CPU vs PCB reflow profile

[OldChap]

When attaching IHS to cpu ....Yes I am thinking 3770K

What does anyone here consider is the major difference between this and a typical pcb solder reflow profile as seen below

[Snow Crash]

If you are thinking about reusing Intel solder from an old CPU I *think* I remember reading the flow temp is a fair bit lower than the profile above. I'll look around a bit. I was thinking about this the other day ... and just don't know enough about the temps/ tolerances all around (solder, cpu, board). Let us know how you get on ... I can see the post title now ... Toaster oven TIM

hmm... sounds as bit complicated
http://www.intel.com/technology/itj/...s/5-solder.htm

appendix A ... I wonder if one of these vendors would sell to a consumer?
http://www.intel.com/Assets/PDF/designguide/320840.pdf
oops .. that is x58 shipset ... maybe see if they do x58 CPU and then see if you can pull solder ou and use in 3770K?

I'll dig through these posts to see if there is anything useful
http://www.xtremesystems.org/forums/...d.php?t=222040
page 2 post# 39

The solder will melt at 166-172°C,set the oven but measure with an accurate thermometer and just pop it off,aluminium foil wrap if necessary.Goes well with Duck.

http://www.xtremesystems.org/forums/...d.php?t=209279

[OldChap]

http://www.intel.com/technology/itj/...s/5-solder.htm That, my friend, is exactly the sort of information I need as I have sourced Indium for this experiment

I would suggest that heat cycling is less of an issue for crunchers. Now I need to consider how to flux this die- indium interface as well.