4Gbit).
Edit: If any of you guys have GSkill kits that you have the heat spreaders removed, could you check them against what I have above and confirm Sam's statement.
http://www.overclock.net/t/1268061/o...#post_20158789
Last edited by Reefa_Madness; 09-26-2013 at 02:01 PM.
In memory of Gracie, my sweet, sweet wife and mother of my children. Darling, we will miss you dearly. May you rest in peace (born to this world on March 30, 1976; went to her Heavenly Father on Good Friday, April 22, 2011).
http://animoto.com/play/E0wFhd6tN0nA...ent=challenger
Heat
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Thanks. I see now that the SPD have the specs that don dan guessed, confused.. whatever, they perform good The ECO's didn't seem so good, around 2400 8-11-8 1.8 volt but maybe I can push some more.
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