Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report

[bro20000]

Found a nice bit of info for you all.Here

http://www.techpowerup.com/164858/Iv...er-Report.html





PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that steel plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.

In comparison, Intel used flux-less solder to bind the IHS to the die on previous-generation Sandy Bridge Core processors in the LGA1155 package. Attempting to remove IHS off a chip with flux-less solder won't end well, as it could rip the die off the package. On the other hand, the idea behind use of flux-less solder in CPU packages is to improve heat transfer between the die and the IHS. Using thermal paste to do the job results in slightly inferior heat transfer, but removing IHS is safer. One can be sure that making it safe for IHS removal couldn't have been the issue behind switching back to conventional thermal paste, as everything under the IHS isn't user-serviceable anyway, and off limits for them. Perhaps Intel kept extreme overclockers in mind.

[dejo]

hopefully, this will expose the "issue" enough to get intel to rethink their stance on interface material. This isnt pretty

[BeepBeep2]

It is probably much cheaper for them.

[zalbard]

I really hope they are going to be quick to address that.

[BuBBle.D]

Wont this degrade the heat transfer over the years even further?

[Hondacity]

so the writer wrote an article based on some forum post. he should do that more often lmao

[thegoatman]

Whelp, looks like it's back to popping the top!

[eXa]

that steel plate on top of the processor which makes contact with the cooler

[zanzabar]

It is probably much cheaper for them.

good TIM is more costly than solder, solder is really cheap and the hardware is already in place (or was) to put it on the cpu die.

Wont this degrade the heat transfer over the years even further?

if it is like the tim that they use for the stock HS then it wont even last years you would be lucky with 2, if it is shin etsu x23 like is used with servers then it will last for years and will be much more costly. im also not sure why they would go to tim since tim needs alot of pressure and that dose not happen with the stock mounting and u cannot normally put pressure under the IHS since they are concave on the top.

that steel plate on top of the processor which makes contact with the cooler

if it is steel that his a huge problem, and if they are are calling it steel instead of copper with crap on it do they have any credibility. that is on the TPU blurb though and not the article @ http://www.overclockers.com/ivy-bridge-temperatures

[Hondacity]

e5200 dual cores used that too

[zanzabar]

e5200 dual cores used that too http://i24.photobucket.com/albums/c5...5/c77389fe.jpg

that was a low end chip, equivalent to an i3. the quad core IB with HT is higher than the quad core 2011 and lower than the hex core on the scale of parts so they should do it properly, but this would explain the need for better cooling on IB than the SB. the tim chips like those and the 6xxx gen 2 all needed more cooling than the 8xxx did.

[Hondacity]

i wonder how sandy looks like underneath her skirt

[dejo]

looks like this.
http://forums.vr-zone.com/the-overcl...ml#post9743547

[thegoatman]

I think Intel is afraid of how many top-dollar CPU sales they'd lose on Ivy to overclockers who buy slower chips and ramp em up.

[BeepBeep2]

good TIM is more costly than solder, solder is really cheap and the hardware is already in place (or was) to put it on the cpu die.



if it is like the tim that they use for the stock HS then it wont even last years you would be lucky with 2, if it is shin etsu x23 like is used with servers then it will last for years and will be much more costly. im also not sure why they would go to tim since tim needs alot of pressure and that dose not happen with the stock mounting and u cannot normally put pressure under the IHS since they are concave on the top.



if it is steel that his a huge problem, and if they are are calling it steel instead of copper with crap on it do they have any credibility. that is on the TPU blurb though and not the article @ http://www.overclockers.com/ivy-bridge-temperatures

No, the indium-silver based solder intel uses under their IHS' is probably 10x more costly than normal TIM per application...think "Indigo Extreme" ($15-20 per application) vs MX-2 (About $0.15-.20 per application)...

[zanzabar]

I think Intel is afraid of how many top-dollar CPU sales they'd lose on Ivy to overclockers who buy slower chips and ramp em up.

are you saying that the highest priced K edition chips that they now force us to buy are not high end or top dollar, sure they are not $1k but who bought those and dose not buy them now, those are also hex cores now and the others are quad that are the $300 range

No, the indium based solder intel uses is probably 5-10x more costly than normal TIM...think "Indigo Extreme" vs MX-2...

ah, i was thinking fluxless high silver solder v shin etsu.

[Dumo]

so the writer wrote an article based on some forum post. he should do that more often lmao

Is it based on Pitt's "dead delided ES" pic? Lol

[UrbanSmooth]

Remove those IHSs!!

[zalbard]

Is it based on Pitt's "dead delided ES" pic?

If it is....then Lol

And if so, ES and Retail chips could use different TIMs.
This needs further investigation and perhaps an official reply from Intel as well.

[kuroikenshi]

No, the indium-silver based solder intel uses under their IHS' is probably 10x more costly than normal TIM per application...think "Indigo Extreme" ($15-20 per application) vs MX-2 (About $0.15-.20 per application)...

Indigo Extreme its supposed to have near perfect contact between surfaces, something TIM cannot achieve, god not eve Dave can achieve a near perfect contact between surfaces.

I would prefer indium-silver over TIM any given day

[Dumo]

If theres a problem, I'm sure Intel will be on top of it by now...especially when it comes to "heat".

[dasa]

i just hope they continue to use thermealpaste on at least the k series ivy so it is much easier to remove the ihs for a waterblock like my storm g5

[tbone8ty]

intel needed to sell more watercoolers this was the answer

[BeepBeep2]

Indigo Extreme its supposed to have near perfect contact between surfaces, something TIM cannot achieve, god not eve Dave can achieve a near perfect contact between surfaces.

I would prefer indium-silver over TIM any given day

Not really true. I've had (visually/blown up 50x) perfect contact with TIM between surfaces, photo proof too
Use a lot and mount cooler/block/pot really hard...

The problem here is w/mK (thermal conductivity) in which case Indigo Xtreme is 2x better than the leading TIM.

[sin0822]

so the writer wrote an article based on some forum post. he should do that more often lmao

this was Pt1T's post on HWBot right? lol that is what i thought it was.

I personally have an opinion most of you guys wont like, first of all why would Intel change their TDP to 95W on a CPU that definitely runs very good at stock with turbo and pulls less power than sandy? Why would they decrease the price right before launch? And why would they do this? No one uses TIM for the IHS anymore. Maybe Intel hates Ivy lol, for no reason they made this chip look worse than it is.