heatware chew*
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Ket making another valuable contribution to the community I see
Valid point but those are usually hard to get a hold of and how to know which oem for which brand?
The way Henry has tested is probably the best but it's very hard to simulate the exact same conditions every time and a lot more work. I figured this way would be interesting as you get some real numbers out of it and can see how big the temperature delta might actually be.
Again, valid points with some buts.
How the heat resistors are mounted and where temperature is measured from doesn't make a difference as long as you're comparing to other pastes as conditions will be the same. It'll just alter the scale. For reference they are mounted with Zalmans ad-hesive TIM glue and temperature measured directly from the middle mounted resistor.
Thermal cycling might help some pastes for sure, but I really doubt it'd make a big difference at low temperatures. The main point of this test was to see how thermal conductivity changed at different temperatures (ie how suitible they are for low temps). I might try that next time I do some testing to see how much of a difference it really makes.
If you have 200 hours to spare you're more than welcome to test yourself Also same point as before, doubt it makes a huge difference at low temps.
Btw, I'm all ears for feedback on how to better compare different thermal pastes so please continue pointing out what can be improved. They way I figured it the way I did it was quick, simple and good enough to compare results (if differences would've been ~5-10 degrees that might've called for some retesting but they are quite alot more than that ).
2008 - AOCC WW #2 | MOA EU #8 | GOOC WW #1
2009 - GOOC WW #3 | MOA EU #3 | MOA WW #1 | GB TweaKing #6 | ASUS ROG OCS #2
2010 - MOA EU #1 | GOOC EU #13 | MOA WW #1
2011 - MOA EU #4 | MOA WW #?
I get the feeling that using no mounting pressure (other than the container's weight) might have "punished" a thick paste like Ceramique. I don't think its fair to say that the mounting doesn't matter as long as its the same for all the pastes. Without mounting pressure, some pastes might have unrealistically high thermal resistance in a test like this when compared to the real world.
It's very possible. Can still use this dummy setup, though, just need to increase the pressure (I don't know the exact pressure of a proper F1EE mount, but perhaps squeezing the TIM during the pot mounting procedure [just push on top of the pot, you get what I mean] and then adding 1kg of weight to it would be enough).
Best way I have found is to apply TIM, mount the pot. Turn on computer and bring it to the BIOS. Watch temps and when probe says ~60c then shut off the comp.
Give the pot a few twists and turns and tighten down the screws just a bit more.
Then go cold
It gets such a tight mounting that often I have to do the reverse to remove the pot when I am all done, even when the pot has warmed back to room temps.
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I always do a thermal cycle as well, before going cold. Not just so the thermal paste can spread out and make a nice uniform covering, but to make sure I have something resembling contact at all
Lets be honest... we've all tried a session and realised that max MHz have bombed because pot contact wasn't right. Giving a thermal cycle lets us check... even if the contact is terrible, hopefully we have enough time to power off before something dies
I never twist the pot once things have warmed up though, feels like im disturbing something thats looking after itself quite nicely...
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