Hybrid Memory Cube (HMC)

[Ao1]

http://www.hybridmemorycube.org./technology.html

About Hybrid Memory Cube Hybrid Memory Cube is a revolutionary innovation in DRAM memory architecture that sets a new standard for memory performance, power consumption and cost.

•HMC Combines high-speed logic process technology with a stack of through-silicon-via (TSV) bonded memory die.
•HMC delivers dramatic improvements in performance, breaking through the memory wall and enabling dramatic performance and bandwidth improvements - a single HMC can provide more than 15x the performance of a DDR3 module.
•The revolutionary architecture of HMC is exponentially more efficient than current memory, utilizing 70% less energy per bit than DDR3 DRAM technologies..
•Hybrid Memory Cube's increased density per bit and reduced form factor contribute to lower total cost of ownership, by allowing more memory into each machine and using nearly 90% less space than today's RDIMMs.

With performance levels that break through the memory wall, Hybrid Memory Cube represents the key to extending network system performance to push through the challenges of new 100G and 400G infrastructure growth. Eventually, HMC will drive exascale CPU system performance growth for next generation HPC systems.

•Whereas DDR4 represents an evolutionary standard, HMC is a revolutionary technology that is a complete paradigm shift from current memory architectures.
•Hybrid Memory Cube will redefine memory. By advancing past the traditional DRAM system, HMC is setting a new standard of memory that can keep up with the advancements of CPUs and GPUs.
•Hybrid Memory Cube could be an absolute game changer for applications ranging from high performance computing to consumer technologies like tablets and graphics cards that value a combination of form factor, energy and bandwidth.

Micron and Samsung Collaborate to Develop HMC Interface Specification


http://www.micronblogs.com/