Intel introduced polymer thermal interface
materials (PTIM) initially with 3-4 W/moK bulk thermal
conductivity and then successfully transitioned to Pb-free
solder-based thermal interface material to meet the ever
increasing demand for thermal cooling capability as
shown in Figure 16 [5].
Figure 16: Improvement in thermal cooling capability
with TIM materials (Polymer vs. Solder)
The introduction of Pb-free solder-based TIM materials
posed significant integration challenges. The STIM
needed to relieve the mechanical stress caused by CTE
mismatch of the integrated heat spreader lid and the
silicon die and to minimize stress transfer to the silicon
die during thermal cycling [6]. The thermal conductivity
and the mechanical compliance requirements resulted in
the development and qualification of low melting
temperatures (157oC Tm), low mechanical yield strength
(4-6 MPa), and relatively high thermal conductivity (~87
W/moK) pure Indium (In) metal for STIM applications. In
order to use In for STIM applications, appropriate
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