the articles say that instead of using an IBM cell processor, future consoles might uses bulldozer APU variants
the articles say that instead of using an IBM cell processor, future consoles might uses bulldozer APU variants
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I can see what you mean I didn't speak too clearly, considering my comment is in an optomistic tone not sure why these retards chimed in with stupid comments .
So looking at the shrink in a 8 core processor one would presume that these would be efficient. Meaning disable 6 of the 8 cores theoretically these should be able to compete no? Or are these cores essentially just another die shrink with 2 added cores?
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what i was getting at was, for the BD to be good on desktops it will need to work with programs made for the lowest common system that that program can be used by, so even though it can be nice and complex with many thread and complex instructions it will only be measured on a desktop platform by how fast is it doing things that a p4 dose. were on a console or server its more on how much power it actually has
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Xbox 360 CPU is a full core per each two-threaded core, nothing to do with cell at all.
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my point was that console code is for that platform so its measured as what its power is when optimized were desktop parts are rated as when used with code for the LCD of the platform so can it be executed on/with a p4 or dx9
its a bastard byproduct of the old PPC core and the cell using a HT based interconnect to link the cores and l2 cashe, but it dose not pertain to my example other than its in existence and the platform its in is optimized for that chip, not how it works.
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AliG I never though AMD will have better performance in single core at the same frequency.
Its unlikely if you look at the size of a module and SB core. SB core is still bigger by 10%.
SB core to core performance against Thuban is better by 35% but the size is +70%. So I am speculating BD will be slower by 5-10% at best but with turbo 10% higher the difference will be zero or BD will be a little faster.
What happened to you??? You used to be a troll monster! Anyways I for one appreciate reading a positive post by you, thanks!
There is still some waiting to do peeps. From the looks of the initial image, I don't see how everyone can assume that these "blank" areas are not being used. Look at the quality of the image, as if it was drawn instead of a closeup photo of the die. Its obviously for general reference to the layout, not a detailed transistor map.
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The die size of GTX 480 is 529 mm2. Nowhere near being close.
And even if you look at Intel chips it does not appear to be quite as huge.
Keep in mind that this is an 8 core CPU we are talking about here.
P.S. Thuban's die size is 346 mm2...
So much panic over nothing...
Last edited by zalbard; 08-23-2011 at 06:34 PM.
^thuban was the last of 45nm after they got yields to their peak
starting a new node with a chip of 300mm2 is semi risky, but there will be plenty of quads to sell and they will be in plenty of demand for gamers. if the price is really 190$ for a quad and 310$ for a octo, thats not bad of a margin on something half broken, lol.
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Guys, Sandy Bridge EP is EXACTLY 400mm2. It was revealed by Intel at ISSCC.
wow, no wonder amd changed their contract with glofo to only pay for functional dies and not for wafers
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Just wondering.... With a fairly large die and the modules spread apart. would that benefit cooling anything? does the cache produce much heat btw? It looks very ideal atleast if its mainly the modules that produce heat....
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315mm^2... in line with previous estimations
not very bad considering it has 16MB+ total cache
hummm so its 3 weeks before lunch uh!
Three or four weeks--yeah. We're getting very close now.
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