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Thread: Early Ivy Bridge Sample Tested

  1. #226
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    Quote Originally Posted by Pontos View Post
    If Ivy Bridge is really going to have only about 10% IPC increase compared to Sandy Bridge, then maybe Piledriver will be able to become competitive in the performance field and not just in the price field.

    Maybe.

    For real though, Piledriver better be competitive because AMD has nothing else until late 2013 or so, and Haswell will be released before that.
    That seems highly unlikely consider bulldozer is not at all competitive with sandy bridge.

  2. #227
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    On what evidence is everyone in this thread speculating on the high voltage / high temps? I looked through but didn't find links to specific examples.

    I'm putting my money where my mouth is by purchasing an i7 3770k on launch day. I believe it'll OC better than snb because of the data Intel shared on tri-gate transistors. Reducing leakage that substantially ought to increase thermal headroom, all else being equal.
    Last edited by Andypro1; 04-02-2012 at 06:29 PM. Reason: Rephrased so it didn't sound as if I was offering a bet.

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  3. #228
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    Oooooh you don't really want to do that with everyone here Unless the retail chips prove to be significantly better than ES samples.
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    Quote Originally Posted by Jowy Atreides View Post
    Intel is about to get athlon'd
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  4. #229
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    Quote Originally Posted by Andypro1 View Post
    On what evidence is everyone in this thread speculating on the high voltage / high temps? I looked through but didn't find links to specific examples.

    I'm personally betting the cost of an i7 3770k on launch day on better OC than snb because of the data Intel shared on tri-gate transistors. Reducing leakage that substantially ought to increase thermal headroom, all else being equal.
    If we are talking air and/or watercooling, I will take that bet.
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  5. #230
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    Free chip for joo M.Beier?

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  6. #231
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    Quote Originally Posted by [XC] Oj101 View Post
    Oooooh you don't really want to do that with everyone here Unless the retail chips prove to be significantly better than ES samples.
    Sorry, let me rephrase that to be a little clearer: I'm not betting any forum members anything :p. All I meant was that I'm putting my money where my mouth is, i.e., by purchasing an IVB on launch.

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  7. #232
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    Ivy will bring all the (cold) overclocking fun like we used to have with cold friendly cpu from long ago

  8. #233
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    Quote Originally Posted by Dumo View Post
    Ivy will bring all the (cold) overclocking fun like we used to have with cold friendly cpu from long ago
    *Try not to rip off the IHS, with your cascade on this one buddy
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  9. #234
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    Quote Originally Posted by M.Beier View Post
    *Try not to rip off the IHS, with your cascade on this one buddy
    That PC Ice's yellow cascade already buried with its maker

    This one is new, lighter and won't break my back. Lol

    SS for Ivy build by runmc

    Last edited by Dumo; 04-02-2012 at 07:18 PM.

  10. #235
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    ^And here was I, thinking it will only be good for laptops..

  11. #236
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    Quote Originally Posted by Andypro1 View Post
    Sorry, let me rephrase that to be a little clearer: I'm not betting any forum members anything :p. All I meant was that I'm putting my money where my mouth is, i.e., by purchasing an IVB on launch.
    Oh trust me, for (far) below zero fun this is close to unbeatable But for air I'm sticking to SB.
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    Quote Originally Posted by Jowy Atreides View Post
    Intel is about to get athlon'd
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  12. #237
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    when is ivy supposed to launch? Trinity should launch by may 15, it should be interesting to see the 2 head to head, seeing as how glofo's 32nm process issues have been worked out. i am still wary of intel graphics though, i mean have they gotten better at drivers?
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  13. #238
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    Quote Originally Posted by R101 View Post
    ^And here was I, thinking it will only be good for laptops..
    Hell no...
    Only "weakness" is K-SKU for people overclocking with air or watercooling...
    The successor of i3-2100, I am 99% sure that I'll buy, saving power, and upping performance.
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  14. #239
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    Quote Originally Posted by M.Beier View Post
    Hell no...
    Only "weakness" is K-SKU for people overclocking with air or watercooling...
    Unfortunately a lot of us fall into these categories including myself. I have a single stage but I don't use it a lot due to the noise it makes and it doesn't look like it would help much anyway.

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  15. #240
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    Intel's coming Ivy Bridge processor overclocked to over 7 GHz with liquid nitrogen.
    http://www.nordichardware.com/news/7...-nitrogen.html

  16. #241
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    what makes it clock so well under exotic cooling and supposely not under air or water ? the need for extreme vcpu ?
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  17. #242
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    Probly because its 22nm process of the CPU die....internally the cores not being able to dissipate the heat quick enough with regular air cooling/h2o
    Last edited by Dumo; 04-04-2012 at 08:56 AM.

  18. #243
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    What is max turbo multiplier "only" 63x? Why not 64 or 65x?
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  19. #244
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    8 or 16 bit ?
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  20. #245
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    I can totally see Intel putting some 'blank' die space between cores in the future, just to aid the dissipation..

    Either that or making transistors work at higher temperatures.

  21. #246
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    Quote Originally Posted by R101 View Post
    I can totally see Intel putting some 'blank' die space between cores in the future, just to aid the dissipation..

    Either that or making transistors work at higher temperatures.
    or superconductor
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  22. #247
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    Quote Originally Posted by M.Beier View Post
    or superconductor
    can you imagine diamond spacers and heat spreader???? kinda Utopian and incredibly expensive.... but it simply feels rights

  23. #248
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    Any new info? Still a dog on Air/Water? Is it possible that the retail CPUs will be better in this regard?

  24. #249
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    i found i7 3770 (non k :'( ) and 3570k in stock in France (along with 3450 and 3550)...seems weird, but does it means NDA won't stand for long ?

    damnit why no 3770K ? :'(
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  25. #250
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    Quote Originally Posted by Dumo View Post
    Probly because its 22nm process of the CPU die....internally the cores not being able to dissipate the heat quick enough with regular air cooling/h2o
    Smaller die area surface to enter in contact with the IHS and so on with the cooler.
    I mean SB on 32nm had 216mm^ die size, IB on 22nm has 165-170mm^???.
    More tranzistors/mm^ of die, more heat per mm^ but less contact to disipate so in conclusion bad thermic transfer.

    Intel to help should make the IHS from a much better conductor material and may be to ensure a much better contact with the die.

    May be an copper IHS should help.
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